EP3707971A4 - Backplane footprint for high speed, high density electrical connectors - Google Patents
Backplane footprint for high speed, high density electrical connectors Download PDFInfo
- Publication number
- EP3707971A4 EP3707971A4 EP18875264.6A EP18875264A EP3707971A4 EP 3707971 A4 EP3707971 A4 EP 3707971A4 EP 18875264 A EP18875264 A EP 18875264A EP 3707971 A4 EP3707971 A4 EP 3707971A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- electrical connectors
- density electrical
- high speed
- high density
- backplane footprint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/807,444 US10201074B2 (en) | 2016-03-08 | 2017-11-08 | Backplane footprint for high speed, high density electrical connectors |
PCT/US2018/059757 WO2019094549A1 (en) | 2017-11-08 | 2018-11-08 | Backplane footprint for high speed, high density electrical connectors |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3707971A1 EP3707971A1 (en) | 2020-09-16 |
EP3707971A4 true EP3707971A4 (en) | 2021-07-28 |
Family
ID=66438088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP18875264.6A Pending EP3707971A4 (en) | 2017-11-08 | 2018-11-08 | Backplane footprint for high speed, high density electrical connectors |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP3707971A4 (en) |
CN (1) | CN111602472B (en) |
WO (1) | WO2019094549A1 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050247482A1 (en) * | 2004-05-10 | 2005-11-10 | Fujitsu Limited | Wiring base board, method of producing thereof, and electronic device |
EP3200572A1 (en) * | 2014-09-22 | 2017-08-02 | Fujikura, Ltd. | Printed wiring board |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4806107A (en) * | 1987-10-16 | 1989-02-21 | American Telephone And Telegraph Company, At&T Bell Laboratories | High frequency connector |
US6388206B2 (en) * | 1998-10-29 | 2002-05-14 | Agilent Technologies, Inc. | Microcircuit shielded, controlled impedance “Gatling gun”via |
SE523511C2 (en) | 2001-11-26 | 2004-04-27 | Tetra Laval Holdings & Finance | Method and apparatus for sterilizing a packaging material by means of a liquid sterilizing agent |
US20040115968A1 (en) * | 2002-12-17 | 2004-06-17 | Cohen Thomas S. | Connector and printed circuit board for reducing cross-talk |
CN101673885B (en) * | 2004-11-29 | 2012-07-18 | Fci公司 | Improved matched-impedance surface-mount technology footprints |
WO2008124101A2 (en) | 2007-04-04 | 2008-10-16 | Amphenol Corporation | Electrical connector lead frame |
US20120003848A1 (en) * | 2009-03-25 | 2012-01-05 | Molex Incorporated | High data rate connector system |
US8885357B2 (en) | 2012-01-06 | 2014-11-11 | Cray Inc. | Printed circuit board with reduced cross-talk |
US9545003B2 (en) * | 2012-12-28 | 2017-01-10 | Fci Americas Technology Llc | Connector footprints in printed circuit board (PCB) |
CN103260348B (en) * | 2013-04-01 | 2016-02-10 | 广州兴森快捷电路科技有限公司 | High Speed PCB Board and difference via hole impedance control method |
US9807869B2 (en) * | 2014-11-21 | 2017-10-31 | Amphenol Corporation | Mating backplane for high speed, high density electrical connector |
US9930772B2 (en) * | 2015-12-30 | 2018-03-27 | Te Connectivity Corporation | Printed circuit and circuit board assembly configured for quad signaling |
CN109076700B (en) | 2016-03-08 | 2021-07-30 | 安费诺公司 | Backplane footprints for high speed, high density electrical connectors |
-
2018
- 2018-11-08 WO PCT/US2018/059757 patent/WO2019094549A1/en unknown
- 2018-11-08 CN CN201880085756.7A patent/CN111602472B/en active Active
- 2018-11-08 EP EP18875264.6A patent/EP3707971A4/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050247482A1 (en) * | 2004-05-10 | 2005-11-10 | Fujitsu Limited | Wiring base board, method of producing thereof, and electronic device |
EP3200572A1 (en) * | 2014-09-22 | 2017-08-02 | Fujikura, Ltd. | Printed wiring board |
Non-Patent Citations (1)
Title |
---|
See also references of WO2019094549A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2019094549A1 (en) | 2019-05-16 |
CN111602472B (en) | 2024-02-06 |
CN111602472A (en) | 2020-08-28 |
EP3707971A1 (en) | 2020-09-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20200605 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20210629 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H05K 1/02 20060101AFI20210623BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
|
17Q | First examination report despatched |
Effective date: 20240112 |