FR2458202A1 - METHOD, MATERIAL AND APPARATUS FOR MANUFACTURING PRINTED CIRCUITS - Google Patents

METHOD, MATERIAL AND APPARATUS FOR MANUFACTURING PRINTED CIRCUITS

Info

Publication number
FR2458202A1
FR2458202A1 FR7914024A FR7914024A FR2458202A1 FR 2458202 A1 FR2458202 A1 FR 2458202A1 FR 7914024 A FR7914024 A FR 7914024A FR 7914024 A FR7914024 A FR 7914024A FR 2458202 A1 FR2458202 A1 FR 2458202A1
Authority
FR
France
Prior art keywords
weld
powder
ink
printed circuits
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7914024A
Other languages
French (fr)
Other versions
FR2458202B1 (en
Inventor
Raymond C Des Marais Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Publication of FR2458202A1 publication Critical patent/FR2458202A1/en
Application granted granted Critical
Publication of FR2458202B1 publication Critical patent/FR2458202B1/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B41M7/0027—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using protective coatings or layers by lamination or by fusion of the coatings or layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PROCEDE DE FABRICATION DE CIRCUITS IMPRIMES PAR UNE TECHNIQUE A ADDITION. UNE ENCRE FORMEE DE RESINE CONTENANT UNE CHARGE METALLIQUE EST D'ABORD DEPOSEE PAR IMPRESSION SUR UNE PLAQUETTE, PUIS EST RECOUVERTE D'UNE POUDRE METALLIQUE QUI EST ENSUITE INCRUSTEE DANS L'ENCRE PAR COMPRESSION. UNE COUCHE DE SOUDURE EST ENSUITE LIEE PAR ALLIAGE A LA POUDRE, PUIS LE CIRCUIT EST CHAUFFE AFIN DE LIER LA SOUDURE A L'ENCRE ET A LA POUDRE. UNE RESERVE DE PROTECTION DE LA SOUDURE PEUT ENSUITE ETRE DEPOSEE SELECTIVEMENT SUR LE CIRCUIT. APPLICATION TRES AVANTAGEUSE A LA REALISATION DE CIRCUITS IMPRIMES EN PETITES SERIES.METHOD OF MANUFACTURING CIRCUITS PRINTED BY AN ADDITIONAL TECHNIQUE. A RESIN-SHAPED INK CONTAINING A METAL CHARGE IS FIRST DEPOSITED BY PRINTING ON A PLATE, THEN IS COVERED WITH A METAL POWDER WHICH IS THEN INCRUSTED IN THE INK BY COMPRESSION. A LAYER OF WELD IS THEN BONDED BY POWDER ALLOY, THEN THE CIRCUIT IS HEATED TO BIND THE WELD TO THE INK AND POWDER. A WELD PROTECTION RESERVE CAN THEN BE DEPOSITED SELECTIVELY ON THE CIRCUIT. VERY ADVANTAGEOUS APPLICATION TO THE REALIZATION OF PRINTED CIRCUITS IN SMALL SERIES.

FR7914024A 1976-07-21 1979-05-31 METHOD, MATERIAL AND APPARATUS FOR MANUFACTURING PRINTED CIRCUITS Expired FR2458202B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70735576A 1976-07-21 1976-07-21

Publications (2)

Publication Number Publication Date
FR2458202A1 true FR2458202A1 (en) 1980-12-26
FR2458202B1 FR2458202B1 (en) 1985-10-25

Family

ID=24841370

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7914024A Expired FR2458202B1 (en) 1976-07-21 1979-05-31 METHOD, MATERIAL AND APPARATUS FOR MANUFACTURING PRINTED CIRCUITS

Country Status (7)

Country Link
JP (1) JPS55162293A (en)
BE (1) BE882957A (en)
DE (1) DE2922304A1 (en)
FR (1) FR2458202B1 (en)
GB (1) GB2050702B (en)
NL (1) NL8001942A (en)
SE (1) SE440844B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1172112A (en) * 1980-12-12 1984-08-07 Richard P. Plunkett Process for making conductive coatings
FR2505367A1 (en) * 1981-05-08 1982-11-12 Lignes Telegraph Telephon Plating conducting layer placed on dielectric - used for multilayer circuit for hybrid circuit
DE19511553C2 (en) * 1995-03-29 1997-02-20 Litton Precision Prod Int Method for producing electrically conductive structures, an electrically conductive structure obtained according to the method and combination for producing electrically conductive structures
GB2380068B (en) * 2001-09-15 2005-08-03 Jaybee Graphics Low Conductive Ink Composition
JP2015195329A (en) * 2014-03-28 2015-11-05 株式会社秀峰 Manufacturing method of conductive wiring, and conductive wiring
JP2016039171A (en) * 2014-08-05 2016-03-22 株式会社秀峰 Method for manufacturing conductive wiring and conductive wiring
US10446412B2 (en) 2015-04-13 2019-10-15 Printcb Ltd. Printing of multi-layer circuits

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB691121A (en) * 1950-07-11 1953-05-06 Nat Res Dev Improvements in or relating to the deposition of metals on surfaces
DE1075179B (en) * 1960-02-11 Woodbridge Suffolk Lawrence John Young (Großbritannien) Process for the manufacture of printed circuits
FR1420044A (en) * 1963-12-26 1965-12-03 Matsushita Electric Ind Co Ltd Manufacturing process of printed circuits
US3506482A (en) * 1967-04-25 1970-04-14 Matsushita Electric Ind Co Ltd Method of making printed circuits
US3910852A (en) * 1971-03-22 1975-10-07 Conshohocken Chemicals Inc Conductive resin composition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1075179B (en) * 1960-02-11 Woodbridge Suffolk Lawrence John Young (Großbritannien) Process for the manufacture of printed circuits
GB691121A (en) * 1950-07-11 1953-05-06 Nat Res Dev Improvements in or relating to the deposition of metals on surfaces
FR1420044A (en) * 1963-12-26 1965-12-03 Matsushita Electric Ind Co Ltd Manufacturing process of printed circuits
US3506482A (en) * 1967-04-25 1970-04-14 Matsushita Electric Ind Co Ltd Method of making printed circuits
US3910852A (en) * 1971-03-22 1975-10-07 Conshohocken Chemicals Inc Conductive resin composition

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ENGINEERING, vol. 210, no. 5449, 16 octobre 1970, pages 411-414, Londres (GB); *

Also Published As

Publication number Publication date
GB2050702B (en) 1984-02-08
GB2050702A (en) 1981-01-07
BE882957A (en) 1980-10-24
DE2922304A1 (en) 1981-04-09
JPS55162293A (en) 1980-12-17
SE8002343L (en) 1981-09-27
NL8001942A (en) 1981-11-02
SE440844B (en) 1985-08-19
FR2458202B1 (en) 1985-10-25

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Legal Events

Date Code Title Description
ST Notification of lapse