CN100562214C - 具有改良过孔的印刷电路板 - Google Patents
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- H—ELECTRICITY
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- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H05K1/0213—Electrical arrangements not otherwise provided for
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- H05K2201/03—Conductive materials
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
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- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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Abstract
本发明提供一种具有改良过孔的印刷电路板,所述印刷电路板包括两信号层、一过孔、若干信号引入线及若干信号引出线。所述过孔、信号引入线及信号引出线用于所述印刷电路板层间的电气连接;所述过孔包括一钻孔及两个焊盘;其中一焊盘与所述信号引入线电连接,另一焊盘与所述信号引出线电连接,其中与所述信号引入线电连接的焊盘的直径小于与所述信号引出线电连接的焊盘的直径。通过上述设计,在不影响输出信号的前提下,可以减少高速信号传输过程中输入信号经过过孔时的反射,从而改善了信号的传输质量。
Description
【技术领域】
本发明涉及一种印刷电路板(Printed Circuit Board,以下简称PCB),特别涉及一种具有改良过孔的高速数字印刷电路板。
【背景技术】
在现代通讯系统中,信号的传输速率越来越高,从过去的50M、100M到现在的2.5G、3.125G,并将向5G、10G发展。
随着实际应用中对数字信号处理系统要求的日益提高,信号传输特性的提高已经成为高速数字印刷电路板设计者必须关心的问题。信号完整性是指电路传输信号时对信号波形的保真程度。良好的信号完整性指信号通过传输电路后,信号接收端的波形与信号发送端的波形在容许的误差范围内保持一致,并且空间邻近的传输信号间的相互影响也要在误差容许的范围之内。信号完整性处理的好坏直接关系到系统能否正常工作。由于信号的延迟、反射、串扰等信号传输所带来的问题会致使信号品质变坏,严重时会导致信号逻辑错误,因此保证信号传输线特性阻抗的匹配和一致连续性,以保证接收端的一定的信号质量,是高速数字印刷电路板设计的关键。而理论和实践都证明,高速信号线需要通过过孔来实现印刷电路板层与层间的信号连接是导致信号传输线阻抗不连续、信号完整性失真的一个重要因素。
高速信号印刷电路板上信号密度不断增大,为了保证信号传递和更有效的布局总线,需要更多的信号传输层,于是通过过孔实现层间信号传输是不可避免的。过孔按作用可分为两类:一是用作各层间的电气连接;二是用作器件的固定和定位。按工艺类型过孔可分为三类,即盲孔、埋孔和通孔。盲孔位于印刷电路板顶层和底层表面,用于表层线路和内层线路的连接;埋孔位于印刷电路板内层;通孔贯穿整个电路板,可实现内部电气互连或作为器件的粘着定位孔。
如图1所示,过孔主要由中间的钻孔11、钻孔周围的焊盘13及非连接层的反焊盘15三部分组成,这三部分的尺寸大小决定了过孔的大小。图2示出的是过孔的电路参数模型,该模型由两个电容C0、C1和一个电感L构成,电容的大小主要受焊盘、反焊盘的尺寸影响。过孔焊盘的近似容值可以用下式来评估和计算:
其中,εr为印刷电路板的介电常数,T为过孔所连接的印刷电路板的板厚,D1为过孔的焊盘直径,D2为过孔在非连接层的反焊盘的直径。在实际电路中,由于等效电容的作用远大于电感L的作用,因此过孔集中参数可简化成一电容,该电容值为过孔两个焊盘的电容值之和,如图1所示现有技术中D’0=D’1,所以整个过孔(图未标号)的阻抗为:
在涉及高速、高密度的印刷电路板设计时,设计者总是希望过孔越小越好,这样其自身的寄生电容就越小,从而更适合高速电路。
现有技术在工艺允许的范围内一般是同时减小所有焊盘的直径,虽然减小了焊盘的容值,减少了输入信号的反射,但由于与输出信号线连接的焊盘直径减小,其直接导致输出信号反射减小,使得输出信号误差较大,从而影响了输出信号进一步传输时的完整性,大多不能呈现较好的效果。当有输入信号从一信号层由信号传输线通过过孔的一焊盘传输信号至另外一信号层时,与输入信号线相连的焊盘电容较大,阻抗较小,一般视为短路,而信号传输线恒有阻抗,故传输过程中传输线阻抗不连续,信号的完整性受到一定程度的影响。请参考图3中的曲线2’,该曲线为现有技术中输入信号的反射曲线,由图可知,当信号传输线在有过孔的印刷电路板上由一信号层通过过孔传输信号至另一信号层时,由于过孔阻抗与输入信号传输线阻抗不相匹配程度较大,导致输入信号在通过过孔焊盘时发生较大的反射,影响信号的传输质量。
【发明内容】
鉴于以上内容,有必要提供一种具有改良过孔的印刷电路板,以利于印刷电路板上的信号传输,通过减小输入信号通过过孔时的反射,提高信号的传输质量。
一种具有改良过孔的印刷电路板,所述印刷电路板包括两信号层、一过孔、若干信号引入线和若干信号引出线,所述过孔及信号引入线和信号引出线用于所述印刷电路板层间的电气连接。所述过孔包括一钻孔、两个焊盘及一设于所述两个焊盘之间的反焊盘,所述反焊盘的直径大于所述两个焊盘的直径,其中一焊盘与所述信号引入线电连接并处于同一信号层,另一焊盘与所述信号引出线电连接并同处于另一信号层,其中与所述信号引入线电连接的焊盘的直径小于与所述信号引出线电连接的焊盘的直径。所述过孔类型可以是通孔、盲孔或埋孔。
相较现有技术,本发明的过孔中与信号输入端相连的焊盘的直径小于与信号输出端相连的焊盘的直径,从而使得输入信号经过过孔时反射减小,同时通过过孔后的输出信号反射不受影响,进一步提高了信号的传输质量。
【附图说明】
下面结合附图及较佳实施方式对本发明作进一步详细描述:
图1是现有技术具有过孔的印刷电路板示意图。
图2是过孔的电路参数模型。
图3是本发明具有改良过孔的印刷电路板的较佳实施方式示意图。
图4是信号传输线在本发明具有改良过孔的印刷电路板与现有印刷电路板上传输信号时的阻抗仿真波形图,可以对比显示本发明效果。
图5是信号传输线在本发明具有改良过孔的印刷电路板与现有印刷电路板上传输信号时的反射仿真波形图,可以对比显示本发明效果。
【具体实施方式】
图3为本发明较佳实施方式的具有改良过孔的印刷电路板,所述印刷电路板包括两信号层(图未标号)、一过孔(图未标号)、一信号引入线12及一信号引出线14。所述过孔包括一钻孔110、一与所述信号引入线12电连接的焊盘112及一与所述信号引出线14电连接的焊盘114。,所述信号引入线12及焊盘112同处于所述印刷电路板的一信号层,所述信号引出线14及焊盘114同处于所述印刷电路板的另一信号层。由于在信号传输时,要求输入信号的反射要尽量减小,而输出信号同时也要有较好的完整性。所以该设计在现有过孔的基础上,使得与所述信号引入线12电连接的焊盘112的直径D0小于与所述信号引出线14电连接的焊盘114的直径D1,即D0<D1。与现有技术相比,该过孔反焊盘的直径D2不发生变化,即D2=D’2,所述焊盘114的直径与现有技术相比亦没有变化,即D1=D’1。知本发明中的过孔电容:
上式中C0代表焊盘112的电容,C1代表焊盘114的电容。由于过孔焊盘的电容与过孔焊盘的直径成正比,与现有技术相比,对于与所述信号引入线12电连接的焊盘112来说,由于所述焊盘112直径D0减小,所以该焊盘112的电容C0减小,与所述信号引出线14电连接的焊盘114的电容C1不变。由上述分析知,整个过孔的电容C via较现有技术过孔的电容C’via减少,由于电阻和电容成反比,所以整个过孔的电阻增大,与输入信号传输线的阻抗更为匹配,即通过减小所述焊盘112的直径D0使得信号传输线在传输信号到所述过孔时的反射减小。其具体效果请参阅图4和图5,其中图4为信号传输线在本发明具有改良过孔的印刷电路板与现有印刷电路板上传输信号时的阻抗仿真波形对比结果图,从仿真测试的波形来看,信号传输线在具有改良过孔的印刷电路板上传输信号时,其阻抗曲线1与其在通过普通过孔的印刷电路板上传输信号时的阻抗曲线1’相比,没有通过过孔的区域两条曲线完全重合。当信号传输至过孔时,阻抗曲线1较阻抗曲线1’平缓,即传输线在具有改良过孔的印刷电路板上阻抗匹配程度更好。
请参阅图5是信号传输线在本发明具有改良过孔的印刷电路板与现有印刷电路板上传输信号时的反射仿真波形图,从仿真测试的波形来看,没有通过过孔的区域两条曲线亦完全重合。当信号传输至过孔时,通过改进过孔时的输入信号的反射曲线2与信号传输经过普通过孔时的反射曲线2’相比,所述改进过孔在信号输入时输入信号的反射减小,输出信号的反射与原来的相同,对于传输信号整体而言,提高了其传输的完整性,改善了信号的传输特性。
可以理解的是,本发明实施方式的技术方案对本领域普通技术人员来说,可能做出各种等同的改变或替换,而所有这些改变或替换都应属于本发明后附权利要求的保护范围。
Claims (6)
1.一种具有改良过孔的印刷电路板,所述印刷电路板包括两信号层、一过孔、若干信号引入线及若干信号引出线,所述过孔、信号引入线及信号引出线用于所述印刷电路板层间的电气连接;所述过孔包括一钻孔、两个焊盘及一设于所述两个焊盘之间的反焊盘,所述反焊盘的直径大于所述两个焊盘的直径,其中一焊盘与所述信号引入线电连接,另一焊盘与所述信号引出线电连接,其特征在于:与所述信号引入线电连接的焊盘的直径小于与所述信号引出线电连接的焊盘的直径。
2.如权利要求1所述的具有改良过孔的印刷电路板,其特征在于:所述过孔是通孔。
3.如权利要求1所述的具有改良过孔的印刷电路板,其特征在于:所述过孔是盲孔。
4.如权利要求1所述的具有改良过孔的印刷电路板,其特征在于:所述过孔是埋孔。
5.如权利要求2至4项中任一项所述的具有改良过孔的印刷电路板,其特征在于:所述信号引入线及与其连接的焊盘在同一信号层。
6.如权利要求2至4项中任一项所述的具有改良过孔的印刷电路板,其特征在于:所述信号引出线及与其连接的焊盘同在另一信号层。
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CN200510035782.3A CN100562214C (zh) | 2005-07-02 | 2005-07-02 | 具有改良过孔的印刷电路板 |
US11/478,922 US7745737B2 (en) | 2005-07-02 | 2006-06-30 | Printed circuit board having vias |
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CN105764250A (zh) * | 2016-05-18 | 2016-07-13 | 浪潮(北京)电子信息产业有限公司 | 一种pcb |
CN107520470A (zh) * | 2017-09-30 | 2017-12-29 | 奥士康科技股份有限公司 | 一种提升钻孔效率的方法 |
CN107729280A (zh) * | 2017-11-15 | 2018-02-23 | 无锡军安电子科技有限公司 | 一种高速差分信号端口阻抗与传输线阻抗一致性控制方法 |
CN109270719A (zh) * | 2018-12-12 | 2019-01-25 | 惠科股份有限公司 | 显示面板和显示装置 |
CN112770495B (zh) * | 2019-10-21 | 2022-05-27 | 宏启胜精密电子(秦皇岛)有限公司 | 全向内埋模组及制作方法、封装结构及制作方法 |
CN111315124B (zh) * | 2020-02-27 | 2021-06-18 | 歌尔光学科技有限公司 | 电路板组件和电子设备 |
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WO2002003767A1 (en) * | 2000-06-29 | 2002-01-10 | 3M Innovative Properties Company | Multi-metal layer circuit |
JP2003273525A (ja) * | 2002-03-15 | 2003-09-26 | Kyocera Corp | 配線基板 |
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US7371974B2 (en) * | 2001-03-14 | 2008-05-13 | Ibiden Co., Ltd. | Multilayer printed wiring board |
US7155821B1 (en) * | 2004-06-30 | 2007-01-02 | Emc Corporation | Techniques for manufacturing a circuit board having a countersunk via |
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WO2002003767A1 (en) * | 2000-06-29 | 2002-01-10 | 3M Innovative Properties Company | Multi-metal layer circuit |
JP2003273525A (ja) * | 2002-03-15 | 2003-09-26 | Kyocera Corp | 配線基板 |
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US20070000691A1 (en) | 2007-01-04 |
US7745737B2 (en) | 2010-06-29 |
CN1889810A (zh) | 2007-01-03 |
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