FR2968226B1 - Composition de fondant et procede de soudage - Google Patents

Composition de fondant et procede de soudage

Info

Publication number
FR2968226B1
FR2968226B1 FR1161084A FR1161084A FR2968226B1 FR 2968226 B1 FR2968226 B1 FR 2968226B1 FR 1161084 A FR1161084 A FR 1161084A FR 1161084 A FR1161084 A FR 1161084A FR 2968226 B1 FR2968226 B1 FR 2968226B1
Authority
FR
France
Prior art keywords
founder
composition
welding method
welding
founder composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1161084A
Other languages
English (en)
Other versions
FR2968226A1 (fr
Inventor
David D Fleming
Mike K Gallagher
Kim Sang Ho
Mark R Winkle
Xiang-Qian Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials LLC
Original Assignee
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials LLC
Publication of FR2968226A1 publication Critical patent/FR2968226A1/fr
Application granted granted Critical
Publication of FR2968226B1 publication Critical patent/FR2968226B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C217/00Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton
    • C07C217/52Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups or amino groups bound to carbon atoms of rings other than six-membered aromatic rings of the same carbon skeleton
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016Brazing of electronic components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203Fluxing, i.e. applying flux onto surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615N-compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362Selection of compositions of fluxes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/365Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/42Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR1161084A 2010-12-02 2011-12-02 Composition de fondant et procede de soudage Expired - Fee Related FR2968226B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/958,495 US8070047B1 (en) 2010-12-02 2010-12-02 Flux composition and method of soldering

Publications (2)

Publication Number Publication Date
FR2968226A1 FR2968226A1 (fr) 2012-06-08
FR2968226B1 true FR2968226B1 (fr) 2014-07-18

Family

ID=45034317

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1161084A Expired - Fee Related FR2968226B1 (fr) 2010-12-02 2011-12-02 Composition de fondant et procede de soudage

Country Status (7)

Country Link
US (1) US8070047B1 (fr)
JP (1) JP5865682B2 (fr)
KR (1) KR101923965B1 (fr)
CN (1) CN102615453B (fr)
DE (1) DE102011120100A1 (fr)
FR (1) FR2968226B1 (fr)
TW (1) TWI438179B (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120060774A (ko) * 2010-12-02 2012-06-12 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. 폴리아민 플럭스 조성물 및 솔더링 방법
US8434666B2 (en) * 2011-09-30 2013-05-07 Rohm And Haas Electronic Materials Llc Flux composition and method of soldering
JP6398464B2 (ja) * 2014-08-26 2018-10-03 三菱マテリアル株式会社 ハンダペースト用水溶性フラックス及びハンダペースト
CN109719422B (zh) * 2017-10-27 2022-03-29 株式会社田村制作所 焊料组合物及电子基板
DE102018112982A1 (de) * 2018-05-30 2019-12-05 STANNOL GmbH & Co. KG Aktivator für Flussmittelsysteme sowie Lötmittel zum Weichlöten von Aluminium

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US3977916A (en) * 1974-12-20 1976-08-31 Chevron Research Company Wax-flux composition containing alkylaryl sulfonic acid for soldering
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US4165244A (en) * 1977-10-21 1979-08-21 Jacobs Norman L Soldering flux and method of using same
US4196024A (en) * 1978-11-02 1980-04-01 E. I. Du Pont De Nemours And Company Alkyl phosphate soldering fluxes
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JP3787857B2 (ja) * 1995-03-10 2006-06-21 タムラ化研株式会社 回路基板はんだ付け用フラックス及び回路基板
JP3498427B2 (ja) * 1995-06-19 2004-02-16 ソニー株式会社 成形はんだ用フラックス
US5851311A (en) 1996-03-29 1998-12-22 Sophia Systems Co., Ltd. Polymerizable flux composition for encapsulating the solder in situ
US5958151A (en) 1996-07-22 1999-09-28 Ford Global Technologies, Inc. Fluxing media for non-VOC, no-clean soldering
FR2759293B1 (fr) * 1997-02-11 1999-04-30 Ethypharm Lab Prod Ethiques Microgranules contenant du cisplatine, procede de fabrication, preparation pharmaceutique et utilisation en polychimiotherapie ou en association avec une radiotherapie
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US6402013B2 (en) * 1999-12-03 2002-06-11 Senju Metal Industry Co., Ltd Thermosetting soldering flux and soldering process
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JP2001300766A (ja) * 2000-04-27 2001-10-30 Tamura Kaken Co Ltd 回路基板はんだ付用フラックス及び回路基板
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Also Published As

Publication number Publication date
JP5865682B2 (ja) 2016-02-17
CN102615453B (zh) 2014-12-03
JP2012135813A (ja) 2012-07-19
CN102615453A (zh) 2012-08-01
TWI438179B (zh) 2014-05-21
KR101923965B1 (ko) 2018-11-30
US8070047B1 (en) 2011-12-06
FR2968226A1 (fr) 2012-06-08
TW201231441A (en) 2012-08-01
KR20120060766A (ko) 2012-06-12
DE102011120100A1 (de) 2012-06-06

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