FR2962593B1 - Procede d'assemblage d'une puce dans un substrat souple. - Google Patents

Procede d'assemblage d'une puce dans un substrat souple.

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Publication number
FR2962593B1
FR2962593B1 FR1002846A FR1002846A FR2962593B1 FR 2962593 B1 FR2962593 B1 FR 2962593B1 FR 1002846 A FR1002846 A FR 1002846A FR 1002846 A FR1002846 A FR 1002846A FR 2962593 B1 FR2962593 B1 FR 2962593B1
Authority
FR
France
Prior art keywords
assembling
chip
flexible substrate
flexible
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1002846A
Other languages
English (en)
Other versions
FR2962593A1 (fr
Inventor
Jean Brun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR1002846A priority Critical patent/FR2962593B1/fr
Priority to EP11746593.0A priority patent/EP2591498A1/fr
Priority to PCT/FR2011/000395 priority patent/WO2012007655A1/fr
Priority to US13/702,173 priority patent/US9179586B2/en
Priority to JP2013517432A priority patent/JP5951602B2/ja
Priority to CN2011800334295A priority patent/CN102971841A/zh
Publication of FR2962593A1 publication Critical patent/FR2962593A1/fr
Application granted granted Critical
Publication of FR2962593B1 publication Critical patent/FR2962593B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L2224/819—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector with the bump connector not providing any mechanical bonding
    • H01L2224/81901—Pressing the bump connector against the bonding areas by means of another connector
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    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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    • H01L2224/832—Applying energy for connecting
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    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
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    • H01L2224/9211—Parallel connecting processes
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    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
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    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
FR1002846A 2010-07-06 2010-07-06 Procede d'assemblage d'une puce dans un substrat souple. Expired - Fee Related FR2962593B1 (fr)

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Application Number Priority Date Filing Date Title
FR1002846A FR2962593B1 (fr) 2010-07-06 2010-07-06 Procede d'assemblage d'une puce dans un substrat souple.
EP11746593.0A EP2591498A1 (fr) 2010-07-06 2011-07-05 Procédé d'assemblage d'une puce dans un substrat souple
PCT/FR2011/000395 WO2012007655A1 (fr) 2010-07-06 2011-07-05 Procédé d'assemblage d'une puce dans un substrat souple
US13/702,173 US9179586B2 (en) 2010-07-06 2011-07-05 Method for assembling a chip in a flexible substrate
JP2013517432A JP5951602B2 (ja) 2010-07-06 2011-07-05 フレキシブル基板にチップをアセンブルする方法
CN2011800334295A CN102971841A (zh) 2010-07-06 2011-07-05 在柔性基板中组装芯片的方法

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FR1002846A FR2962593B1 (fr) 2010-07-06 2010-07-06 Procede d'assemblage d'une puce dans un substrat souple.

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Families Citing this family (13)

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Publication number Priority date Publication date Assignee Title
FR2955972B1 (fr) * 2010-02-03 2012-03-09 Commissariat Energie Atomique Procede d'assemblage d'au moins une puce avec un tissu incluant un dispositif a puce
FR2986372B1 (fr) * 2012-01-31 2014-02-28 Commissariat Energie Atomique Procede d'assemblage d'un element a puce micro-electronique sur un element filaire, installation permettant de realiser l'assemblage
GB2500380A (en) * 2012-03-18 2013-09-25 Effect Photonics B V Arrangement and method of making electrical connections
EP2957154B1 (fr) 2013-02-15 2018-11-07 IMEC vzw Intégration de circuits électroniques dans un textile
US9801277B1 (en) * 2013-08-27 2017-10-24 Flextronics Ap, Llc Bellows interconnect
CN107113960A (zh) 2014-12-08 2017-08-29 株式会社藤仓 伸缩性基板
US10499502B2 (en) * 2015-01-27 2019-12-03 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Flexible device module for fabric layer assembly and method for production
CN105047676A (zh) 2015-09-06 2015-11-11 京东方科技集团股份有限公司 一种封装用柔性基板及封装体
EP3483929B1 (fr) 2017-11-08 2022-04-20 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Support de composant comportant des couches électriquement conductrices et isolantes et un composant y incorporé et son procédé de fabrication
US11022580B1 (en) 2019-01-31 2021-06-01 Flex Ltd. Low impedance structure for PCB based electrodes
EP3735111A1 (fr) 2019-05-03 2020-11-04 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Support de composant à couche déformée destiné à recevoir un composant
US11668686B1 (en) 2019-06-17 2023-06-06 Flex Ltd. Batteryless architecture for color detection in smart labels
CN112839425A (zh) * 2019-11-25 2021-05-25 浙江荷清柔性电子技术有限公司 柔性电路板、柔性芯片封装结构

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04290478A (ja) * 1991-03-19 1992-10-15 Denki Kagaku Kogyo Kk マトリックス回路基板、その製造方法及び表示板
JPH0536868U (ja) 1991-10-11 1993-05-18 スタンレー電気株式会社 回路基板
AU663640B2 (en) * 1993-02-22 1995-10-12 Illinois Tool Works Inc. Membrane switch
US5987739A (en) * 1996-02-05 1999-11-23 Micron Communications, Inc. Method of making a polymer based circuit
DE19755792C2 (de) * 1997-12-16 2001-05-17 Titv Greiz Textiles Flächengebilde aus mehreren miteinander verbundenen, teilweise elektrisch leitende Drähte/Fäden enthaltenden Gewebelagen
JP3471690B2 (ja) * 1999-12-16 2003-12-02 沖電気工業株式会社 半導体素子の実装方法
DE10161527A1 (de) 2001-12-14 2003-07-03 Infineon Technologies Ag Aufbau- und Verbindungstechnik in textilen Strukturen
DE10307505B4 (de) 2003-02-21 2005-03-03 Infineon Technologies Ag Textilgewebestruktur, Flächenverkleidungsstruktur und Verfahren zum Bestimmen eines Abstands von Mikroelektronikelementen der Textilgewebestruktur zu mindestens einer Referenzposition
JP4290478B2 (ja) 2003-05-20 2009-07-08 株式会社コーワ 洗浄用ブラシのブラシ片
DE10325883A1 (de) 2003-06-06 2004-12-30 Infineon Technologies Ag Verfahren zur Kontaktierung von leitfähigen Fasern
DE102004001661A1 (de) * 2004-01-12 2005-08-11 Infineon Technologies Ag Verfahren zum elektrischen Verbinden eines elektrischen Leiters mit einem elektronischen Bauelement und Vorrichtung
TWI246914B (en) * 2004-12-30 2006-01-11 Ind Tech Res Inst Flexible implantable electrical stimulator array
EP1727408A1 (fr) 2005-05-13 2006-11-29 Eidgenössische Technische Hochschule Zürich Textile avec des pistes conductrices et le procédé de sa fabrication
ATE381250T1 (de) 2005-05-13 2007-12-15 Sefar Ag Leiterplatte und verfahren zu deren herstellung
TWI276191B (en) * 2005-08-30 2007-03-11 Ind Tech Res Inst Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same
EP2132832B1 (fr) * 2007-03-29 2014-10-08 Koninklijke Philips N.V. Ensemble electronique pour une fixation a un substrat de tissu, textile electronique, et procede de fabrication d'un tel textile electronique
TWI377880B (en) * 2007-08-20 2012-11-21 Ind Tech Res Inst Fabrication methods for flexible electronic devices
WO2010058360A1 (fr) * 2008-11-21 2010-05-27 Koninklijke Philips Electronics N.V. Dispositif électronique sur textile
JP5867877B2 (ja) * 2010-09-21 2016-02-24 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 電子テキスタイル及び電子テキスタイルの製造方法

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JP2013531897A (ja) 2013-08-08
EP2591498A1 (fr) 2013-05-15
FR2962593A1 (fr) 2012-01-13
US20130074331A1 (en) 2013-03-28
JP5951602B2 (ja) 2016-07-13
US9179586B2 (en) 2015-11-03
CN102971841A (zh) 2013-03-13
WO2012007655A1 (fr) 2012-01-19

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