GB2058620B - Method and apparatus for effecting the lapping of wafers of semiconductive material - Google Patents

Method and apparatus for effecting the lapping of wafers of semiconductive material

Info

Publication number
GB2058620B
GB2058620B GB8026700A GB8026700A GB2058620B GB 2058620 B GB2058620 B GB 2058620B GB 8026700 A GB8026700 A GB 8026700A GB 8026700 A GB8026700 A GB 8026700A GB 2058620 B GB2058620 B GB 2058620B
Authority
GB
United Kingdom
Prior art keywords
lapping
wafers
effecting
semiconductive material
semiconductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8026700A
Other versions
GB2058620A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam Corp
Original Assignee
Speedfam Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Corp filed Critical Speedfam Corp
Publication of GB2058620A publication Critical patent/GB2058620A/en
Application granted granted Critical
Publication of GB2058620B publication Critical patent/GB2058620B/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
GB8026700A 1979-09-18 1980-08-15 Method and apparatus for effecting the lapping of wafers of semiconductive material Expired GB2058620B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7667079A 1979-09-18 1979-09-18

Publications (2)

Publication Number Publication Date
GB2058620A GB2058620A (en) 1981-04-15
GB2058620B true GB2058620B (en) 1982-11-17

Family

ID=22133499

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8026700A Expired GB2058620B (en) 1979-09-18 1980-08-15 Method and apparatus for effecting the lapping of wafers of semiconductive material

Country Status (5)

Country Link
JP (1) JPS6059113B2 (en)
DE (1) DE3033944C2 (en)
FR (1) FR2465563A1 (en)
GB (1) GB2058620B (en)
IT (1) IT1129028B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840356U (en) * 1981-09-10 1983-03-16 株式会社三興技研 Protective equipment for abrasive workpieces
JPS6074018U (en) * 1983-10-26 1985-05-24 新神戸電機株式会社 Storage battery liquid loss/temperature detection sensor
US4534536A (en) * 1984-06-08 1985-08-13 Buehler Ltd. Apparatus for mounting samples for polishing
JPS61192474A (en) * 1985-02-19 1986-08-27 Sanyo Electric Co Ltd Chip polishing jig
JPH0755497B2 (en) * 1985-06-07 1995-06-14 株式会社平林 Cutting method for hard and brittle materials
JPS6392439A (en) * 1986-10-07 1988-04-22 Toyoda Gosei Co Ltd Apparatus for controlling pitch of reinforcing threads
JPS6372517U (en) * 1986-10-29 1988-05-14
US5267418A (en) * 1992-05-27 1993-12-07 International Business Machines Corporation Confined water fixture for holding wafers undergoing chemical-mechanical polishing
AU7107294A (en) * 1993-02-12 1994-08-29 Vladimir Stepanovich Kondratenko Process for machining components made of brittle materials and a device for carrying out the same
JP3042293B2 (en) * 1994-02-18 2000-05-15 信越半導体株式会社 Wafer polishing equipment
US5695392A (en) * 1995-08-09 1997-12-09 Speedfam Corporation Polishing device with improved handling of fluid polishing media

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2112636A (en) * 1936-09-02 1938-03-29 Brush Dev Co Method of making piezoelectric units
US3449870A (en) * 1967-01-24 1969-06-17 Geoscience Instr Corp Method and apparatus for mounting thin elements

Also Published As

Publication number Publication date
IT1129028B (en) 1986-06-04
DE3033944A1 (en) 1981-04-02
FR2465563A1 (en) 1981-03-27
JPS6059113B2 (en) 1985-12-23
FR2465563B3 (en) 1982-05-21
IT8049624A0 (en) 1980-09-05
GB2058620A (en) 1981-04-15
JPS5645367A (en) 1981-04-25
DE3033944C2 (en) 1985-07-11

Similar Documents

Publication Publication Date Title
GB2042718B (en) Method and apparatus for controlling etching
GB2065369B (en) Method and an apparatus for manufacturing silicon layer
JPS5510500A (en) Manufactre and apparatus for polycrystal silicon
DE3063275D1 (en) Method and apparatus for the blending of granular materials
EP0031901A3 (en) Method and apparatus for the heat-treatment of fine-grained material
DE3172341D1 (en) Process and apparatus for preparing bodies of semiconductor material
DE2965631D1 (en) Method and apparatus for heating semiconductor wafers
GB2058620B (en) Method and apparatus for effecting the lapping of wafers of semiconductive material
GB2053012B (en) Method of and apparatus for the thermal treatment of flowable material
ZA7791B (en) Method and apparatus for processing abrasive material
ZA817390B (en) Apparatus and method for the grinding of material
IL51680A0 (en) Apparatus and method for controlling the crystallisation of semi-conductor materials
ZA772962B (en) Method of and apparatus for the treatment of material
DE2967121D1 (en) Apparatus and process for plasma-etching
IL59629A (en) Apparatus and process for photoexposing semiconductor wafers
DE3070491D1 (en) Method of drying semiconductor substrates and apparatus for drying semiconductor substrates
JPS5499781A (en) Method and apparatus for manufacturing abrasive material
CH609473A5 (en) Method for rapid processing of photographic material and equipment for carrying out the method
JPS5294694A (en) Gorgle and method of and apparatus for manufacturing the same
GB1541158A (en) Apparatus for the treatment of web-like material
BG32881A1 (en) Method and apparatus for retouchina the edges of articles
GB2054684B (en) Method and apparatus for the untwisting of cloth
DE3063975D1 (en) Method and apparatus for the manufacture of tiles
DE2967142D1 (en) Method and apparatus for the manufacture of fusecord
JPS51136583A (en) Method and apparatus for making single crystal bands from semiconductor materials

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee