FR2785454B1 - Orifice metallise blinde a impedance reglee du type "mitrailleuse de gatling" - Google Patents

Orifice metallise blinde a impedance reglee du type "mitrailleuse de gatling"

Info

Publication number
FR2785454B1
FR2785454B1 FR9913439A FR9913439A FR2785454B1 FR 2785454 B1 FR2785454 B1 FR 2785454B1 FR 9913439 A FR9913439 A FR 9913439A FR 9913439 A FR9913439 A FR 9913439A FR 2785454 B1 FR2785454 B1 FR 2785454B1
Authority
FR
France
Prior art keywords
armored
gun type
gatling gun
regulated impedance
metallized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9913439A
Other languages
English (en)
Other versions
FR2785454A1 (fr
Inventor
Lewis R Dove
John F Casey
Ron Barnett
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of FR2785454A1 publication Critical patent/FR2785454A1/fr
Application granted granted Critical
Publication of FR2785454B1 publication Critical patent/FR2785454B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H01L2223/6622—Coaxial feed-throughs in active or passive substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
FR9913439A 1998-10-29 1999-10-27 Orifice metallise blinde a impedance reglee du type "mitrailleuse de gatling" Expired - Fee Related FR2785454B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/182,287 US6388206B2 (en) 1998-10-29 1998-10-29 Microcircuit shielded, controlled impedance “Gatling gun”via

Publications (2)

Publication Number Publication Date
FR2785454A1 FR2785454A1 (fr) 2000-05-05
FR2785454B1 true FR2785454B1 (fr) 2002-10-11

Family

ID=22667816

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9913439A Expired - Fee Related FR2785454B1 (fr) 1998-10-29 1999-10-27 Orifice metallise blinde a impedance reglee du type "mitrailleuse de gatling"

Country Status (5)

Country Link
US (1) US6388206B2 (fr)
JP (1) JP2000138433A (fr)
DE (1) DE19949378A1 (fr)
FR (1) FR2785454B1 (fr)
GB (1) GB2343298B (fr)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6727777B2 (en) * 2001-04-16 2004-04-27 Vitesse Semiconductor Corporation Apparatus and method for angled coaxial to planar structure broadband transition
JP3820955B2 (ja) * 2001-10-12 2006-09-13 日本電気株式会社 ビルドアップ基板とその製造方法
US6828513B2 (en) * 2002-04-30 2004-12-07 Texas Instruments Incorporated Electrical connector pad assembly for printed circuit board
BR0315624A (pt) 2002-10-22 2005-08-23 Jason A Sullivan Sistema de processamento em computador personalizável robusto
EP1557075A4 (fr) 2002-10-22 2010-01-13 Sullivan Jason Module de controle non associe aux peripheriques possedant des proprietes ameliorees de dissipation de chaleur
CN1729734B (zh) 2002-10-22 2011-01-05 贾森·A·沙利文 用于提供动态模块处理单元的系统及方法
FR2849346B1 (fr) * 2002-12-20 2006-12-08 Thales Sa Boitier hyperfrequence a montage de surface et montage correspondant avec un circuit multicouche.
DE10305855A1 (de) * 2003-02-13 2004-08-26 Robert Bosch Gmbh HF-Multilayer-Platine
JP4652230B2 (ja) 2003-06-02 2011-03-16 日本電気株式会社 プリント回路基板用コンパクトビア伝送路およびその設計方法
US7030712B2 (en) * 2004-03-01 2006-04-18 Belair Networks Inc. Radio frequency (RF) circuit board topology
CN100544559C (zh) * 2004-03-09 2009-09-23 日本电气株式会社 用于多层印刷电路板的通孔传输线
US20060151869A1 (en) * 2005-01-10 2006-07-13 Franz Gisin Printed circuit boards and the like with improved signal integrity for differential signal pairs
TWI248330B (en) * 2005-01-14 2006-01-21 Ind Tech Res Inst High frequency and wide band impedance matching via
US7492146B2 (en) * 2005-05-16 2009-02-17 Teradyne, Inc. Impedance controlled via structure
CN100562214C (zh) * 2005-07-02 2009-11-18 鸿富锦精密工业（深圳）有限公司 具有改良过孔的印刷电路板
CN1916915A (zh) * 2005-08-19 2007-02-21 鸿富锦精密工业（深圳）有限公司 改良过孔阻抗的方法
TWI286049B (en) * 2006-04-04 2007-08-21 Advanced Semiconductor Eng Circuit substrate
US7781889B2 (en) * 2006-06-29 2010-08-24 Intel Corporation Shielded via
CN101513144B (zh) * 2006-08-02 2012-07-18 日本电气株式会社 印刷布线板
CN101282614A (zh) * 2007-04-04 2008-10-08 鸿富锦精密工业（深圳）有限公司 具有改良过孔的印刷电路板
DE102008014742A1 (de) * 2008-03-18 2009-09-24 Qimonda Ag Anordnung in Flip-Chip-Montagebauweise, Überprüfungsanordnung zum Überprüfen der Positionierung eines integrierten Schaltkreises relativ zu einem Träger einer Anordnung in Flip-Chip-Montagebauweise und Verfahren zum Überprüfen der Positionierung eines integrierten Schaltkreises relativ zu einem Träger einer Anordnung in Flip-Chip-Montagebauweise
US7830301B2 (en) * 2008-04-04 2010-11-09 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for automotive radars
US7733265B2 (en) * 2008-04-04 2010-06-08 Toyota Motor Engineering & Manufacturing North America, Inc. Three dimensional integrated automotive radars and methods of manufacturing the same
US8022861B2 (en) * 2008-04-04 2011-09-20 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for mm-wave imager and radar
US20100110650A1 (en) * 2008-10-31 2010-05-06 Maxwell Martha A Soldering Strategies for Printed Circuit Board Assemblies
US7990237B2 (en) * 2009-01-16 2011-08-02 Toyota Motor Engineering & Manufacturing North America, Inc. System and method for improving performance of coplanar waveguide bends at mm-wave frequencies
CN101945537A (zh) * 2009-07-10 2011-01-12 英华达(上海)电子有限公司 一种具有过孔结构的印刷电路板及其制造方法
EP2278613B1 (fr) * 2009-07-21 2013-06-05 STMicroelectronics (Crolles 2) SAS Via de connexion électrique tubulaire constitué de plusieurs vias conducteurs élémentaires
US8729405B2 (en) * 2010-03-31 2014-05-20 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
US20120002455A1 (en) * 2010-06-07 2012-01-05 Sullivan Jason A Miniturization techniques, systems, and apparatus relatng to power supplies, memory, interconnections, and leds
US8786496B2 (en) 2010-07-28 2014-07-22 Toyota Motor Engineering & Manufacturing North America, Inc. Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications
US8570765B2 (en) * 2010-08-31 2013-10-29 Asustek Computer Inc. Circuit board with via hole and electronic device equipped with the same
US8957325B2 (en) 2013-01-15 2015-02-17 Fujitsu Limited Optimized via cutouts with ground references
TWI484876B (zh) * 2013-12-20 2015-05-11 Ind Tech Res Inst 具傳輸孔之電路板及其製造方法
WO2016081855A1 (fr) 2014-11-21 2016-05-26 Amphenol Corporation Fond de panier adapté pour un connecteur électrique à haute densité et grande vitesse
TWI576026B (zh) 2015-07-17 2017-03-21 財團法人工業技術研究院 電路結構
US10201074B2 (en) 2016-03-08 2019-02-05 Amphenol Corporation Backplane footprint for high speed, high density electrical connectors
CN105891740B (zh) * 2016-04-08 2018-08-31 北京航空航天大学 一种宽频带近场磁场探头的阻抗补偿结构及其构建方法
EP3707971A4 (fr) * 2017-11-08 2021-07-28 Amphenol Corporation Empreinte de face arrière destinée à des connecteurs électriques à haute densité et haute vitesse
WO2019241107A1 (fr) 2018-06-11 2019-12-19 Amphenol Corporation Empreinte de fond de panier destinée à des connecteurs électriques à haute densité et à haute vitesse
CN114900947A (zh) * 2022-04-15 2022-08-12 深南电路股份有限公司 印制电路板

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3895435A (en) * 1974-01-23 1975-07-22 Raytheon Co Method for electrically interconnecting multilevel stripline circuitry
SE426894B (sv) 1981-06-30 1983-02-14 Ericsson Telefon Ab L M Impedansriktig koaxialovergang for mikrovagssignaler
US4816791A (en) 1987-11-27 1989-03-28 General Electric Company Stripline to stripline coaxial transition
US5200580A (en) * 1991-08-26 1993-04-06 E-Systems, Inc. Configurable multi-chip module interconnect
JPH05206678A (ja) * 1992-01-28 1993-08-13 Nec Corp 多層配線基板
US5401912A (en) * 1993-06-07 1995-03-28 St Microwave Corp., Arizona Operations Microwave surface mount package
GB9515233D0 (en) * 1995-07-25 1995-09-20 Cinch Connectors Ltd Co-axial connector system
US5644276A (en) * 1996-05-29 1997-07-01 The United States Of America As Represented By The Secretary Of The Army Multi-layer controllable impedance transition device for microwaves/millimeter waves
JP4195731B2 (ja) * 1996-07-25 2008-12-10 富士通株式会社 多層プリント板及びこれを利用した高周波回路装置
JPH10173410A (ja) * 1996-12-12 1998-06-26 Sharp Corp ストリップ線路を用いた伝送回路
US5842877A (en) 1996-12-16 1998-12-01 Telefonaktiebolaget L M Ericsson Shielded and impedance-matched connector assembly, and associated method, for radio frequency circuit device
US5920242A (en) * 1997-06-09 1999-07-06 Ngk Spark Plug Co., Ltd. Multielement-type piezoelectric filter with through-hole connection of resonators to a base substrate circuit
US6031188A (en) * 1998-04-30 2000-02-29 Lockheed Martin Corp. Multi-circuit RF connections using molded and compliant RF coaxial interconnects

Also Published As

Publication number Publication date
US6388206B2 (en) 2002-05-14
GB2343298B (en) 2003-03-12
GB9925204D0 (en) 1999-12-22
JP2000138433A (ja) 2000-05-16
FR2785454A1 (fr) 2000-05-05
DE19949378A1 (de) 2000-05-11
US20010015288A1 (en) 2001-08-23
GB2343298A (en) 2000-05-03

Similar Documents

Publication Publication Date Title
FR2785454B1 (fr) Orifice metallise blinde a impedance reglee du type "mitrailleuse de gatling"
DE69122988D1 (de) Niederdruck-Spritzpistole
IL113041A0 (en) Add-on armor
DE1090689T1 (de) Sprühpistole
AU8423391A (en) Spray gun
BR9300384A (pt) Revestimento de triccao
DE69941537D1 (de) Kleine sprüpistole
ZA909308B (en) Drenching gun
ZA918333B (en) Gun lock
EP0460382A3 (en) Coating with an anti-fogging property
GB2300466B (en) Recoil counter-vectoring gun
DE69422435D1 (de) Elektroplattierte kompositbeschichtungen
BR9306569A (pt) Pistola de pulverização
DE69414872D1 (de) Pulversprühbeschichtung
IL117392A0 (en) Weapon lock
GB9109088D0 (en) Coating of filaments by sputter-ion plating
GB9518583D0 (en) Gun sights
EP0472817A3 (en) Electrostatic spray pistol
DE29509281U1 (de) Spritzpistole
KR970008256U (ko) 다용도 분사건의 개량구조
KR960028402U (ko) 분사기겸용 분무기의 구조
EP0463327A3 (en) Electrostatic spray pistol
KR940007742U (ko) 연속아연 도금설비의 건조기(Dryer)
AU8587491A (en) Gun lock
FI961860A (fi) Kameralla varustettu ilmatorjuntatykki

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20080630