FR2550906B1 - Carte de circuit imprime a couches multiples et son procede de fabrication - Google Patents

Carte de circuit imprime a couches multiples et son procede de fabrication

Info

Publication number
FR2550906B1
FR2550906B1 FR848412980A FR8412980A FR2550906B1 FR 2550906 B1 FR2550906 B1 FR 2550906B1 FR 848412980 A FR848412980 A FR 848412980A FR 8412980 A FR8412980 A FR 8412980A FR 2550906 B1 FR2550906 B1 FR 2550906B1
Authority
FR
France
Prior art keywords
manufacturing
circuit board
printed circuit
layer printed
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR848412980A
Other languages
English (en)
Other versions
FR2550906A1 (fr
Inventor
Gordon Leslie Thompson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Publication of FR2550906A1 publication Critical patent/FR2550906A1/fr
Application granted granted Critical
Publication of FR2550906B1 publication Critical patent/FR2550906B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • H05K1/116Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0154Polyimide
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/0949Pad close to a hole, not surrounding the hole
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377Protective layers
    • H05K2203/1394Covering open PTHs, e.g. by dry film resist or by metal disc
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/176Removing, replacing or disconnecting component; Easily removable component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0094Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452Solder masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/429Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4688Composite multilayer circuits, i.e. comprising insulating layers having different properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
FR848412980A 1983-08-20 1984-08-20 Carte de circuit imprime a couches multiples et son procede de fabrication Expired - Fee Related FR2550906B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB838322474A GB8322474D0 (en) 1983-08-20 1983-08-20 Printed circuit boards

Publications (2)

Publication Number Publication Date
FR2550906A1 FR2550906A1 (fr) 1985-02-22
FR2550906B1 true FR2550906B1 (fr) 1992-09-04

Family

ID=10547638

Family Applications (1)

Application Number Title Priority Date Filing Date
FR848412980A Expired - Fee Related FR2550906B1 (fr) 1983-08-20 1984-08-20 Carte de circuit imprime a couches multiples et son procede de fabrication

Country Status (7)

Country Link
JP (1) JPS6059799A (fr)
AU (1) AU571886B2 (fr)
DE (1) DE3428812A1 (fr)
FR (1) FR2550906B1 (fr)
GB (2) GB8322474D0 (fr)
NL (1) NL8402527A (fr)
ZA (1) ZA846089B (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2551618B1 (fr) * 1983-09-02 1989-12-01 Inf Milit Spatiale Aeronaut Procede de fabrication d'un circuit imprime a couches enterrees et circuit imprime obtenu par un tel procede
GB2207558B (en) * 1987-07-11 1991-10-30 Abdul Hamed Printed circuit boards
TW526693B (en) 2000-06-15 2003-04-01 Murata Manufacturing Co Multilayer circuit component and method for manufacturing the same
DE102015111432A1 (de) * 2015-07-15 2017-01-19 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Verfahren zur Aufbereitung eines mechatronischen Systems für ein Nutzfahrzeug sowie mechatronisches System

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2650348A1 (de) * 1976-11-03 1978-05-11 Bosch Gmbh Robert Elektrische schaltungsanordnung
BR8008696A (pt) * 1979-05-24 1981-04-14 Fujitsu Ltd Painel de circuito impresso de miltiplas camadas, oco, e processo para fabricacao do mesmo
FR2476428A1 (fr) * 1980-02-15 1981-08-21 Tech Electro Cie Indle Procede de fixation de composants electroniques sur un circuit imprime et produit obtenu par ce procede
JPS5724775U (fr) * 1980-07-17 1982-02-08

Also Published As

Publication number Publication date
GB8322474D0 (en) 1983-09-21
FR2550906A1 (fr) 1985-02-22
AU3204684A (en) 1985-02-21
JPS6059799A (ja) 1985-04-06
AU571886B2 (en) 1988-04-28
ZA846089B (en) 1985-03-27
NL8402527A (nl) 1985-03-18
DE3428812A1 (de) 1985-03-07
GB8421094D0 (en) 1984-09-26
GB2145574A (en) 1985-03-27
GB2145574B (en) 1986-04-09

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Legal Events

Date Code Title Description
CD Change of name or company name
CL Concession to grant licences
ST Notification of lapse