FR2501414B1 - - Google Patents

Info

Publication number
FR2501414B1
FR2501414B1 FR8104536A FR8104536A FR2501414B1 FR 2501414 B1 FR2501414 B1 FR 2501414B1 FR 8104536 A FR8104536 A FR 8104536A FR 8104536 A FR8104536 A FR 8104536A FR 2501414 B1 FR2501414 B1 FR 2501414B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8104536A
Other languages
French (fr)
Other versions
FR2501414A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8104536A priority Critical patent/FR2501414A1/fr
Priority to GB8206106A priority patent/GB2094552A/en
Priority to DE19823207846 priority patent/DE3207846A1/de
Publication of FR2501414A1 publication Critical patent/FR2501414A1/fr
Application granted granted Critical
Publication of FR2501414B1 publication Critical patent/FR2501414B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/273—Interconnections for measuring or testing, e.g. probe pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
FR8104536A 1981-03-06 1981-03-06 Microboitier d'encapsulation de pastilles de semi-conducteur, testable apres soudure sur un substrat Granted FR2501414A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR8104536A FR2501414A1 (fr) 1981-03-06 1981-03-06 Microboitier d'encapsulation de pastilles de semi-conducteur, testable apres soudure sur un substrat
GB8206106A GB2094552A (en) 1981-03-06 1982-03-02 A semiconductor-chip encapsulation micromodule which is testable after soldering on a substrate
DE19823207846 DE3207846A1 (de) 1981-03-06 1982-03-04 Mikrogehaeuse zum einkapseln von halbleiterplaettchen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8104536A FR2501414A1 (fr) 1981-03-06 1981-03-06 Microboitier d'encapsulation de pastilles de semi-conducteur, testable apres soudure sur un substrat

Publications (2)

Publication Number Publication Date
FR2501414A1 FR2501414A1 (fr) 1982-09-10
FR2501414B1 true FR2501414B1 (enExample) 1984-07-06

Family

ID=9255957

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8104536A Granted FR2501414A1 (fr) 1981-03-06 1981-03-06 Microboitier d'encapsulation de pastilles de semi-conducteur, testable apres soudure sur un substrat

Country Status (3)

Country Link
DE (1) DE3207846A1 (enExample)
FR (1) FR2501414A1 (enExample)
GB (1) GB2094552A (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0115514B1 (en) * 1982-08-10 1986-11-12 BROWN, David, Frank Chip carrier
FR2565408B1 (fr) * 1984-05-30 1987-04-10 Thomson Csf Dispositif comportant une pastille de circuit integre surmontee d'une dalle isolante servant de boitier
US4695870A (en) * 1986-03-27 1987-09-22 Hughes Aircraft Company Inverted chip carrier
US4907065A (en) * 1988-03-01 1990-03-06 Lsi Logic Corporation Integrated circuit chip sealing assembly
EP0351581A1 (de) * 1988-07-22 1990-01-24 Oerlikon-Contraves AG Hochintegrierte Schaltung sowie Verfahren zu deren Herstellung
EP0538010A3 (en) * 1991-10-17 1993-05-19 Fujitsu Limited Semiconductor package, a holder, a method of production and testing for the same
TW238419B (enExample) 1992-08-21 1995-01-11 Olin Corp
KR960705354A (ko) * 1993-10-12 1996-10-09 폴 와인스타인 모서리가 연결가능한 금속 팩키지(Edge connectable metal package)
GB2283863A (en) * 1993-11-16 1995-05-17 Ibm Direct chip attach module
JPH10125741A (ja) * 1996-10-16 1998-05-15 Oki Electric Ind Co Ltd 集積回路及び集積回路の製造方法及び集積回路の評価方法
US6573028B1 (en) * 1998-02-10 2003-06-03 Nissha Printing Co., Ltd. Base sheet for semiconductor module, method for manufacturing base sheet for semiconductor module, and semiconductor module
EP2220680A1 (en) 2007-12-06 2010-08-25 Nxp B.V. Semiconductor device and wafer with a test structure and method for assessing adhesion of under-bump metallization

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3809797A (en) * 1971-11-16 1974-05-07 Du Pont Seal ring compositions and electronic packages made therewith
US4180161A (en) * 1977-02-14 1979-12-25 Motorola, Inc. Carrier structure integral with an electronic package and method of construction

Also Published As

Publication number Publication date
GB2094552A (en) 1982-09-15
FR2501414A1 (fr) 1982-09-10
DE3207846A1 (de) 1982-09-16

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Legal Events

Date Code Title Description
ST Notification of lapse