FR2892231B1 - Dispositif magnetique a jonction tunnel magnetoresistive et memoire magnetique a acces aleatoire - Google Patents
Dispositif magnetique a jonction tunnel magnetoresistive et memoire magnetique a acces aleatoireInfo
- Publication number
- FR2892231B1 FR2892231B1 FR0510533A FR0510533A FR2892231B1 FR 2892231 B1 FR2892231 B1 FR 2892231B1 FR 0510533 A FR0510533 A FR 0510533A FR 0510533 A FR0510533 A FR 0510533A FR 2892231 B1 FR2892231 B1 FR 2892231B1
- Authority
- FR
- France
- Prior art keywords
- magnetic
- random access
- layer
- tunnel junction
- magnetoresistive tunnel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000015654 memory Effects 0.000 title abstract 2
- 230000005415 magnetization Effects 0.000 abstract 2
- 230000004888 barrier function Effects 0.000 abstract 1
- 230000006870 function Effects 0.000 abstract 1
- 230000004044 response Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
- G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1675—Writing or programming circuits or methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/30—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE]
- H01F41/302—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F41/305—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices applying the spacer or adjusting its interface, e.g. in order to enable particular effect different from exchange coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3286—Spin-exchange coupled multilayers having at least one layer with perpendicular magnetic anisotropy
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Hall/Mr Elements (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Magnetic Heads (AREA)
- Semiconductor Memories (AREA)
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0510533A FR2892231B1 (fr) | 2005-10-14 | 2005-10-14 | Dispositif magnetique a jonction tunnel magnetoresistive et memoire magnetique a acces aleatoire |
JP2008535037A JP5468262B2 (ja) | 2005-10-14 | 2006-10-13 | 磁気抵抗トンネル接合素子およびmramへのその適用 |
PCT/EP2006/067374 WO2007042563A1 (fr) | 2005-10-14 | 2006-10-13 | Dispositif magnétique de jonction de tunnel magnétorésistif et son application à un mram |
AT06807238T ATE497259T1 (de) | 2005-10-14 | 2006-10-13 | Magnetoresistive tunnelübergangs-magnetanordnung und ihre anwendung auf mram |
US12/083,398 US7821818B2 (en) | 2005-10-14 | 2006-10-13 | Magnetoresistive tunnel junction magnetic device and its application to MRAM |
EP06807238A EP1949466B1 (fr) | 2005-10-14 | 2006-10-13 | Dispositif magnétique de jonction de tunnel magnétorésistif et son application à un mram |
CN2006800381280A CN101288186B (zh) | 2005-10-14 | 2006-10-13 | 磁阻隧道结磁性器件及其在磁性随机存取存储器中的应用 |
DE602006019897T DE602006019897D1 (de) | 2005-10-14 | 2006-10-13 | Magnetoresistive tunnelübergangs-magnetanordnung und ihre anwendung auf mram |
TW095137826A TWI459385B (zh) | 2005-10-14 | 2006-10-13 | 磁阻隧道接面磁性裝置及其在磁性隨機存取記憶體之應用 |
KR1020087008675A KR20080063767A (ko) | 2005-10-14 | 2006-10-13 | 자기저항성 터널 접합 자기 소자 및 mram에의 적용 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0510533A FR2892231B1 (fr) | 2005-10-14 | 2005-10-14 | Dispositif magnetique a jonction tunnel magnetoresistive et memoire magnetique a acces aleatoire |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2892231A1 FR2892231A1 (fr) | 2007-04-20 |
FR2892231B1 true FR2892231B1 (fr) | 2008-06-27 |
Family
ID=36481516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0510533A Expired - Fee Related FR2892231B1 (fr) | 2005-10-14 | 2005-10-14 | Dispositif magnetique a jonction tunnel magnetoresistive et memoire magnetique a acces aleatoire |
Country Status (10)
Country | Link |
---|---|
US (1) | US7821818B2 (fr) |
EP (1) | EP1949466B1 (fr) |
JP (1) | JP5468262B2 (fr) |
KR (1) | KR20080063767A (fr) |
CN (1) | CN101288186B (fr) |
AT (1) | ATE497259T1 (fr) |
DE (1) | DE602006019897D1 (fr) |
FR (1) | FR2892231B1 (fr) |
TW (1) | TWI459385B (fr) |
WO (1) | WO2007042563A1 (fr) |
Families Citing this family (102)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5040105B2 (ja) | 2005-12-01 | 2012-10-03 | ソニー株式会社 | 記憶素子、メモリ |
EP2065886A1 (fr) * | 2007-11-27 | 2009-06-03 | Hitachi Ltd. | Dispositif magnétorésistif |
US7804709B2 (en) * | 2008-07-18 | 2010-09-28 | Seagate Technology Llc | Diode assisted switching spin-transfer torque memory unit |
JP5030888B2 (ja) * | 2008-08-08 | 2012-09-19 | 株式会社日立製作所 | 共鳴トンネル磁気抵抗効果素子、磁気メモリセル及び磁気ランダムアクセスメモリ |
US8217478B2 (en) | 2008-10-10 | 2012-07-10 | Seagate Technology Llc | Magnetic stack with oxide to reduce switching current |
JP2011008861A (ja) * | 2009-06-25 | 2011-01-13 | Sony Corp | メモリ |
WO2011036752A1 (fr) * | 2009-09-24 | 2011-03-31 | 株式会社日立製作所 | Élément à effet de magnétorésistance et à effet tunnel résonant, cellule de mémoire magnétique, et mémoire ram magnétique |
US8482967B2 (en) * | 2010-11-03 | 2013-07-09 | Seagate Technology Llc | Magnetic memory element with multi-domain storage layer |
US8482968B2 (en) * | 2010-11-13 | 2013-07-09 | International Business Machines Corporation | Non-volatile magnetic tunnel junction transistor |
EP2605246B1 (fr) * | 2011-12-12 | 2015-02-11 | Crocus Technology S.A. | Élément de mémoire magnétique d'accès aléatoire auto-référencé comprenant une couche de stockage synthétique |
JP2014090109A (ja) * | 2012-10-31 | 2014-05-15 | Hitachi High-Technologies Corp | 磁気抵抗素子の製造方法 |
EP2741296B1 (fr) * | 2012-12-07 | 2019-01-30 | Crocus Technology S.A. | Mémoire magnétique à accès aléatoire auto-référencée (MRAM) et procédé d'écriture de la cellule MRAM avec une fiabilité accrue et une consommation d'énergie réduite |
US9461242B2 (en) | 2013-09-13 | 2016-10-04 | Micron Technology, Inc. | Magnetic memory cells, methods of fabrication, semiconductor devices, memory systems, and electronic systems |
US9608197B2 (en) | 2013-09-18 | 2017-03-28 | Micron Technology, Inc. | Memory cells, methods of fabrication, and semiconductor devices |
US10454024B2 (en) | 2014-02-28 | 2019-10-22 | Micron Technology, Inc. | Memory cells, methods of fabrication, and memory devices |
US9281466B2 (en) | 2014-04-09 | 2016-03-08 | Micron Technology, Inc. | Memory cells, semiconductor structures, semiconductor devices, and methods of fabrication |
US9269888B2 (en) | 2014-04-18 | 2016-02-23 | Micron Technology, Inc. | Memory cells, methods of fabrication, and semiconductor devices |
US9349945B2 (en) | 2014-10-16 | 2016-05-24 | Micron Technology, Inc. | Memory cells, semiconductor devices, and methods of fabrication |
KR102324627B1 (ko) | 2014-10-31 | 2021-11-10 | 삼성전자주식회사 | 자기 저항 소자를 포함하는 반도체 소자 |
US9768377B2 (en) | 2014-12-02 | 2017-09-19 | Micron Technology, Inc. | Magnetic cell structures, and methods of fabrication |
US10439131B2 (en) * | 2015-01-15 | 2019-10-08 | Micron Technology, Inc. | Methods of forming semiconductor devices including tunnel barrier materials |
US9728712B2 (en) | 2015-04-21 | 2017-08-08 | Spin Transfer Technologies, Inc. | Spin transfer torque structure for MRAM devices having a spin current injection capping layer |
US10468590B2 (en) | 2015-04-21 | 2019-11-05 | Spin Memory, Inc. | High annealing temperature perpendicular magnetic anisotropy structure for magnetic random access memory |
US9853206B2 (en) | 2015-06-16 | 2017-12-26 | Spin Transfer Technologies, Inc. | Precessional spin current structure for MRAM |
US9773974B2 (en) | 2015-07-30 | 2017-09-26 | Spin Transfer Technologies, Inc. | Polishing stop layer(s) for processing arrays of semiconductor elements |
US10163479B2 (en) | 2015-08-14 | 2018-12-25 | Spin Transfer Technologies, Inc. | Method and apparatus for bipolar memory write-verify |
KR102482373B1 (ko) | 2015-11-24 | 2022-12-29 | 삼성전자주식회사 | 자기 저항 메모리 장치 및 그 제조 방법 |
CN105374935B (zh) * | 2015-12-01 | 2018-10-09 | 中电海康集团有限公司 | 一种用于stt-mram的含有不均匀势垒层的磁性隧道结 |
US9741926B1 (en) | 2016-01-28 | 2017-08-22 | Spin Transfer Technologies, Inc. | Memory cell having magnetic tunnel junction and thermal stability enhancement layer |
US11119936B2 (en) | 2016-09-27 | 2021-09-14 | Spin Memory, Inc. | Error cache system with coarse and fine segments for power optimization |
US10546625B2 (en) | 2016-09-27 | 2020-01-28 | Spin Memory, Inc. | Method of optimizing write voltage based on error buffer occupancy |
US10818331B2 (en) | 2016-09-27 | 2020-10-27 | Spin Memory, Inc. | Multi-chip module for MRAM devices with levels of dynamic redundancy registers |
US10991410B2 (en) | 2016-09-27 | 2021-04-27 | Spin Memory, Inc. | Bi-polar write scheme |
US10446210B2 (en) | 2016-09-27 | 2019-10-15 | Spin Memory, Inc. | Memory instruction pipeline with a pre-read stage for a write operation for reducing power consumption in a memory device that uses dynamic redundancy registers |
US10360964B2 (en) | 2016-09-27 | 2019-07-23 | Spin Memory, Inc. | Method of writing contents in memory during a power up sequence using a dynamic redundancy register in a memory device |
US10437723B2 (en) | 2016-09-27 | 2019-10-08 | Spin Memory, Inc. | Method of flushing the contents of a dynamic redundancy register to a secure storage area during a power down in a memory device |
US10366774B2 (en) | 2016-09-27 | 2019-07-30 | Spin Memory, Inc. | Device with dynamic redundancy registers |
US11119910B2 (en) | 2016-09-27 | 2021-09-14 | Spin Memory, Inc. | Heuristics for selecting subsegments for entry in and entry out operations in an error cache system with coarse and fine grain segments |
US10437491B2 (en) | 2016-09-27 | 2019-10-08 | Spin Memory, Inc. | Method of processing incomplete memory operations in a memory device during a power up sequence and a power down sequence using a dynamic redundancy register |
US10628316B2 (en) | 2016-09-27 | 2020-04-21 | Spin Memory, Inc. | Memory device with a plurality of memory banks where each memory bank is associated with a corresponding memory instruction pipeline and a dynamic redundancy register |
US11151042B2 (en) | 2016-09-27 | 2021-10-19 | Integrated Silicon Solution, (Cayman) Inc. | Error cache segmentation for power reduction |
US10460781B2 (en) | 2016-09-27 | 2019-10-29 | Spin Memory, Inc. | Memory device with a dual Y-multiplexer structure for performing two simultaneous operations on the same row of a memory bank |
US10665777B2 (en) | 2017-02-28 | 2020-05-26 | Spin Memory, Inc. | Precessional spin current structure with non-magnetic insertion layer for MRAM |
US10672976B2 (en) | 2017-02-28 | 2020-06-02 | Spin Memory, Inc. | Precessional spin current structure with high in-plane magnetization for MRAM |
JP6616803B2 (ja) * | 2017-06-19 | 2019-12-04 | 株式会社日立ハイテクノロジーズ | 磁気抵抗素子の製造方法、及び磁気抵抗素子 |
US10032978B1 (en) | 2017-06-27 | 2018-07-24 | Spin Transfer Technologies, Inc. | MRAM with reduced stray magnetic fields |
US10529439B2 (en) | 2017-10-24 | 2020-01-07 | Spin Memory, Inc. | On-the-fly bit failure detection and bit redundancy remapping techniques to correct for fixed bit defects |
US10481976B2 (en) | 2017-10-24 | 2019-11-19 | Spin Memory, Inc. | Forcing bits as bad to widen the window between the distributions of acceptable high and low resistive bits thereby lowering the margin and increasing the speed of the sense amplifiers |
US10656994B2 (en) | 2017-10-24 | 2020-05-19 | Spin Memory, Inc. | Over-voltage write operation of tunnel magnet-resistance (“TMR”) memory device and correcting failure bits therefrom by using on-the-fly bit failure detection and bit redundancy remapping techniques |
US10489245B2 (en) | 2017-10-24 | 2019-11-26 | Spin Memory, Inc. | Forcing stuck bits, waterfall bits, shunt bits and low TMR bits to short during testing and using on-the-fly bit failure detection and bit redundancy remapping techniques to correct them |
US10679685B2 (en) | 2017-12-27 | 2020-06-09 | Spin Memory, Inc. | Shared bit line array architecture for magnetoresistive memory |
US10395712B2 (en) | 2017-12-28 | 2019-08-27 | Spin Memory, Inc. | Memory array with horizontal source line and sacrificial bitline per virtual source |
US10891997B2 (en) | 2017-12-28 | 2021-01-12 | Spin Memory, Inc. | Memory array with horizontal source line and a virtual source line |
US10424726B2 (en) | 2017-12-28 | 2019-09-24 | Spin Memory, Inc. | Process for improving photoresist pillar adhesion during MRAM fabrication |
US10811594B2 (en) | 2017-12-28 | 2020-10-20 | Spin Memory, Inc. | Process for hard mask development for MRAM pillar formation using photolithography |
US10360962B1 (en) | 2017-12-28 | 2019-07-23 | Spin Memory, Inc. | Memory array with individually trimmable sense amplifiers |
US10395711B2 (en) | 2017-12-28 | 2019-08-27 | Spin Memory, Inc. | Perpendicular source and bit lines for an MRAM array |
US10516094B2 (en) | 2017-12-28 | 2019-12-24 | Spin Memory, Inc. | Process for creating dense pillars using multiple exposures for MRAM fabrication |
US10784439B2 (en) | 2017-12-29 | 2020-09-22 | Spin Memory, Inc. | Precessional spin current magnetic tunnel junction devices and methods of manufacture |
US10367139B2 (en) | 2017-12-29 | 2019-07-30 | Spin Memory, Inc. | Methods of manufacturing magnetic tunnel junction devices |
US10236048B1 (en) | 2017-12-29 | 2019-03-19 | Spin Memory, Inc. | AC current write-assist in orthogonal STT-MRAM |
US10236047B1 (en) | 2017-12-29 | 2019-03-19 | Spin Memory, Inc. | Shared oscillator (STNO) for MRAM array write-assist in orthogonal STT-MRAM |
US10840436B2 (en) | 2017-12-29 | 2020-11-17 | Spin Memory, Inc. | Perpendicular magnetic anisotropy interface tunnel junction devices and methods of manufacture |
US10270027B1 (en) | 2017-12-29 | 2019-04-23 | Spin Memory, Inc. | Self-generating AC current assist in orthogonal STT-MRAM |
US10360961B1 (en) | 2017-12-29 | 2019-07-23 | Spin Memory, Inc. | AC current pre-charge write-assist in orthogonal STT-MRAM |
US10886330B2 (en) | 2017-12-29 | 2021-01-05 | Spin Memory, Inc. | Memory device having overlapping magnetic tunnel junctions in compliance with a reference pitch |
US10546624B2 (en) | 2017-12-29 | 2020-01-28 | Spin Memory, Inc. | Multi-port random access memory |
US10424723B2 (en) | 2017-12-29 | 2019-09-24 | Spin Memory, Inc. | Magnetic tunnel junction devices including an optimization layer |
US10840439B2 (en) | 2017-12-29 | 2020-11-17 | Spin Memory, Inc. | Magnetic tunnel junction (MTJ) fabrication methods and systems |
US10199083B1 (en) | 2017-12-29 | 2019-02-05 | Spin Transfer Technologies, Inc. | Three-terminal MRAM with ac write-assist for low read disturb |
US10339993B1 (en) | 2017-12-30 | 2019-07-02 | Spin Memory, Inc. | Perpendicular magnetic tunnel junction device with skyrmionic assist layers for free layer switching |
US10319900B1 (en) | 2017-12-30 | 2019-06-11 | Spin Memory, Inc. | Perpendicular magnetic tunnel junction device with precessional spin current layer having a modulated moment density |
US10229724B1 (en) | 2017-12-30 | 2019-03-12 | Spin Memory, Inc. | Microwave write-assist in series-interconnected orthogonal STT-MRAM devices |
US10141499B1 (en) | 2017-12-30 | 2018-11-27 | Spin Transfer Technologies, Inc. | Perpendicular magnetic tunnel junction device with offset precessional spin current layer |
US10255962B1 (en) | 2017-12-30 | 2019-04-09 | Spin Memory, Inc. | Microwave write-assist in orthogonal STT-MRAM |
US10236439B1 (en) | 2017-12-30 | 2019-03-19 | Spin Memory, Inc. | Switching and stability control for perpendicular magnetic tunnel junction device |
US10468588B2 (en) | 2018-01-05 | 2019-11-05 | Spin Memory, Inc. | Perpendicular magnetic tunnel junction device with skyrmionic enhancement layers for the precessional spin current magnetic layer |
US10438996B2 (en) | 2018-01-08 | 2019-10-08 | Spin Memory, Inc. | Methods of fabricating magnetic tunnel junctions integrated with selectors |
US10438995B2 (en) | 2018-01-08 | 2019-10-08 | Spin Memory, Inc. | Devices including magnetic tunnel junctions integrated with selectors |
WO2019147602A1 (fr) | 2018-01-29 | 2019-08-01 | Northwestern University | Dopage amphotère du type p et du type n de semi-conducteurs du groupe iii-vi avec des atomes du groupe iv |
US10446744B2 (en) | 2018-03-08 | 2019-10-15 | Spin Memory, Inc. | Magnetic tunnel junction wafer adaptor used in magnetic annealing furnace and method of using the same |
US10388861B1 (en) | 2018-03-08 | 2019-08-20 | Spin Memory, Inc. | Magnetic tunnel junction wafer adaptor used in magnetic annealing furnace and method of using the same |
US11107974B2 (en) | 2018-03-23 | 2021-08-31 | Spin Memory, Inc. | Magnetic tunnel junction devices including a free magnetic trench layer and a planar reference magnetic layer |
US11107978B2 (en) | 2018-03-23 | 2021-08-31 | Spin Memory, Inc. | Methods of manufacturing three-dimensional arrays with MTJ devices including a free magnetic trench layer and a planar reference magnetic layer |
US10784437B2 (en) | 2018-03-23 | 2020-09-22 | Spin Memory, Inc. | Three-dimensional arrays with MTJ devices including a free magnetic trench layer and a planar reference magnetic layer |
US20190296220A1 (en) | 2018-03-23 | 2019-09-26 | Spin Transfer Technologies, Inc. | Magnetic Tunnel Junction Devices Including an Annular Free Magnetic Layer and a Planar Reference Magnetic Layer |
US10411185B1 (en) | 2018-05-30 | 2019-09-10 | Spin Memory, Inc. | Process for creating a high density magnetic tunnel junction array test platform |
US10692569B2 (en) | 2018-07-06 | 2020-06-23 | Spin Memory, Inc. | Read-out techniques for multi-bit cells |
US10600478B2 (en) | 2018-07-06 | 2020-03-24 | Spin Memory, Inc. | Multi-bit cell read-out techniques for MRAM cells with mixed pinned magnetization orientations |
US10559338B2 (en) | 2018-07-06 | 2020-02-11 | Spin Memory, Inc. | Multi-bit cell read-out techniques |
US10593396B2 (en) | 2018-07-06 | 2020-03-17 | Spin Memory, Inc. | Multi-bit cell read-out techniques for MRAM cells with mixed pinned magnetization orientations |
US10650875B2 (en) | 2018-08-21 | 2020-05-12 | Spin Memory, Inc. | System for a wide temperature range nonvolatile memory |
US11094361B2 (en) * | 2018-09-05 | 2021-08-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Transistorless memory cell |
US10699761B2 (en) | 2018-09-18 | 2020-06-30 | Spin Memory, Inc. | Word line decoder memory architecture |
US11621293B2 (en) | 2018-10-01 | 2023-04-04 | Integrated Silicon Solution, (Cayman) Inc. | Multi terminal device stack systems and methods |
US10971680B2 (en) | 2018-10-01 | 2021-04-06 | Spin Memory, Inc. | Multi terminal device stack formation methods |
US10580827B1 (en) | 2018-11-16 | 2020-03-03 | Spin Memory, Inc. | Adjustable stabilizer/polarizer method for MRAM with enhanced stability and efficient switching |
CN111293138A (zh) * | 2018-12-07 | 2020-06-16 | 中国科学院上海微系统与信息技术研究所 | 三维mram存储结构及其制作方法 |
US11107979B2 (en) | 2018-12-28 | 2021-08-31 | Spin Memory, Inc. | Patterned silicide structures and methods of manufacture |
WO2020160358A1 (fr) * | 2019-01-31 | 2020-08-06 | Northwestern University | Dispositif de mémoire magnétique utilisant une couche de semi-conducteur dopé |
CN112736190B (zh) * | 2019-10-14 | 2023-04-18 | 上海磁宇信息科技有限公司 | 磁性隧道结结构及磁性随机存储器 |
US11968907B2 (en) | 2022-07-05 | 2024-04-23 | Western Digital Technologies, Inc. | Magnetoresistive memory device including a magnetoresistance amplification layer |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3217703B2 (ja) * | 1995-09-01 | 2001-10-15 | 株式会社東芝 | 磁性体デバイス及びそれを用いた磁気センサ |
JP4124533B2 (ja) * | 1999-03-02 | 2008-07-23 | 富士通株式会社 | 強磁性トンネル接合素子及びその製造方法 |
US6295225B1 (en) * | 1999-05-14 | 2001-09-25 | U.S. Philips Corporation | Magnetic tunnel junction device having an intermediate layer |
JP4076197B2 (ja) * | 1999-05-19 | 2008-04-16 | 株式会社東芝 | 磁性素子、記憶装置、磁気再生ヘッド、3端子素子、及び磁気ディスク装置 |
FR2817998B1 (fr) * | 2000-12-07 | 2003-01-10 | Commissariat Energie Atomique | Dispositif magnetique a polarisation de spin et a rotation d'aimantation, memoire et procede d'ecriture utilisant ce dispositif |
JP2002314164A (ja) * | 2001-02-06 | 2002-10-25 | Sony Corp | 磁気トンネル素子及びその製造方法、薄膜磁気ヘッド、磁気メモリ、並びに磁気センサ |
DE10123820C2 (de) * | 2001-05-16 | 2003-06-18 | Infineon Technologies Ag | Verfahren zur Herstellung eines TMR-Schichtsystems mit Diodencharakteristik und MRAM-Speicheranordnung |
FR2832542B1 (fr) | 2001-11-16 | 2005-05-06 | Commissariat Energie Atomique | Dispositif magnetique a jonction tunnel magnetique, memoire et procedes d'ecriture et de lecture utilisant ce dispositif |
DE10202903B4 (de) * | 2002-01-25 | 2009-01-22 | Qimonda Ag | Magnetoresistive Speicherzelle mit polaritätsabhängigem Widerstand und Speicherzelle |
US6956766B2 (en) * | 2002-11-26 | 2005-10-18 | Kabushiki Kaisha Toshiba | Magnetic cell and magnetic memory |
US6944052B2 (en) * | 2002-11-26 | 2005-09-13 | Freescale Semiconductor, Inc. | Magnetoresistive random access memory (MRAM) cell having a diode with asymmetrical characteristics |
JP2004179483A (ja) * | 2002-11-28 | 2004-06-24 | Hitachi Ltd | 不揮発性磁気メモリ |
US6982901B1 (en) * | 2003-01-31 | 2006-01-03 | Hewlett-Packard Development Company, L.P. | Memory device and method of use |
US6747335B1 (en) * | 2003-01-31 | 2004-06-08 | Hewlett-Packard Development Company, L.P. | Magnetic memory cell |
US6794697B1 (en) * | 2003-10-01 | 2004-09-21 | Hewlett-Packard Development Company, L.P. | Asymmetric patterned magnetic memory |
US6936479B2 (en) * | 2004-01-15 | 2005-08-30 | Hewlett-Packard Development Company, L.P. | Method of making toroidal MRAM cells |
WO2007038971A1 (fr) * | 2005-09-20 | 2007-04-12 | Freescale Semiconductor, Inc. | Cellule à effet tunnel dépendant du spin et son procédé de fabrication |
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2005
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FR2892231A1 (fr) | 2007-04-20 |
US7821818B2 (en) | 2010-10-26 |
WO2007042563A1 (fr) | 2007-04-19 |
KR20080063767A (ko) | 2008-07-07 |
ATE497259T1 (de) | 2011-02-15 |
EP1949466B1 (fr) | 2011-01-26 |
CN101288186B (zh) | 2011-06-29 |
TW200733104A (en) | 2007-09-01 |
EP1949466A1 (fr) | 2008-07-30 |
TWI459385B (zh) | 2014-11-01 |
JP5468262B2 (ja) | 2014-04-09 |
DE602006019897D1 (de) | 2011-03-10 |
US20090231909A1 (en) | 2009-09-17 |
CN101288186A (zh) | 2008-10-15 |
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