FR2785454B1 - Orifice metallise blinde a impedance reglee du type "mitrailleuse de gatling" - Google Patents

Orifice metallise blinde a impedance reglee du type "mitrailleuse de gatling"

Info

Publication number
FR2785454B1
FR2785454B1 FR9913439A FR9913439A FR2785454B1 FR 2785454 B1 FR2785454 B1 FR 2785454B1 FR 9913439 A FR9913439 A FR 9913439A FR 9913439 A FR9913439 A FR 9913439A FR 2785454 B1 FR2785454 B1 FR 2785454B1
Authority
FR
France
Prior art keywords
armored
gun type
gatling gun
regulated impedance
metallized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9913439A
Other languages
English (en)
French (fr)
Other versions
FR2785454A1 (fr
Inventor
Lewis R Dove
John F Casey
Ron Barnett
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of FR2785454A1 publication Critical patent/FR2785454A1/fr
Application granted granted Critical
Publication of FR2785454B1 publication Critical patent/FR2785454B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
FR9913439A 1998-10-29 1999-10-27 Orifice metallise blinde a impedance reglee du type "mitrailleuse de gatling" Expired - Fee Related FR2785454B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/182,287 US6388206B2 (en) 1998-10-29 1998-10-29 Microcircuit shielded, controlled impedance “Gatling gun”via

Publications (2)

Publication Number Publication Date
FR2785454A1 FR2785454A1 (fr) 2000-05-05
FR2785454B1 true FR2785454B1 (fr) 2002-10-11

Family

ID=22667816

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9913439A Expired - Fee Related FR2785454B1 (fr) 1998-10-29 1999-10-27 Orifice metallise blinde a impedance reglee du type "mitrailleuse de gatling"

Country Status (5)

Country Link
US (1) US6388206B2 (enExample)
JP (1) JP2000138433A (enExample)
DE (1) DE19949378A1 (enExample)
FR (1) FR2785454B1 (enExample)
GB (1) GB2343298B (enExample)

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KR101499826B1 (ko) 2002-10-22 2015-03-10 제이슨 에이. 설리반 맞춤형 로버스트 컴퓨팅 시스템, 처리 제어 유닛, 및 무선 컴퓨팅 네트워크 장치
FR2849346B1 (fr) * 2002-12-20 2006-12-08 Thales Sa Boitier hyperfrequence a montage de surface et montage correspondant avec un circuit multicouche.
DE10305855A1 (de) * 2003-02-13 2004-08-26 Robert Bosch Gmbh HF-Multilayer-Platine
US7463122B2 (en) * 2003-06-02 2008-12-09 Nec Corporation Compact via transmission line for printed circuit board and its designing method
US7030712B2 (en) * 2004-03-01 2006-04-18 Belair Networks Inc. Radio frequency (RF) circuit board topology
CN100544559C (zh) * 2004-03-09 2009-09-23 日本电气株式会社 用于多层印刷电路板的通孔传输线
US20060151869A1 (en) * 2005-01-10 2006-07-13 Franz Gisin Printed circuit boards and the like with improved signal integrity for differential signal pairs
TWI248330B (en) * 2005-01-14 2006-01-21 Ind Tech Res Inst High frequency and wide band impedance matching via
US7492146B2 (en) * 2005-05-16 2009-02-17 Teradyne, Inc. Impedance controlled via structure
CN100562214C (zh) * 2005-07-02 2009-11-18 鸿富锦精密工业（深圳）有限公司 具有改良过孔的印刷电路板
CN1916915A (zh) * 2005-08-19 2007-02-21 鸿富锦精密工业（深圳）有限公司 改良过孔阻抗的方法
TWI286049B (en) * 2006-04-04 2007-08-21 Advanced Semiconductor Eng Circuit substrate
US7781889B2 (en) * 2006-06-29 2010-08-24 Intel Corporation Shielded via
CN101513144B (zh) * 2006-08-02 2012-07-18 日本电气株式会社 印刷布线板
CN101282614A (zh) * 2007-04-04 2008-10-08 鸿富锦精密工业（深圳）有限公司 具有改良过孔的印刷电路板
DE102008014742A1 (de) * 2008-03-18 2009-09-24 Qimonda Ag Anordnung in Flip-Chip-Montagebauweise, Überprüfungsanordnung zum Überprüfen der Positionierung eines integrierten Schaltkreises relativ zu einem Träger einer Anordnung in Flip-Chip-Montagebauweise und Verfahren zum Überprüfen der Positionierung eines integrierten Schaltkreises relativ zu einem Träger einer Anordnung in Flip-Chip-Montagebauweise
US8022861B2 (en) * 2008-04-04 2011-09-20 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for mm-wave imager and radar
US7830301B2 (en) * 2008-04-04 2010-11-09 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for automotive radars
US7733265B2 (en) * 2008-04-04 2010-06-08 Toyota Motor Engineering & Manufacturing North America, Inc. Three dimensional integrated automotive radars and methods of manufacturing the same
US20100110650A1 (en) * 2008-10-31 2010-05-06 Maxwell Martha A Soldering Strategies for Printed Circuit Board Assemblies
US7990237B2 (en) * 2009-01-16 2011-08-02 Toyota Motor Engineering & Manufacturing North America, Inc. System and method for improving performance of coplanar waveguide bends at mm-wave frequencies
CN101945537A (zh) * 2009-07-10 2011-01-12 英华达(上海)电子有限公司 一种具有过孔结构的印刷电路板及其制造方法
EP2278613B1 (fr) * 2009-07-21 2013-06-05 STMicroelectronics (Crolles 2) SAS Via de connexion électrique tubulaire constitué de plusieurs vias conducteurs élémentaires
US8729405B2 (en) * 2010-03-31 2014-05-20 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
US20120002455A1 (en) * 2010-06-07 2012-01-05 Sullivan Jason A Miniturization techniques, systems, and apparatus relatng to power supplies, memory, interconnections, and leds
US8786496B2 (en) 2010-07-28 2014-07-22 Toyota Motor Engineering & Manufacturing North America, Inc. Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications
US8570765B2 (en) * 2010-08-31 2013-10-29 Asustek Computer Inc. Circuit board with via hole and electronic device equipped with the same
US8957325B2 (en) 2013-01-15 2015-02-17 Fujitsu Limited Optimized via cutouts with ground references
TWI484876B (zh) 2013-12-20 2015-05-11 Ind Tech Res Inst 具傳輸孔之電路板及其製造方法
US9775231B2 (en) 2014-11-21 2017-09-26 Amphenol Corporation Mating backplane for high speed, high density electrical connector
TWI576026B (zh) 2015-07-17 2017-03-21 財團法人工業技術研究院 電路結構
US10201074B2 (en) 2016-03-08 2019-02-05 Amphenol Corporation Backplane footprint for high speed, high density electrical connectors
EP3707971A4 (en) * 2017-11-08 2021-07-28 Amphenol Corporation REAR FACE IMPRESSION FOR HIGH-DENSITY AND HIGH-SPEED ELECTRICAL CONNECTORS
TWI830739B (zh) 2018-06-11 2024-02-01 美商安芬諾股份有限公司 包含用於高速且高密度之電連接器的連接器佔位面積之印刷電路板和互連系統以及其製造方法
CN112003030A (zh) * 2020-08-18 2020-11-27 上海矽杰微电子有限公司 一种交通雷达检测的毫米波微带阵列天线
CN114900947B (zh) * 2022-04-15 2025-04-25 深南电路股份有限公司 印制电路板

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JP4195731B2 (ja) * 1996-07-25 2008-12-10 富士通株式会社 多層プリント板及びこれを利用した高周波回路装置
JPH10173410A (ja) * 1996-12-12 1998-06-26 Sharp Corp ストリップ線路を用いた伝送回路
US5842877A (en) 1996-12-16 1998-12-01 Telefonaktiebolaget L M Ericsson Shielded and impedance-matched connector assembly, and associated method, for radio frequency circuit device
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Also Published As

Publication number Publication date
FR2785454A1 (fr) 2000-05-05
GB9925204D0 (en) 1999-12-22
GB2343298B (en) 2003-03-12
US6388206B2 (en) 2002-05-14
GB2343298A (en) 2000-05-03
JP2000138433A (ja) 2000-05-16
DE19949378A1 (de) 2000-05-11
US20010015288A1 (en) 2001-08-23

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20080630