GB2058620B - Method and apparatus for effecting the lapping of wafers of semiconductive material - Google Patents

Method and apparatus for effecting the lapping of wafers of semiconductive material

Info

Publication number
GB2058620B
GB2058620B GB8026700A GB8026700A GB2058620B GB 2058620 B GB2058620 B GB 2058620B GB 8026700 A GB8026700 A GB 8026700A GB 8026700 A GB8026700 A GB 8026700A GB 2058620 B GB2058620 B GB 2058620B
Authority
GB
United Kingdom
Prior art keywords
lapping
wafers
effecting
semiconductive material
semiconductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8026700A
Other languages
English (en)
Other versions
GB2058620A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam Corp
Original Assignee
Speedfam Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Corp filed Critical Speedfam Corp
Publication of GB2058620A publication Critical patent/GB2058620A/en
Application granted granted Critical
Publication of GB2058620B publication Critical patent/GB2058620B/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
GB8026700A 1979-09-18 1980-08-15 Method and apparatus for effecting the lapping of wafers of semiconductive material Expired GB2058620B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7667079A 1979-09-18 1979-09-18

Publications (2)

Publication Number Publication Date
GB2058620A GB2058620A (en) 1981-04-15
GB2058620B true GB2058620B (en) 1982-11-17

Family

ID=22133499

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8026700A Expired GB2058620B (en) 1979-09-18 1980-08-15 Method and apparatus for effecting the lapping of wafers of semiconductive material

Country Status (5)

Country Link
JP (1) JPS6059113B2 (https=)
DE (1) DE3033944C2 (https=)
FR (1) FR2465563A1 (https=)
GB (1) GB2058620B (https=)
IT (1) IT1129028B (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840356U (ja) * 1981-09-10 1983-03-16 株式会社三興技研 研摩加工物の保護具
JPS6074018U (ja) * 1983-10-26 1985-05-24 新神戸電機株式会社 蓄電池減液・温度検出センサ
US4534536A (en) * 1984-06-08 1985-08-13 Buehler Ltd. Apparatus for mounting samples for polishing
JPS61192474A (ja) * 1985-02-19 1986-08-27 Sanyo Electric Co Ltd チツプ研摩用治具
JPH0755497B2 (ja) * 1985-06-07 1995-06-14 株式会社平林 硬脆材料の切断方法
JPS6392439A (ja) * 1986-10-07 1988-04-22 Toyoda Gosei Co Ltd 補強糸のピツチ調整装置
JPS6372517U (https=) * 1986-10-29 1988-05-14
US5267418A (en) * 1992-05-27 1993-12-07 International Business Machines Corporation Confined water fixture for holding wafers undergoing chemical-mechanical polishing
KR960700863A (ko) * 1993-02-12 1996-02-24 블라디미르 스테파노비치 콘트라텐코 취성 재료 부품 가공 공정 및 그 장치(Process for Machining Components Made of Brittle Materials and a Device for Carrying out the Same)
JP3042293B2 (ja) * 1994-02-18 2000-05-15 信越半導体株式会社 ウエーハのポリッシング装置
US5695392A (en) * 1995-08-09 1997-12-09 Speedfam Corporation Polishing device with improved handling of fluid polishing media
CN111318929B (zh) * 2020-03-11 2025-02-18 济源创新石化配件有限公司 一种密封件平面加工用高精度研磨机
CN115377086A (zh) * 2022-08-10 2022-11-22 中国电子科技集团公司第十一研究所 一种锑化铟红外探测器的减薄方法
CN120754967A (zh) * 2023-06-30 2025-10-10 江苏鑫华半导体科技股份有限公司 一种电子级多晶硅棒破碎方法及系统

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2112636A (en) * 1936-09-02 1938-03-29 Brush Dev Co Method of making piezoelectric units
US3449870A (en) * 1967-01-24 1969-06-17 Geoscience Instr Corp Method and apparatus for mounting thin elements

Also Published As

Publication number Publication date
DE3033944C2 (de) 1985-07-11
JPS6059113B2 (ja) 1985-12-23
IT1129028B (it) 1986-06-04
FR2465563B3 (https=) 1982-05-21
DE3033944A1 (de) 1981-04-02
JPS5645367A (en) 1981-04-25
GB2058620A (en) 1981-04-15
IT8049624A0 (it) 1980-09-05
FR2465563A1 (fr) 1981-03-27

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee