FR2501414A1 - Microboitier d'encapsulation de pastilles de semi-conducteur, testable apres soudure sur un substrat - Google Patents

Microboitier d'encapsulation de pastilles de semi-conducteur, testable apres soudure sur un substrat Download PDF

Info

Publication number
FR2501414A1
FR2501414A1 FR8104536A FR8104536A FR2501414A1 FR 2501414 A1 FR2501414 A1 FR 2501414A1 FR 8104536 A FR8104536 A FR 8104536A FR 8104536 A FR8104536 A FR 8104536A FR 2501414 A1 FR2501414 A1 FR 2501414A1
Authority
FR
France
Prior art keywords
base
external connections
cover
microbase
connections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8104536A
Other languages
English (en)
French (fr)
Other versions
FR2501414B1 (enExample
Inventor
Pierre Texier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8104536A priority Critical patent/FR2501414A1/fr
Priority to GB8206106A priority patent/GB2094552A/en
Priority to DE19823207846 priority patent/DE3207846A1/de
Publication of FR2501414A1 publication Critical patent/FR2501414A1/fr
Application granted granted Critical
Publication of FR2501414B1 publication Critical patent/FR2501414B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
FR8104536A 1981-03-06 1981-03-06 Microboitier d'encapsulation de pastilles de semi-conducteur, testable apres soudure sur un substrat Granted FR2501414A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR8104536A FR2501414A1 (fr) 1981-03-06 1981-03-06 Microboitier d'encapsulation de pastilles de semi-conducteur, testable apres soudure sur un substrat
GB8206106A GB2094552A (en) 1981-03-06 1982-03-02 A semiconductor-chip encapsulation micromodule which is testable after soldering on a substrate
DE19823207846 DE3207846A1 (de) 1981-03-06 1982-03-04 Mikrogehaeuse zum einkapseln von halbleiterplaettchen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8104536A FR2501414A1 (fr) 1981-03-06 1981-03-06 Microboitier d'encapsulation de pastilles de semi-conducteur, testable apres soudure sur un substrat

Publications (2)

Publication Number Publication Date
FR2501414A1 true FR2501414A1 (fr) 1982-09-10
FR2501414B1 FR2501414B1 (enExample) 1984-07-06

Family

ID=9255957

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8104536A Granted FR2501414A1 (fr) 1981-03-06 1981-03-06 Microboitier d'encapsulation de pastilles de semi-conducteur, testable apres soudure sur un substrat

Country Status (3)

Country Link
DE (1) DE3207846A1 (enExample)
FR (1) FR2501414A1 (enExample)
GB (1) GB2094552A (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH659541A5 (fr) * 1982-08-10 1987-01-30 David Frank Brown Support de puce.
FR2565408B1 (fr) * 1984-05-30 1987-04-10 Thomson Csf Dispositif comportant une pastille de circuit integre surmontee d'une dalle isolante servant de boitier
US4695870A (en) * 1986-03-27 1987-09-22 Hughes Aircraft Company Inverted chip carrier
US4907065A (en) * 1988-03-01 1990-03-06 Lsi Logic Corporation Integrated circuit chip sealing assembly
EP0351581A1 (de) * 1988-07-22 1990-01-24 Oerlikon-Contraves AG Hochintegrierte Schaltung sowie Verfahren zu deren Herstellung
EP0538010A3 (en) * 1991-10-17 1993-05-19 Fujitsu Limited Semiconductor package, a holder, a method of production and testing for the same
TW238419B (enExample) 1992-08-21 1995-01-11 Olin Corp
AU7873894A (en) * 1993-10-12 1995-05-04 Olin Corporation Edge connectable metal package
GB2283863A (en) * 1993-11-16 1995-05-17 Ibm Direct chip attach module
JPH10125741A (ja) 1996-10-16 1998-05-15 Oki Electric Ind Co Ltd 集積回路及び集積回路の製造方法及び集積回路の評価方法
WO1999041781A1 (fr) * 1998-02-10 1999-08-19 Nissha Printing Co., Ltd. Feuille de base pour module de semiconducteur, procede de fabrication de ladite feuille de base, et module de semiconducteur
EP2220680A1 (en) 2007-12-06 2010-08-25 Nxp B.V. Semiconductor device and wafer with a test structure and method for assessing adhesion of under-bump metallization

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1335654A (en) * 1971-11-16 1973-10-31 Du Pont Packages for semiconductor chips
US4180161A (en) * 1977-02-14 1979-12-25 Motorola, Inc. Carrier structure integral with an electronic package and method of construction

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1335654A (en) * 1971-11-16 1973-10-31 Du Pont Packages for semiconductor chips
US4180161A (en) * 1977-02-14 1979-12-25 Motorola, Inc. Carrier structure integral with an electronic package and method of construction

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/78 *

Also Published As

Publication number Publication date
DE3207846A1 (de) 1982-09-16
FR2501414B1 (enExample) 1984-07-06
GB2094552A (en) 1982-09-15

Similar Documents

Publication Publication Date Title
TW502349B (en) Semiconductor device and packaging method thereof
TW419761B (en) Chip size package and method of fabricating the same
TWI264810B (en) Structure and method of forming a multiple leadframe semiconductor device
EP0239494B1 (fr) Boîtier de circuit intégré
FR2501414A1 (fr) Microboitier d'encapsulation de pastilles de semi-conducteur, testable apres soudure sur un substrat
US6346432B2 (en) Semiconductor element having external connection terminals, method of manufacturing the semiconductor element, and semiconductor device equipped with the semiconductor element
TW200812052A (en) Semiconductor stack package for optimal packaging of components having interconnections
CA1303241C (fr) Carte a microcircuits electroniques et son procede de fabrication
TW442945B (en) Integrated circuit chip, integrated circuit device, printed circuit board and electronic machine
US20120236902A1 (en) Infrared sensor
FR2563049A1 (fr) Boitier pour circuit integre
FR2604029A1 (fr) Puce de circuit integre possedant des bornes de sortie ameliorees
FR2708106A1 (fr) Douille d'essais et procédé de production de microplaquettes reconnues bonnes en utilisant cette douille.
US6291263B1 (en) Method of fabricating an integrated circuit package having a core-hollowed encapsulation body
TW200404995A (en) Infrared sensor package
TW398046B (en) Method for manufacturing chip scale packages
CN105355641B (zh) 高像素影像传感芯片的封装结构及封装方法
EP0044755A2 (fr) Boîtier d'encapsulation, résistant à de fortes pressions externes, pour circuit hybride
FR2764115A1 (fr) Dispositif semiconducteur et procede de connexion des fils internes de masse d'un tel dispositif
US6405359B1 (en) Method for backside failure analysis requiring simple bias conditions
TWI297393B (en) Test socket and upper cover therefor
US5349234A (en) Package and method for assembly of infra-red imaging devices
FR2629271A1 (fr) Dispositif d'interconnexion et de protection d'une pastille nue de composant hyperfrequence
FR2629272A1 (fr) Support de circuit integre de haute densite et appareil d'etamage selectif des conducteurs du support
FR2620275A1 (fr) Boitier pour le montage en surface d'un composant fonctionnant en hyperfrequences

Legal Events

Date Code Title Description
ST Notification of lapse