FR2603904A1 - Procede d'attaque corrosive du cuivre et produit obtenu en particulier plaquette de circuit - Google Patents

Procede d'attaque corrosive du cuivre et produit obtenu en particulier plaquette de circuit

Info

Publication number
FR2603904A1
FR2603904A1 FR8712080A FR8712080A FR2603904A1 FR 2603904 A1 FR2603904 A1 FR 2603904A1 FR 8712080 A FR8712080 A FR 8712080A FR 8712080 A FR8712080 A FR 8712080A FR 2603904 A1 FR2603904 A1 FR 2603904A1
Authority
FR
France
Prior art keywords
copper
corrosive
circuit board
product obtained
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8712080A
Other languages
English (en)
Other versions
FR2603904B1 (fr
Inventor
James F Battey
Norvell J Nelson
Daniel J Barnett
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PSI Star Inc
Original Assignee
PSI Star Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PSI Star Inc filed Critical PSI Star Inc
Publication of FR2603904A1 publication Critical patent/FR2603904A1/fr
Application granted granted Critical
Publication of FR2603904B1 publication Critical patent/FR2603904B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12389—All metal or with adjacent metals having variation in thickness
    • Y10T428/12396—Discontinuous surface component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

L'invention concerne un procédé utilisant un liquide d'attaque pour produire un circuit imprimé. Le procédé comprend les étapes qui consistent à choisir une feuille de cuivre dont la structure cristalline de la surface supérieure est attaquée chimiquement de façon anisotrope et avec un rapport de l'attaque verticale à l'attaque latérale supérieur à 1:1 par le liquide d'attaque, à lier la feuille de cuivre à un substrat et à exposer une portion de la feuille de cuivre au liquide d'attaque pour enlever cette portion de la feuille de substrat. Selon une forme de réalisation, la solution d'attaque contient de l'acide nitrique, du nitrate de cuivre ou de l'acide sulfurique, un polymère et un surfactant et le cuivre a une structure des cristaux de surface supérieure avec prédominance de l'orientation 111. L'invention concerne également un circuit imprimé obtenu par ce procédé.
FR8712080A 1986-09-15 1987-08-31 Procede d'attaque corrosive du cuivre et produit obtenu en particulier plaquette de circuit Expired - Lifetime FR2603904B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/907,078 US4695348A (en) 1986-09-15 1986-09-15 Copper etching process and product

Publications (2)

Publication Number Publication Date
FR2603904A1 true FR2603904A1 (fr) 1988-03-18
FR2603904B1 FR2603904B1 (fr) 1991-02-08

Family

ID=25423483

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8712080A Expired - Lifetime FR2603904B1 (fr) 1986-09-15 1987-08-31 Procede d'attaque corrosive du cuivre et produit obtenu en particulier plaquette de circuit

Country Status (5)

Country Link
US (1) US4695348A (fr)
JP (1) JPS63119594A (fr)
DE (1) DE3728803A1 (fr)
FR (1) FR2603904B1 (fr)
GB (1) GB2196903B (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4767661A (en) * 1986-09-15 1988-08-30 Psi Star Copper etching process and product
US4767662A (en) * 1986-09-15 1988-08-30 Psi Star Copper etching process and product
DE3642604A1 (de) * 1986-12-13 1988-06-23 Henkel Kgaa Verwendung kurzkettiger alkansulfonsaeuren in reinigungs- und desinfektionsmitteln
GR872040B (en) * 1987-01-30 1988-04-05 Hughes Aircraft Co Methods for removing stringers appearing in plated through holes in copper containing multi layer printed wiring boards
US4846918A (en) * 1988-02-24 1989-07-11 Psi Star Copper etching process and product with controlled nitrous acid reaction
US4927700A (en) * 1988-02-24 1990-05-22 Psi Star Copper etching process and product with controlled nitrous acid reaction
US5104688A (en) * 1990-06-04 1992-04-14 Macdermid, Incorporated Pretreatment composition and process for tin-lead immersion plating
US5316802A (en) * 1992-02-20 1994-05-31 Nissin Electric Co., Ltd. Method of forming copper film on substrate
JP2754157B2 (ja) * 1994-03-31 1998-05-20 三井金属鉱業株式会社 プリント配線板用電解銅箔の製造方法
JP3458023B2 (ja) * 1995-08-01 2003-10-20 メック株式会社 銅および銅合金のマイクロエッチング剤
US6380627B1 (en) * 1998-06-26 2002-04-30 The Regents Of The University Of California Low resistance barrier layer for isolating, adhering, and passivating copper metal in semiconductor fabrication
US6156221A (en) * 1998-10-02 2000-12-05 International Business Machines Corporation Copper etching compositions, processes and products derived therefrom
US6830627B1 (en) 1999-03-23 2004-12-14 International Business Machines Corporation Copper cleaning compositions, processes and products derived therefrom
JP4063475B2 (ja) * 1999-11-10 2008-03-19 メック株式会社 銅または銅合金のエッチング剤
US6896748B2 (en) * 2002-07-18 2005-05-24 Praxair S.T. Technology, Inc. Ultrafine-grain-copper-base sputter targets
TW200417628A (en) * 2002-09-09 2004-09-16 Shipley Co Llc Improved cleaning composition
US6784107B1 (en) 2003-03-18 2004-08-31 Hui Chen Method for planarizing a copper interconnect structure
JP5352542B2 (ja) * 2010-07-15 2013-11-27 エル エス エムトロン リミテッド リチウム二次電池の集電体用銅箔
EP3518631A1 (fr) 2018-01-29 2019-07-31 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Gravure anisotrope faisant appel à des polymères fortement ramifiés
CN112941517A (zh) * 2019-12-11 2021-06-11 日本碍子株式会社 外观设计性优异的物品及其制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0079265A1 (fr) * 1981-11-06 1983-05-18 Thomson-Csf Procédé de réalisation d'un socle pour le montage d'une pastille semiconductrice sur l'embase d'un boîtier d'encapsulation
DE3421064A1 (de) * 1983-06-06 1984-12-06 PSI Star, Inc., Hayward, Calif. Verfahren zum aetzen eines metalls
US4543153A (en) * 1984-05-17 1985-09-24 Psi Star Process and apparatus for etching copper masked by a nickel-gold mask

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5413965A (en) * 1977-07-01 1979-02-01 Hitachi Ltd Method of making print wiring substrate
US4141850A (en) * 1977-11-08 1979-02-27 Dart Industries Inc. Dissolution of metals
US4242181A (en) * 1979-11-09 1980-12-30 The Harshaw Chemical Company Copper plating process for printed circuit boards
US4319955A (en) * 1980-11-05 1982-03-16 Philip A. Hunt Chemical Corp. Ammoniacal alkaline cupric etchant solution for and method of reducing etchant undercut
US4451327A (en) * 1982-12-17 1984-05-29 Psi Star, Inc. Process and structure for etching copper
JPS59145800A (ja) * 1983-02-07 1984-08-21 Fukuda Kinzoku Hakufun Kogyo Kk 金属箔の粗面化処理方法
US4497687A (en) * 1983-07-28 1985-02-05 Psi Star, Inc. Aqueous process for etching cooper and other metals
US4632727A (en) * 1985-08-12 1986-12-30 Psi Star Copper etching process and solution

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0079265A1 (fr) * 1981-11-06 1983-05-18 Thomson-Csf Procédé de réalisation d'un socle pour le montage d'une pastille semiconductrice sur l'embase d'un boîtier d'encapsulation
DE3421064A1 (de) * 1983-06-06 1984-12-06 PSI Star, Inc., Hayward, Calif. Verfahren zum aetzen eines metalls
US4543153A (en) * 1984-05-17 1985-09-24 Psi Star Process and apparatus for etching copper masked by a nickel-gold mask

Also Published As

Publication number Publication date
FR2603904B1 (fr) 1991-02-08
DE3728803A1 (de) 1988-03-17
JPS63119594A (ja) 1988-05-24
US4695348A (en) 1987-09-22
GB2196903A (en) 1988-05-11
GB2196903B (en) 1990-09-19
GB8720597D0 (en) 1987-10-07

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Legal Events

Date Code Title Description
ST Notification of lapse