IT8548123A0 - Elettrolita acido di rame con brillantante e procedimento per elettro deposizione di rame - Google Patents

Elettrolita acido di rame con brillantante e procedimento per elettro deposizione di rame

Info

Publication number
IT8548123A0
IT8548123A0 IT8548123A IT4812385A IT8548123A0 IT 8548123 A0 IT8548123 A0 IT 8548123A0 IT 8548123 A IT8548123 A IT 8548123A IT 4812385 A IT4812385 A IT 4812385A IT 8548123 A0 IT8548123 A0 IT 8548123A0
Authority
IT
Italy
Prior art keywords
copper
electrodeposition
procedure
rinse aid
acid electrolyte
Prior art date
Application number
IT8548123A
Other languages
English (en)
Other versions
IT1182231B (it
Inventor
Barbieri Stephen Christopher
Mayer Linda Jean
Original Assignee
Omi Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omi Int Corp filed Critical Omi Int Corp
Publication of IT8548123A0 publication Critical patent/IT8548123A0/it
Application granted granted Critical
Publication of IT1182231B publication Critical patent/IT1182231B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
IT48123/85A 1984-05-29 1985-05-27 Elettrolita acido di rame con brillantante e procedimento per elettrodeposizione di rame IT1182231B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/614,088 US4555315A (en) 1984-05-29 1984-05-29 High speed copper electroplating process and bath therefor

Publications (2)

Publication Number Publication Date
IT8548123A0 true IT8548123A0 (it) 1985-05-27
IT1182231B IT1182231B (it) 1987-09-30

Family

ID=24459819

Family Applications (1)

Application Number Title Priority Date Filing Date
IT48123/85A IT1182231B (it) 1984-05-29 1985-05-27 Elettrolita acido di rame con brillantante e procedimento per elettrodeposizione di rame

Country Status (8)

Country Link
US (1) US4555315A (it)
JP (1) JPS6141787A (it)
AU (1) AU564519B2 (it)
CA (1) CA1255623A (it)
DE (1) DE3518193A1 (it)
FR (1) FR2565259B1 (it)
GB (1) GB2159539B (it)
IT (1) IT1182231B (it)

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DE10058896C1 (de) * 2000-10-19 2002-06-13 Atotech Deutschland Gmbh Elektrolytisches Kupferbad, dessen Verwendung und Verfahren zur Abscheidung einer matten Kupferschicht
JP3967879B2 (ja) * 2000-11-16 2007-08-29 株式会社ルネサステクノロジ 銅めっき液及びそれを用いた半導体集積回路装置の製造方法
US6776893B1 (en) 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
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JP2010538160A (ja) * 2007-08-31 2010-12-09 ゼタコア インコーポレイテッド 興味ある分子の結合を促進するための表面処理方法、該方法により形成されたコーティングおよび装置
US20090056994A1 (en) * 2007-08-31 2009-03-05 Kuhr Werner G Methods of Treating a Surface to Promote Metal Plating and Devices Formed
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EP2483456A2 (en) 2009-09-28 2012-08-08 Basf Se Wafer pretreatment for copper electroplating
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EP2465976B1 (en) * 2010-12-15 2013-04-03 Rohm and Haas Electronic Materials LLC Method of electroplating uniform copper layer on the edge and walls of though holes of a substrate.
KR101705734B1 (ko) * 2011-02-18 2017-02-14 삼성전자주식회사 구리 도금 용액 및 이것을 이용한 구리 도금 방법
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US9243339B2 (en) 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content
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US10988852B2 (en) 2015-10-27 2021-04-27 Rohm And Haas Electronic Materials Llc Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
US20170145577A1 (en) * 2015-11-19 2017-05-25 Rohm And Haas Electronic Materials Llc Method of electroplating low internal stress copper deposits on thin film substrates to inhibit warping
US10100420B2 (en) * 2015-12-29 2018-10-16 Hong Kong Applied Science and Technology Research Institute Company Limtied Plating leveler for electrodeposition of copper pillar
US10519557B2 (en) 2016-02-12 2019-12-31 Macdermid Enthone Inc. Leveler compositions for use in copper deposition in manufacture of microelectronics
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Also Published As

Publication number Publication date
GB8513501D0 (en) 1985-07-03
JPS6141787A (ja) 1986-02-28
GB2159539A (en) 1985-12-04
AU564519B2 (en) 1987-08-13
AU4307385A (en) 1985-12-05
CA1255623A (en) 1989-06-13
IT1182231B (it) 1987-09-30
DE3518193A1 (de) 1985-12-05
FR2565259A1 (fr) 1985-12-06
GB2159539B (en) 1988-01-06
US4555315A (en) 1985-11-26
JPS6220278B2 (it) 1987-05-06
FR2565259B1 (fr) 1990-08-10
DE3518193C2 (it) 1989-07-06

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