FR2550906B1 - Carte de circuit imprime a couches multiples et son procede de fabrication - Google Patents
Carte de circuit imprime a couches multiples et son procede de fabricationInfo
- Publication number
- FR2550906B1 FR2550906B1 FR848412980A FR8412980A FR2550906B1 FR 2550906 B1 FR2550906 B1 FR 2550906B1 FR 848412980 A FR848412980 A FR 848412980A FR 8412980 A FR8412980 A FR 8412980A FR 2550906 B1 FR2550906 B1 FR 2550906B1
- Authority
- FR
- France
- Prior art keywords
- manufacturing
- circuit board
- printed circuit
- layer printed
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0949—Pad close to a hole, not surrounding the hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB838322474A GB8322474D0 (en) | 1983-08-20 | 1983-08-20 | Printed circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2550906A1 FR2550906A1 (fr) | 1985-02-22 |
FR2550906B1 true FR2550906B1 (fr) | 1992-09-04 |
Family
ID=10547638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR848412980A Expired - Fee Related FR2550906B1 (fr) | 1983-08-20 | 1984-08-20 | Carte de circuit imprime a couches multiples et son procede de fabrication |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS6059799A (fr) |
AU (1) | AU571886B2 (fr) |
DE (1) | DE3428812A1 (fr) |
FR (1) | FR2550906B1 (fr) |
GB (2) | GB8322474D0 (fr) |
NL (1) | NL8402527A (fr) |
ZA (1) | ZA846089B (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2551618B1 (fr) * | 1983-09-02 | 1989-12-01 | Inf Milit Spatiale Aeronaut | Procede de fabrication d'un circuit imprime a couches enterrees et circuit imprime obtenu par un tel procede |
GB2207558B (en) * | 1987-07-11 | 1991-10-30 | Abdul Hamed | Printed circuit boards |
TW526693B (en) | 2000-06-15 | 2003-04-01 | Murata Manufacturing Co | Multilayer circuit component and method for manufacturing the same |
DE102015111432A1 (de) * | 2015-07-15 | 2017-01-19 | Knorr-Bremse Systeme für Nutzfahrzeuge GmbH | Verfahren zur Aufbereitung eines mechatronischen Systems für ein Nutzfahrzeug sowie mechatronisches System |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2650348A1 (de) * | 1976-11-03 | 1978-05-11 | Bosch Gmbh Robert | Elektrische schaltungsanordnung |
BR8008696A (pt) * | 1979-05-24 | 1981-04-14 | Fujitsu Ltd | Painel de circuito impresso de miltiplas camadas, oco, e processo para fabricacao do mesmo |
FR2476428A1 (fr) * | 1980-02-15 | 1981-08-21 | Tech Electro Cie Indle | Procede de fixation de composants electroniques sur un circuit imprime et produit obtenu par ce procede |
JPS5724775U (fr) * | 1980-07-17 | 1982-02-08 |
-
1983
- 1983-08-20 GB GB838322474A patent/GB8322474D0/en active Pending
-
1984
- 1984-08-04 DE DE19843428812 patent/DE3428812A1/de not_active Withdrawn
- 1984-08-06 ZA ZA846089A patent/ZA846089B/xx unknown
- 1984-08-17 NL NL8402527A patent/NL8402527A/nl not_active Application Discontinuation
- 1984-08-17 AU AU32046/84A patent/AU571886B2/en not_active Ceased
- 1984-08-20 GB GB08421094A patent/GB2145574B/en not_active Expired
- 1984-08-20 JP JP59171699A patent/JPS6059799A/ja active Pending
- 1984-08-20 FR FR848412980A patent/FR2550906B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB8322474D0 (en) | 1983-09-21 |
FR2550906A1 (fr) | 1985-02-22 |
AU3204684A (en) | 1985-02-21 |
JPS6059799A (ja) | 1985-04-06 |
AU571886B2 (en) | 1988-04-28 |
ZA846089B (en) | 1985-03-27 |
NL8402527A (nl) | 1985-03-18 |
DE3428812A1 (de) | 1985-03-07 |
GB8421094D0 (en) | 1984-09-26 |
GB2145574A (en) | 1985-03-27 |
GB2145574B (en) | 1986-04-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CD | Change of name or company name | ||
CL | Concession to grant licences | ||
ST | Notification of lapse |