FR2565259B1 - Electrolyte acide aqueux, et procede de revetement electrolytique de cuivre a vitesse elevee - Google Patents

Electrolyte acide aqueux, et procede de revetement electrolytique de cuivre a vitesse elevee

Info

Publication number
FR2565259B1
FR2565259B1 FR858507975A FR8507975A FR2565259B1 FR 2565259 B1 FR2565259 B1 FR 2565259B1 FR 858507975 A FR858507975 A FR 858507975A FR 8507975 A FR8507975 A FR 8507975A FR 2565259 B1 FR2565259 B1 FR 2565259B1
Authority
FR
France
Prior art keywords
aqueous acid
acid electrolyte
electrolytic coating
copper electrolytic
speed copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR858507975A
Other languages
English (en)
Other versions
FR2565259A1 (fr
Inventor
Stephen Christopher Barbieri
Linda Jean Mayer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of FR2565259A1 publication Critical patent/FR2565259A1/fr
Application granted granted Critical
Publication of FR2565259B1 publication Critical patent/FR2565259B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
FR858507975A 1984-05-29 1985-05-28 Electrolyte acide aqueux, et procede de revetement electrolytique de cuivre a vitesse elevee Expired - Lifetime FR2565259B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/614,088 US4555315A (en) 1984-05-29 1984-05-29 High speed copper electroplating process and bath therefor

Publications (2)

Publication Number Publication Date
FR2565259A1 FR2565259A1 (fr) 1985-12-06
FR2565259B1 true FR2565259B1 (fr) 1990-08-10

Family

ID=24459819

Family Applications (1)

Application Number Title Priority Date Filing Date
FR858507975A Expired - Lifetime FR2565259B1 (fr) 1984-05-29 1985-05-28 Electrolyte acide aqueux, et procede de revetement electrolytique de cuivre a vitesse elevee

Country Status (8)

Country Link
US (1) US4555315A (fr)
JP (1) JPS6141787A (fr)
AU (1) AU564519B2 (fr)
CA (1) CA1255623A (fr)
DE (1) DE3518193A1 (fr)
FR (1) FR2565259B1 (fr)
GB (1) GB2159539B (fr)
IT (1) IT1182231B (fr)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4857159A (en) * 1987-03-25 1989-08-15 The Standard Oil Company Electrodeposition recovery method for metals in polymer chelates
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
US4786746A (en) * 1987-09-18 1988-11-22 Pennsylvania Research Corporation Copper electroplating solutions and methods of making and using them
GB8801827D0 (en) * 1988-01-27 1988-02-24 Jct Controls Ltd Improvements in electrochemical processes
DE3817722A1 (de) * 1988-05-25 1989-12-14 Raschig Ag Verwendung von 2-substituierten ethansulfon-verbindungen als galvanotechnische hilfsstoffe
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
US5004525A (en) * 1988-08-23 1991-04-02 Shipley Company Inc. Copper electroplating composition
US5232575A (en) * 1990-07-26 1993-08-03 Mcgean-Rohco, Inc. Polymeric leveling additive for acid electroplating baths
US5190796A (en) * 1991-06-27 1993-03-02 General Electric Company Method of applying metal coatings on diamond and articles made therefrom
US5302467A (en) * 1992-04-27 1994-04-12 General Electric Company Halogenated polyimide composition having improved adhesion characteristic and articles obtained therefrom
US5288519A (en) * 1992-04-27 1994-02-22 General Electric Company Method of producing modified polyimide layer having improved adhesion to metal layer thereon
US5290597A (en) * 1992-04-27 1994-03-01 General Electric Company Method of treating halogenated polyimide substrates for increasing adhesion of metal layer thereon
US5328589A (en) * 1992-12-23 1994-07-12 Enthone-Omi, Inc. Functional fluid additives for acid copper electroplating baths
US6709562B1 (en) 1995-12-29 2004-03-23 International Business Machines Corporation Method of making electroplated interconnection structures on integrated circuit chips
US6946716B2 (en) * 1995-12-29 2005-09-20 International Business Machines Corporation Electroplated interconnection structures on integrated circuit chips
KR100470318B1 (ko) * 1997-06-11 2005-07-01 고요 세이코 가부시키가이샤 동력보조스티어링기어용서보밸브
US5972192A (en) * 1997-07-23 1999-10-26 Advanced Micro Devices, Inc. Pulse electroplating copper or copper alloys
US6183622B1 (en) * 1998-07-13 2001-02-06 Enthone-Omi, Inc. Ductility additives for electrorefining and electrowinning
US6793796B2 (en) 1998-10-26 2004-09-21 Novellus Systems, Inc. Electroplating process for avoiding defects in metal features of integrated circuit devices
KR100665745B1 (ko) * 1999-01-26 2007-01-09 가부시키가이샤 에바라 세이사꾸쇼 구리도금방법 및 그 장치
US7109408B2 (en) * 1999-03-11 2006-09-19 Eneco, Inc. Solid state energy converter
US6444110B2 (en) * 1999-05-17 2002-09-03 Shipley Company, L.L.C. Electrolytic copper plating method
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
US20040045832A1 (en) * 1999-10-14 2004-03-11 Nicholas Martyak Electrolytic copper plating solutions
US6491806B1 (en) 2000-04-27 2002-12-10 Intel Corporation Electroplating bath composition
US20050109627A1 (en) * 2003-10-10 2005-05-26 Applied Materials, Inc. Methods and chemistry for providing initial conformal electrochemical deposition of copper in sub-micron features
WO2002024979A1 (fr) * 2000-09-20 2002-03-28 Dr.-Ing. Max Schlötter Gmbh & Co. Kg Electrolyte et procede pour deposer des couches d'alliages etain-cuivre
DE10046600C2 (de) * 2000-09-20 2003-02-20 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten und Verwendung des Elektrolyten
DE10058896C1 (de) * 2000-10-19 2002-06-13 Atotech Deutschland Gmbh Elektrolytisches Kupferbad, dessen Verwendung und Verfahren zur Abscheidung einer matten Kupferschicht
AU2002215939A1 (en) * 2000-10-19 2002-04-29 Atotech Deutschland Gmbh Copper bath and method of depositing a matt copper coating
JP3967879B2 (ja) * 2000-11-16 2007-08-29 株式会社ルネサステクノロジ 銅めっき液及びそれを用いた半導体集積回路装置の製造方法
US6776893B1 (en) 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
US7316772B2 (en) * 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
US6676823B1 (en) 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating
JP3964263B2 (ja) * 2002-05-17 2007-08-22 株式会社デンソー ブラインドビアホール充填方法及び貫通電極形成方法
JP4115240B2 (ja) * 2002-10-21 2008-07-09 日鉱金属株式会社 特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
CN100526515C (zh) * 2002-12-18 2009-08-12 日矿金属株式会社 铜电解液和从该铜电解液制造出的电解铜箔
US20040154926A1 (en) * 2002-12-24 2004-08-12 Zhi-Wen Sun Multiple chemistry electrochemical plating method
WO2004059040A1 (fr) * 2002-12-25 2004-07-15 Nikko Materials Co., Ltd. Solution electrolytique de cuivre contenant un compose polymere amine quaternaire presentant un squelette specifique et un compose de soufre organique en tant qu'additifs et feuille de cuivre electrolytique produite avec cette solution
KR20040073974A (ko) * 2003-02-14 2004-08-21 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. 전기도금 조성물
US6851200B2 (en) * 2003-03-14 2005-02-08 Hopkins Manufacturing Corporation Reflecting lighted level
US7073496B2 (en) * 2003-03-26 2006-07-11 Saint-Gobain Abrasives, Inc. High precision multi-grit slicing blade
US7473339B2 (en) * 2003-04-18 2009-01-06 Applied Materials, Inc. Slim cell platform plumbing
US9399618B2 (en) * 2003-05-12 2016-07-26 Arkema Inc. High purity electrolytic sulfonic acid solutions
US7128822B2 (en) * 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
US7662981B2 (en) * 2005-07-16 2010-02-16 Rohm And Haas Electronic Materials Llc Leveler compounds
US7883398B2 (en) * 2005-08-11 2011-02-08 Saint-Gobain Abrasives, Inc. Abrasive tool
JP2007107074A (ja) * 2005-10-17 2007-04-26 Okuno Chem Ind Co Ltd 酸性電気銅めっき液及び電気銅めっき方法
US20070158199A1 (en) * 2005-12-30 2007-07-12 Haight Scott M Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps
CN101842856B (zh) * 2007-08-31 2013-10-09 埃托特克德国有限公司 处理表面以促进感兴趣的分子结合的方法、由其形成的涂层和器件
US20090056994A1 (en) * 2007-08-31 2009-03-05 Kuhr Werner G Methods of Treating a Surface to Promote Metal Plating and Devices Formed
US20120175264A1 (en) 2009-09-28 2012-07-12 Basf Se Wafer pretreatment for copper electroplating
US20120175744A1 (en) 2009-09-28 2012-07-12 Basf Se Copper electroplating composition
EP2591645B1 (fr) 2010-07-06 2018-09-05 Namics Corporation Procédés de traitement des surfaces de cuivre pour améliorer l'adhérence à des substrats organiques utilisés dans les cartes de circuit imprimé
JP2012127003A (ja) * 2010-12-15 2012-07-05 Rohm & Haas Electronic Materials Llc 銅層を均一にする電気めっき方法
KR101705734B1 (ko) * 2011-02-18 2017-02-14 삼성전자주식회사 구리 도금 용액 및 이것을 이용한 구리 도금 방법
EP2568063A1 (fr) 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Procédé d'électrodéposition de cuivre à faible contrainte interne
US9243339B2 (en) 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content
US9809891B2 (en) 2014-06-30 2017-11-07 Rohm And Haas Electronic Materials Llc Plating method
US10988852B2 (en) 2015-10-27 2021-04-27 Rohm And Haas Electronic Materials Llc Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
US20170145577A1 (en) * 2015-11-19 2017-05-25 Rohm And Haas Electronic Materials Llc Method of electroplating low internal stress copper deposits on thin film substrates to inhibit warping
US10100420B2 (en) 2015-12-29 2018-10-16 Hong Kong Applied Science and Technology Research Institute Company Limtied Plating leveler for electrodeposition of copper pillar
US10519557B2 (en) * 2016-02-12 2019-12-31 Macdermid Enthone Inc. Leveler compositions for use in copper deposition in manufacture of microelectronics
KR102446480B1 (ko) * 2016-09-22 2022-09-26 맥더미드 엔쏜 인코포레이티드 집적 회로의 웨이퍼 레벨 패키징에서의 구리 침착

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL291575A (fr) * 1962-04-16
US3320317A (en) * 1963-07-09 1967-05-16 Dow Chemical Co Quaternary ammonium adducts of polyepichlorohydrin
US3370598A (en) * 1965-10-20 1968-02-27 Whirlpool Co Dishwasher
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
NL7510771A (nl) * 1975-03-11 1976-09-14 Oxy Metal Industries Corp Werkwijze voor het elektrolytisch neerslaan van koper uit waterige zure galvaniseerbaden.
DE2746938A1 (de) * 1977-10-17 1979-04-19 Schering Ag Saures galvanisches kupferbad
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper

Also Published As

Publication number Publication date
GB2159539A (en) 1985-12-04
AU564519B2 (en) 1987-08-13
FR2565259A1 (fr) 1985-12-06
IT8548123A0 (it) 1985-05-27
CA1255623A (fr) 1989-06-13
DE3518193C2 (fr) 1989-07-06
GB8513501D0 (en) 1985-07-03
IT1182231B (it) 1987-09-30
JPS6220278B2 (fr) 1987-05-06
AU4307385A (en) 1985-12-05
GB2159539B (en) 1988-01-06
JPS6141787A (ja) 1986-02-28
DE3518193A1 (de) 1985-12-05
US4555315A (en) 1985-11-26

Similar Documents

Publication Publication Date Title
FR2565259B1 (fr) Electrolyte acide aqueux, et procede de revetement electrolytique de cuivre a vitesse elevee
FR2555913B1 (fr) Procede de desionisation electrochimique de solutions aqueuses
HU910254D0 (en) Process for producing 7-(3-amino-1-pyrrholidinyl-8-chlorine-cyclopropyl-6-fluorine-1,4-dihydro-4-oxo-3-quinoline-carboxylic acid
DE3582497D1 (de) Verfahren zur herstellung einer elektrolytloesung zum elektroplattieren von zinn oder zinn-blei-legierungen.
FR2558156B1 (fr) Procede de produ
FR2414565B1 (fr) Procede d'electrodeposition de cuivre
BR8506856A (pt) Processo de forja
FR2557892B1 (fr) Solution acide de revetement electrolytique de zinc et d'alliage de zinc, et son procede d'utilisation
FR2575198B1 (fr) Procede de fabrication de pate de cellulose
YU43032B (en) Process for obtaining 2,5-diketo-d-gluconic acid
BR8107935A (pt) Celula eletrolitica cloro-alcalina;celula de prensa-filtro;processo de recirculacao de eletrolito
BE887170A (fr) Procede aqueux de recuperation electrolytique de metaux
GB2084123B (en) Method for separating plutonium ions from aqueous sulfuric acid solutions
FR2564487B1 (fr) Electrolyte de zinc acide aqueux et procede de depot electrolytique de zinc
BE896104A (fr) Procede de decapage electrolytique
FR2567542B1 (fr) Procede de
DE3562234D1 (en) Method for purifying aqueous acrylamide solution
GB2165227B (en) Process for diluting aqueous polymer solutions
PT84706A (fr) Procede de fonctionnalisation de iodo-polyfluoroalcanes par reduction electrochimique
IL77050A0 (en) Process for dearsenifying phosphoric acid solutions
BR8406640A (pt) Anodo de metal ativado,bem como processo para sua producao
GB8503153D0 (en) Nut & tail production method
FR2569687B1 (fr) Procede de raffinage de tertio-butylstyrene
FR2481306B1 (fr) Composition et procede de revetement par electrodeposition cathodique
HUT37419A (en) Process for producing new, substituted isochromanes,oxepines and their acid additional salts

Legal Events

Date Code Title Description
ST Notification of lapse