FR2770958B1 - Appareil de commande electronique - Google Patents
Appareil de commande electroniqueInfo
- Publication number
- FR2770958B1 FR2770958B1 FR9814139A FR9814139A FR2770958B1 FR 2770958 B1 FR2770958 B1 FR 2770958B1 FR 9814139 A FR9814139 A FR 9814139A FR 9814139 A FR9814139 A FR 9814139A FR 2770958 B1 FR2770958 B1 FR 2770958B1
- Authority
- FR
- France
- Prior art keywords
- control apparatus
- electronic control
- electronic
- control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19750306A DE19750306A1 (de) | 1997-11-13 | 1997-11-13 | Elektronisches Steuergerät |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2770958A1 FR2770958A1 (fr) | 1999-05-14 |
FR2770958B1 true FR2770958B1 (fr) | 2006-03-31 |
Family
ID=7848620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9814139A Expired - Fee Related FR2770958B1 (fr) | 1997-11-13 | 1998-11-10 | Appareil de commande electronique |
Country Status (5)
Country | Link |
---|---|
US (1) | US6259603B1 (fr) |
JP (1) | JP4124528B2 (fr) |
KR (1) | KR100604619B1 (fr) |
DE (1) | DE19750306A1 (fr) |
FR (1) | FR2770958B1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011088969A1 (de) | 2011-12-19 | 2013-06-20 | Robert Bosch Gmbh | Getriebesteuermodul |
JP6559210B2 (ja) * | 2017-11-27 | 2019-08-14 | 三菱電機株式会社 | 乗り物搭載用電子制御装置の製造方法および乗り物搭載用電子制御装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2520932A1 (fr) * | 1982-02-02 | 1983-08-05 | Thomson Csf | Support de montage de boitier de circuit integre, a connexions de sorties reparties sur le perimetre du boitier |
JPS59228749A (ja) * | 1983-06-10 | 1984-12-22 | Sanyo Electric Co Ltd | 混成集積回路 |
DE3813566A1 (de) * | 1988-04-22 | 1989-11-02 | Bosch Gmbh Robert | Elektrische verbindung zwischen einer hybridbaugruppe und einer leiterplatte sowie verfahren zur deren herstellung |
JPH02121397A (ja) * | 1988-10-31 | 1990-05-09 | Toshiba Corp | 放熱型混成回路装置 |
DE3837975A1 (de) * | 1988-11-09 | 1990-05-10 | Telefunken Electronic Gmbh | Elektronisches steuergeraet |
US5012386A (en) * | 1989-10-27 | 1991-04-30 | Motorola, Inc. | High performance overmolded electronic package |
US5235347A (en) * | 1990-09-07 | 1993-08-10 | Hewlett-Packard Company | Light emitting diode print head |
US5287247A (en) * | 1990-09-21 | 1994-02-15 | Lsi Logic Corporation | Computer system module assembly |
US5293301A (en) * | 1990-11-30 | 1994-03-08 | Shinko Electric Industries Co., Ltd. | Semiconductor device and lead frame used therein |
JPH0513894A (ja) * | 1991-04-30 | 1993-01-22 | Mitsubishi Electric Corp | 基 板 |
KR100307465B1 (ko) * | 1992-10-20 | 2001-12-15 | 야기 추구오 | 파워모듈 |
US5343359A (en) * | 1992-11-19 | 1994-08-30 | Cray Research, Inc. | Apparatus for cooling daughter boards |
JPH06276737A (ja) * | 1993-03-18 | 1994-09-30 | Hitachi Ltd | Dc−dcコンバータ |
US5343360A (en) * | 1993-03-31 | 1994-08-30 | Ncr Corporation | Containing and cooling apparatus for an integrated circuit device having a thermal insulator |
US5991156A (en) * | 1993-12-20 | 1999-11-23 | Stmicroelectronics, Inc. | Ball grid array integrated circuit package with high thermal conductivity |
US5642261A (en) * | 1993-12-20 | 1997-06-24 | Sgs-Thomson Microelectronics, Inc. | Ball-grid-array integrated circuit package with solder-connected thermal conductor |
ES2095733T3 (es) * | 1994-01-12 | 1997-02-16 | Magnetek Spa | Placa laminar para producir circuitos impresos, circuitos impresos fabricados con dicha placa y metodo para su fabricacion. |
JPH07211856A (ja) * | 1994-01-12 | 1995-08-11 | Fujitsu Ltd | 集積回路モジュール |
JPH09508400A (ja) * | 1994-02-02 | 1997-08-26 | チバ−ガイギー アクチエンゲゼルシャフト | 水素化触媒、その調製方法および水素化方法 |
AU3060095A (en) * | 1994-10-29 | 1996-05-09 | Robert Bosch Gmbh | Housing for a hybrid module, and hybrid module |
US5657208A (en) | 1995-07-28 | 1997-08-12 | Hewlett-Packard Company | Surface mount attachments of daughterboards to motherboards |
US6028770A (en) * | 1996-01-25 | 2000-02-22 | Siemens Aktiengesellschaft | Control device, especially for a motor vehicle |
-
1997
- 1997-11-13 DE DE19750306A patent/DE19750306A1/de not_active Withdrawn
-
1998
- 1998-10-30 US US09/183,223 patent/US6259603B1/en not_active Expired - Fee Related
- 1998-11-10 FR FR9814139A patent/FR2770958B1/fr not_active Expired - Fee Related
- 1998-11-10 JP JP31913098A patent/JP4124528B2/ja not_active Expired - Fee Related
- 1998-11-12 KR KR1019980048315A patent/KR100604619B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR19990045216A (ko) | 1999-06-25 |
JP4124528B2 (ja) | 2008-07-23 |
FR2770958A1 (fr) | 1999-05-14 |
DE19750306A1 (de) | 1999-05-20 |
JPH11330749A (ja) | 1999-11-30 |
US6259603B1 (en) | 2001-07-10 |
KR100604619B1 (ko) | 2007-04-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20110801 |