FR2465563A1 - Procede et appareil de montage de plaquettes a polir - Google Patents
Procede et appareil de montage de plaquettes a polir Download PDFInfo
- Publication number
- FR2465563A1 FR2465563A1 FR8018704A FR8018704A FR2465563A1 FR 2465563 A1 FR2465563 A1 FR 2465563A1 FR 8018704 A FR8018704 A FR 8018704A FR 8018704 A FR8018704 A FR 8018704A FR 2465563 A1 FR2465563 A1 FR 2465563A1
- Authority
- FR
- France
- Prior art keywords
- pad
- wafer
- liquid
- polishing
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims description 14
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 15
- 239000002202 Polyethylene glycol Substances 0.000 claims abstract description 8
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 6
- 239000010703 silicon Substances 0.000 claims abstract description 6
- 239000007788 liquid Substances 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 18
- 239000010408 film Substances 0.000 claims description 10
- 230000001413 cellular effect Effects 0.000 claims description 7
- 229920002635 polyurethane Polymers 0.000 claims description 7
- 239000004814 polyurethane Substances 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 2
- 229920006328 Styrofoam Polymers 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 claims description 2
- 235000011187 glycerol Nutrition 0.000 claims description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N glycerol group Chemical class OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 239000008261 styrofoam Substances 0.000 claims description 2
- 150000001768 cations Chemical class 0.000 claims 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- 150000002334 glycols Chemical class 0.000 claims 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000000725 suspension Substances 0.000 abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 229920005830 Polyurethane Foam Polymers 0.000 abstract 1
- 239000011496 polyurethane foam Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 59
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000004018 waxing Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000005457 ice water Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 235000021178 picnic Nutrition 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006327 polystyrene foam Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7667079A | 1979-09-18 | 1979-09-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2465563A1 true FR2465563A1 (fr) | 1981-03-27 |
| FR2465563B3 FR2465563B3 (https=) | 1982-05-21 |
Family
ID=22133499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8018704A Granted FR2465563A1 (fr) | 1979-09-18 | 1980-08-28 | Procede et appareil de montage de plaquettes a polir |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS6059113B2 (https=) |
| DE (1) | DE3033944C2 (https=) |
| FR (1) | FR2465563A1 (https=) |
| GB (1) | GB2058620B (https=) |
| IT (1) | IT1129028B (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5840356U (ja) * | 1981-09-10 | 1983-03-16 | 株式会社三興技研 | 研摩加工物の保護具 |
| JPS6074018U (ja) * | 1983-10-26 | 1985-05-24 | 新神戸電機株式会社 | 蓄電池減液・温度検出センサ |
| US4534536A (en) * | 1984-06-08 | 1985-08-13 | Buehler Ltd. | Apparatus for mounting samples for polishing |
| JPS61192474A (ja) * | 1985-02-19 | 1986-08-27 | Sanyo Electric Co Ltd | チツプ研摩用治具 |
| JPH0755497B2 (ja) * | 1985-06-07 | 1995-06-14 | 株式会社平林 | 硬脆材料の切断方法 |
| JPS6392439A (ja) * | 1986-10-07 | 1988-04-22 | Toyoda Gosei Co Ltd | 補強糸のピツチ調整装置 |
| JPS6372517U (https=) * | 1986-10-29 | 1988-05-14 | ||
| US5267418A (en) * | 1992-05-27 | 1993-12-07 | International Business Machines Corporation | Confined water fixture for holding wafers undergoing chemical-mechanical polishing |
| KR960700863A (ko) * | 1993-02-12 | 1996-02-24 | 블라디미르 스테파노비치 콘트라텐코 | 취성 재료 부품 가공 공정 및 그 장치(Process for Machining Components Made of Brittle Materials and a Device for Carrying out the Same) |
| JP3042293B2 (ja) * | 1994-02-18 | 2000-05-15 | 信越半導体株式会社 | ウエーハのポリッシング装置 |
| US5695392A (en) * | 1995-08-09 | 1997-12-09 | Speedfam Corporation | Polishing device with improved handling of fluid polishing media |
| CN111318929B (zh) * | 2020-03-11 | 2025-02-18 | 济源创新石化配件有限公司 | 一种密封件平面加工用高精度研磨机 |
| CN115377086A (zh) * | 2022-08-10 | 2022-11-22 | 中国电子科技集团公司第十一研究所 | 一种锑化铟红外探测器的减薄方法 |
| CN120754967A (zh) * | 2023-06-30 | 2025-10-10 | 江苏鑫华半导体科技股份有限公司 | 一种电子级多晶硅棒破碎方法及系统 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2112636A (en) * | 1936-09-02 | 1938-03-29 | Brush Dev Co | Method of making piezoelectric units |
| US3449870A (en) * | 1967-01-24 | 1969-06-17 | Geoscience Instr Corp | Method and apparatus for mounting thin elements |
-
1980
- 1980-08-07 JP JP55109096A patent/JPS6059113B2/ja not_active Expired
- 1980-08-15 GB GB8026700A patent/GB2058620B/en not_active Expired
- 1980-08-28 FR FR8018704A patent/FR2465563A1/fr active Granted
- 1980-09-05 IT IT49624/80A patent/IT1129028B/it active
- 1980-09-10 DE DE3033944A patent/DE3033944C2/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE3033944C2 (de) | 1985-07-11 |
| JPS6059113B2 (ja) | 1985-12-23 |
| IT1129028B (it) | 1986-06-04 |
| FR2465563B3 (https=) | 1982-05-21 |
| DE3033944A1 (de) | 1981-04-02 |
| JPS5645367A (en) | 1981-04-25 |
| GB2058620A (en) | 1981-04-15 |
| GB2058620B (en) | 1982-11-17 |
| IT8049624A0 (it) | 1980-09-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| FR2465563A1 (fr) | Procede et appareil de montage de plaquettes a polir | |
| US4519168A (en) | Liquid waxless fixturing of microsize wafers | |
| EP0517594B1 (fr) | Machine de polissage à bande microabrasive tendue et à tête support de plaquette perfectionnée | |
| JP5519256B2 (ja) | 裏面が研削された基板を研磨する方法および装置 | |
| TWI353006B (en) | Method for manufacturing epitaxial wafer | |
| KR101379570B1 (ko) | 격리된 베벨 에지 세정을 위한 방법 및 장치 | |
| CH615108A5 (en) | Sucking sanding machine | |
| FR2679067A1 (fr) | Materiau en feuille composite de polissage pour processus de traitement de semi-conducteurs. | |
| FR2717727A1 (fr) | Appareil de dressage pour plateau de polissage de plaquettes. | |
| TW200915477A (en) | Edge removal of silicon-on-insulator transfer wafer | |
| JPH09201765A (ja) | バッキングパッドおよび半導体ウエーハの研磨方法 | |
| JP2008284684A (ja) | 研磨アームを使用して基板の縁部を研磨する方法及び装置 | |
| FR2839788A1 (fr) | Support individuel de lentille optique | |
| FR2843061A1 (fr) | Procede de polissage de tranche de materiau | |
| FR3067626A1 (fr) | Procede de polissage cmp uniforme | |
| US8752228B2 (en) | Apparatus for cleaning of circuit substrates | |
| FR3067629A1 (fr) | Tampon de polissage a structure de rainures trapezoidales | |
| FR2993808A1 (fr) | Procede pour la pre-texturation d'une couche de polissage mecano-chimique | |
| TW569329B (en) | Method of manufacturing compound semiconductor wafer | |
| FR3067630A1 (fr) | Tampon de polissage a rainures obliques | |
| FR2935628A1 (fr) | Outil de surfacage a qualite optique | |
| FR3067627A1 (fr) | Procede de polissage cmp a haut debit | |
| TWI614089B (zh) | 半導體基板的保護膜形成方法 | |
| EP1862257B1 (fr) | Insert de toilage multi-matériau | |
| FR3067628A1 (fr) | Procede de polissage cmp uniforme |