FR2504696B1 - Procede et dispositif pour l'exposition a la lumiere de substances photosensibles, appelees photoresists - Google Patents

Procede et dispositif pour l'exposition a la lumiere de substances photosensibles, appelees photoresists

Info

Publication number
FR2504696B1
FR2504696B1 FR8206998A FR8206998A FR2504696B1 FR 2504696 B1 FR2504696 B1 FR 2504696B1 FR 8206998 A FR8206998 A FR 8206998A FR 8206998 A FR8206998 A FR 8206998A FR 2504696 B1 FR2504696 B1 FR 2504696B1
Authority
FR
France
Prior art keywords
exposing light
photosensitive substances
called photoresists
photoresists
called
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8206998A
Other languages
English (en)
Other versions
FR2504696A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jenoptik AG
Original Assignee
Carl Zeiss Jena GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss Jena GmbH filed Critical Carl Zeiss Jena GmbH
Publication of FR2504696A1 publication Critical patent/FR2504696A1/fr
Application granted granted Critical
Publication of FR2504696B1 publication Critical patent/FR2504696B1/fr
Expired legal-status Critical Current

Links

Classifications

    • AHUMAN NECESSITIES
    • A44HABERDASHERY; JEWELLERY
    • A44CPERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
    • A44C11/00Watch chains; Ornamental chains
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2041Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
FR8206998A 1981-04-24 1982-04-23 Procede et dispositif pour l'exposition a la lumiere de substances photosensibles, appelees photoresists Expired FR2504696B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DD81229475A DD160756A3 (de) 1981-04-24 1981-04-24 Anordnung zur verbesserung fotochemischer umsetzungsprozesse in fotoresistschichten
JP56154059A JPS57177144A (en) 1981-04-24 1981-09-30 Method and device for exposure

Publications (2)

Publication Number Publication Date
FR2504696A1 FR2504696A1 (fr) 1982-10-29
FR2504696B1 true FR2504696B1 (fr) 1985-11-22

Family

ID=25747719

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8206998A Expired FR2504696B1 (fr) 1981-04-24 1982-04-23 Procede et dispositif pour l'exposition a la lumiere de substances photosensibles, appelees photoresists

Country Status (11)

Country Link
US (1) US4704348A (fr)
JP (1) JPS57177144A (fr)
KR (1) KR860000158B1 (fr)
CH (1) CH651423A5 (fr)
DD (1) DD160756A3 (fr)
DE (1) DE3214325A1 (fr)
FR (1) FR2504696B1 (fr)
GB (1) GB2100453B (fr)
IT (1) IT8267548A0 (fr)
NL (1) NL8201726A (fr)
SU (1) SU1238274A1 (fr)

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US4864356A (en) * 1987-04-21 1989-09-05 Brother Kogyo Kabushiki Kaisha Exposure device for image recording apparatus
US5073796A (en) * 1987-08-31 1991-12-17 Kabushiki Kaisha Toshiba Cooling system for an apparatus with a heat generating element therein
JPH01157527A (ja) * 1987-12-14 1989-06-20 Toshiba Corp フォトレジストのパターン形成方法
DE68921687T2 (de) * 1988-09-02 1995-08-03 Canon Kk Belichtungseinrichtung.
JPH0335542U (fr) * 1989-08-17 1991-04-08
JPH03139634A (ja) * 1989-10-26 1991-06-13 Brother Ind Ltd 画像形成装置
US4989031A (en) * 1990-01-29 1991-01-29 Nikon Corporation Projection exposure apparatus
US5452052A (en) * 1992-03-25 1995-09-19 Matsushita Electric Industrial Co., Ltd. Apparatus for exposing chemically amplified resist
JPH0636993A (ja) * 1992-05-21 1994-02-10 Canon Inc 露光装置及び半導体素子の製造方法
US5696623A (en) * 1993-08-05 1997-12-09 Fujitsu Limited UV exposure with elongated service lifetime
JP3387075B2 (ja) * 1994-12-12 2003-03-17 株式会社ニコン 走査露光方法、露光装置、及び走査型露光装置
DE69618501T2 (de) * 1995-03-08 2002-06-13 Matsushita Electric Ind Co Ltd Verfahren zur Herstellung eines Musters
US5877843A (en) * 1995-09-12 1999-03-02 Nikon Corporation Exposure apparatus
US6297871B1 (en) 1995-09-12 2001-10-02 Nikon Corporation Exposure apparatus
US6645701B1 (en) * 1995-11-22 2003-11-11 Nikon Corporation Exposure method and exposure apparatus
JP4011643B2 (ja) * 1996-01-05 2007-11-21 キヤノン株式会社 半導体製造装置
JPH09218519A (ja) * 1996-02-09 1997-08-19 Nikon Corp 露光装置の環境制御方法及び装置
US6545746B1 (en) * 1996-03-04 2003-04-08 Nikon Corporation Projection exposure apparatus
KR100542414B1 (ko) * 1996-03-27 2006-05-10 가부시키가이샤 니콘 노광장치및공조장치
JP3689510B2 (ja) * 1996-11-15 2005-08-31 キヤノン株式会社 露光装置およびデバイス製造方法
US6714278B2 (en) 1996-11-25 2004-03-30 Nikon Corporation Exposure apparatus
US6882403B1 (en) 1997-04-07 2005-04-19 Nikon Corporation Lithography system and method
KR100636451B1 (ko) 1997-06-10 2006-10-18 가부시키가이샤 니콘 광학 장치 및 그 세정 방법과 투영 노광 장치 및 그 제조방법
JP4026943B2 (ja) * 1997-09-04 2007-12-26 キヤノン株式会社 露光装置およびデバイス製造方法
JPH11224839A (ja) * 1998-02-04 1999-08-17 Canon Inc 露光装置とデバイス製造方法、ならびに該露光装置の光学素子クリーニング方法
WO1999050892A1 (fr) * 1998-03-31 1999-10-07 Nikon Corporation Dispositif optique et systeme d'exposition equipe du dispositif optique
WO2000016381A1 (fr) * 1998-09-14 2000-03-23 Nikon Corporation Appareil d'exposition et son procede de fabrication, et procede de production de dispositif
EP1229573A4 (fr) 1999-07-16 2006-11-08 Nikon Corp Procede et systeme d'exposition
JP2001118783A (ja) * 1999-10-21 2001-04-27 Nikon Corp 露光方法及び装置、並びにデバイス製造方法
JP2001274054A (ja) * 2000-03-24 2001-10-05 Canon Inc 露光装置、半導体デバイス製造方法および半導体デバイス製造工場
JP3869999B2 (ja) 2000-03-30 2007-01-17 キヤノン株式会社 露光装置および半導体デバイス製造方法
JP2002158170A (ja) * 2000-09-08 2002-05-31 Nikon Corp 露光装置及びデバイス製造方法
DE10211611A1 (de) * 2002-03-12 2003-09-25 Zeiss Carl Smt Ag Verfahren und Vorrichtung zur Dekontamination optischer Oberflächen
JP2004128213A (ja) * 2002-10-02 2004-04-22 Canon Inc 温調システム及びそれを組み込んだ露光装置
AU2003295177A1 (en) 2002-12-19 2004-07-14 Koninklijke Philips Electronics N.V. Method and device for irradiating spots on a layer
WO2004086470A1 (fr) 2003-03-25 2004-10-07 Nikon Corporation Systeme d'exposition et procede de production de dispositifs
US7329308B2 (en) * 2003-07-09 2008-02-12 Entegris, Inc. Air handling and chemical filtration system and method
US20060285091A1 (en) * 2003-07-21 2006-12-21 Parekh Bipin S Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system related application
US7384149B2 (en) * 2003-07-21 2008-06-10 Asml Netherlands B.V. Lithographic projection apparatus, gas purging method and device manufacturing method and purge gas supply system
US7352433B2 (en) 2003-10-28 2008-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005142382A (ja) * 2003-11-07 2005-06-02 Canon Inc 露光装置
US20050153424A1 (en) * 2004-01-08 2005-07-14 Derek Coon Fluid barrier with transparent areas for immersion lithography
JP2005353762A (ja) * 2004-06-09 2005-12-22 Matsushita Electric Ind Co Ltd 半導体製造装置及びパターン形成方法
US7304715B2 (en) 2004-08-13 2007-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006093428A (ja) * 2004-09-24 2006-04-06 Canon Inc 温調チャンバおよびこれを用いた露光装置
JP4891538B2 (ja) * 2004-11-04 2012-03-07 株式会社日立ハイテクノロジーズ ロードポート
MY139184A (en) * 2004-12-06 2009-08-28 Novartis Ag Method of drying molds
US8692973B2 (en) 2005-01-31 2014-04-08 Nikon Corporation Exposure apparatus and method for producing device
KR101942138B1 (ko) * 2005-01-31 2019-01-24 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US8018573B2 (en) * 2005-02-22 2011-09-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007281142A (ja) * 2006-04-05 2007-10-25 Canon Inc 露光装置及び方法、並びに、デバイス製造方法
WO2008024263A1 (fr) * 2006-08-18 2008-02-28 Entegris, Inc Système et procédé de piégeage de condensation par vortex utilisés dans l'humidification d'un gaz de drainage
US7572976B1 (en) * 2008-02-06 2009-08-11 Victor Merrill Quick connect electrical box
NL1036596A1 (nl) * 2008-02-21 2009-08-24 Asml Holding Nv Re-flow and buffer system for immersion lithography.
EP3832391A1 (fr) * 2019-12-03 2021-06-09 ASML Netherlands B.V. Ensemble de serrage
CN115308999B (zh) * 2022-10-12 2023-03-24 苏州矩阵光电有限公司 一种匀胶烘干一体机及匀胶烘干方法

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US3620621A (en) * 1969-02-12 1971-11-16 Matrographics Inc Emulsion control
US4026653A (en) * 1975-05-09 1977-05-31 Bell Telephone Laboratories, Incorporated Proximity printing method
DD127137B1 (de) * 1976-08-17 1979-11-28 Elektromat Veb Vorrichtung zum kompensieren der waermeeinwirkung an justier- und belichtungseinrichtungen
US4185202A (en) * 1977-12-05 1980-01-22 Bell Telephone Laboratories, Incorporated X-ray lithography
US4423137A (en) * 1980-10-28 1983-12-27 Quixote Corporation Contact printing and etching method of making high density recording medium

Also Published As

Publication number Publication date
JPS57177144A (en) 1982-10-30
CH651423A5 (de) 1985-09-13
DD160756A3 (de) 1984-02-29
NL8201726A (nl) 1982-11-16
KR860000158B1 (ko) 1986-02-27
IT8267548A0 (it) 1982-04-26
FR2504696A1 (fr) 1982-10-29
SU1238274A1 (ru) 1986-06-15
US4704348A (en) 1987-11-03
KR840000074A (ko) 1984-01-30
GB2100453A (en) 1982-12-22
GB2100453B (en) 1985-03-20
DE3214325A1 (de) 1983-01-27

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Legal Events

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ST Notification of lapse