FR2445624A1 - Procede de fabrication d'une couche de passivation, notamment pour dispositif electronique semi-conducteur - Google Patents
Procede de fabrication d'une couche de passivation, notamment pour dispositif electronique semi-conducteurInfo
- Publication number
- FR2445624A1 FR2445624A1 FR7931447A FR7931447A FR2445624A1 FR 2445624 A1 FR2445624 A1 FR 2445624A1 FR 7931447 A FR7931447 A FR 7931447A FR 7931447 A FR7931447 A FR 7931447A FR 2445624 A1 FR2445624 A1 FR 2445624A1
- Authority
- FR
- France
- Prior art keywords
- layer
- glass
- ultrasonic vibration
- developing
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011521 glass Substances 0.000 title abstract 3
- 229920002120 photoresistant polymer Polymers 0.000 title abstract 3
- 238000002161 passivation Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000000151 deposition Methods 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Procédé de fabrication d'une couche de passivation ayant une configuration déterminée, qui consiste à déposer sur un substrat une couche contenant un verre et un photoresist, à exposer des parties de cette couche à une source lumineuse et à développer la couche exposée à l'aide d'un solvant révélateur, ce procédé étant caracterisé en ce que l'on procède, pendant l'étape de développement, à une agitation du solvant revélateur à l'aide d'ultrasons. Application à la fabrication de dispositifs semi-conducteurs à l'état solide.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US97345278A | 1978-12-26 | 1978-12-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2445624A1 true FR2445624A1 (fr) | 1980-07-25 |
Family
ID=25520909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7931447A Withdrawn FR2445624A1 (fr) | 1978-12-26 | 1979-12-21 | Procede de fabrication d'une couche de passivation, notamment pour dispositif electronique semi-conducteur |
Country Status (3)
Country | Link |
---|---|
FR (1) | FR2445624A1 (fr) |
PL (1) | PL121661B1 (fr) |
RO (1) | RO76971A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0075537A1 (fr) * | 1981-09-17 | 1983-03-30 | Ciba-Geigy Ag | Procédé de revêtement de circuits imprimés |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB991759A (en) * | 1960-09-14 | 1965-05-12 | Aeroprojects Inc | Activating chemical reactions |
GB1073758A (en) * | 1963-10-08 | 1967-06-28 | Texas Instruments Inc | Application of glass to semiconductor devices |
US3474718A (en) * | 1966-02-08 | 1969-10-28 | Sperry Rand Corp | Photosensitive method for depositing thin uniform glass films on substrates |
-
1979
- 1979-12-21 FR FR7931447A patent/FR2445624A1/fr not_active Withdrawn
- 1979-12-22 RO RO7999654A patent/RO76971A/fr unknown
- 1979-12-24 PL PL22078779A patent/PL121661B1/pl unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB991759A (en) * | 1960-09-14 | 1965-05-12 | Aeroprojects Inc | Activating chemical reactions |
GB1073758A (en) * | 1963-10-08 | 1967-06-28 | Texas Instruments Inc | Application of glass to semiconductor devices |
US3474718A (en) * | 1966-02-08 | 1969-10-28 | Sperry Rand Corp | Photosensitive method for depositing thin uniform glass films on substrates |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0075537A1 (fr) * | 1981-09-17 | 1983-03-30 | Ciba-Geigy Ag | Procédé de revêtement de circuits imprimés |
US4544623A (en) * | 1981-09-17 | 1985-10-01 | Ciba-Geigy Corporation | Photosensitive coating composition and the use thereof for protective purposes |
Also Published As
Publication number | Publication date |
---|---|
PL220787A1 (fr) | 1980-09-08 |
RO76971A (fr) | 1981-06-22 |
PL121661B1 (en) | 1982-05-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |