FR2501414A1 - Microboitier d'encapsulation de pastilles de semi-conducteur, testable apres soudure sur un substrat - Google Patents

Microboitier d'encapsulation de pastilles de semi-conducteur, testable apres soudure sur un substrat Download PDF

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Publication number
FR2501414A1
FR2501414A1 FR8104536A FR8104536A FR2501414A1 FR 2501414 A1 FR2501414 A1 FR 2501414A1 FR 8104536 A FR8104536 A FR 8104536A FR 8104536 A FR8104536 A FR 8104536A FR 2501414 A1 FR2501414 A1 FR 2501414A1
Authority
FR
France
Prior art keywords
base
external connections
cover
microbase
connections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8104536A
Other languages
English (en)
French (fr)
Other versions
FR2501414B1 (enExample
Inventor
Pierre Texier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8104536A priority Critical patent/FR2501414A1/fr
Priority to GB8206106A priority patent/GB2094552A/en
Priority to DE19823207846 priority patent/DE3207846A1/de
Publication of FR2501414A1 publication Critical patent/FR2501414A1/fr
Application granted granted Critical
Publication of FR2501414B1 publication Critical patent/FR2501414B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H10P74/273—
    • H10W70/657—
    • H10W76/157—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
FR8104536A 1981-03-06 1981-03-06 Microboitier d'encapsulation de pastilles de semi-conducteur, testable apres soudure sur un substrat Granted FR2501414A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR8104536A FR2501414A1 (fr) 1981-03-06 1981-03-06 Microboitier d'encapsulation de pastilles de semi-conducteur, testable apres soudure sur un substrat
GB8206106A GB2094552A (en) 1981-03-06 1982-03-02 A semiconductor-chip encapsulation micromodule which is testable after soldering on a substrate
DE19823207846 DE3207846A1 (de) 1981-03-06 1982-03-04 Mikrogehaeuse zum einkapseln von halbleiterplaettchen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8104536A FR2501414A1 (fr) 1981-03-06 1981-03-06 Microboitier d'encapsulation de pastilles de semi-conducteur, testable apres soudure sur un substrat

Publications (2)

Publication Number Publication Date
FR2501414A1 true FR2501414A1 (fr) 1982-09-10
FR2501414B1 FR2501414B1 (enExample) 1984-07-06

Family

ID=9255957

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8104536A Granted FR2501414A1 (fr) 1981-03-06 1981-03-06 Microboitier d'encapsulation de pastilles de semi-conducteur, testable apres soudure sur un substrat

Country Status (3)

Country Link
DE (1) DE3207846A1 (enExample)
FR (1) FR2501414A1 (enExample)
GB (1) GB2094552A (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59501564A (ja) * 1982-08-10 1984-08-30 ダウテイ・エレクトロニク・コンポーネンツ・リミテツド 電気回路ユニツト
FR2565408B1 (fr) * 1984-05-30 1987-04-10 Thomson Csf Dispositif comportant une pastille de circuit integre surmontee d'une dalle isolante servant de boitier
US4695870A (en) * 1986-03-27 1987-09-22 Hughes Aircraft Company Inverted chip carrier
US4907065A (en) * 1988-03-01 1990-03-06 Lsi Logic Corporation Integrated circuit chip sealing assembly
EP0351581A1 (de) * 1988-07-22 1990-01-24 Oerlikon-Contraves AG Hochintegrierte Schaltung sowie Verfahren zu deren Herstellung
EP0689241A2 (en) * 1991-10-17 1995-12-27 Fujitsu Limited Carrier for carrying semiconductor device
TW238419B (enExample) 1992-08-21 1995-01-11 Olin Corp
EP0723703A4 (en) * 1993-10-12 1998-04-01 Olin Corp EDGE-ASSEMBLY METAL PACK
GB2283863A (en) * 1993-11-16 1995-05-17 Ibm Direct chip attach module
JPH10125741A (ja) * 1996-10-16 1998-05-15 Oki Electric Ind Co Ltd 集積回路及び集積回路の製造方法及び集積回路の評価方法
KR100690917B1 (ko) * 1998-02-10 2007-03-08 니폰샤신인사츠가부시키가이샤 반도체 모듈용 기체시트의 제조방법
EP2220680A1 (en) 2007-12-06 2010-08-25 Nxp B.V. Semiconductor device and wafer with a test structure and method for assessing adhesion of under-bump metallization

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1335654A (en) * 1971-11-16 1973-10-31 Du Pont Packages for semiconductor chips
US4180161A (en) * 1977-02-14 1979-12-25 Motorola, Inc. Carrier structure integral with an electronic package and method of construction

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1335654A (en) * 1971-11-16 1973-10-31 Du Pont Packages for semiconductor chips
US4180161A (en) * 1977-02-14 1979-12-25 Motorola, Inc. Carrier structure integral with an electronic package and method of construction

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/78 *

Also Published As

Publication number Publication date
DE3207846A1 (de) 1982-09-16
GB2094552A (en) 1982-09-15
FR2501414B1 (enExample) 1984-07-06

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