FR2445624A1 - Procede de fabrication d'une couche de passivation, notamment pour dispositif electronique semi-conducteur - Google Patents

Procede de fabrication d'une couche de passivation, notamment pour dispositif electronique semi-conducteur

Info

Publication number
FR2445624A1
FR2445624A1 FR7931447A FR7931447A FR2445624A1 FR 2445624 A1 FR2445624 A1 FR 2445624A1 FR 7931447 A FR7931447 A FR 7931447A FR 7931447 A FR7931447 A FR 7931447A FR 2445624 A1 FR2445624 A1 FR 2445624A1
Authority
FR
France
Prior art keywords
layer
glass
ultrasonic vibration
developing
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7931447A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of FR2445624A1 publication Critical patent/FR2445624A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

Procédé de fabrication d'une couche de passivation ayant une configuration déterminée, qui consiste à déposer sur un substrat une couche contenant un verre et un photoresist, à exposer des parties de cette couche à une source lumineuse et à développer la couche exposée à l'aide d'un solvant révélateur, ce procédé étant caracterisé en ce que l'on procède, pendant l'étape de développement, à une agitation du solvant revélateur à l'aide d'ultrasons. Application à la fabrication de dispositifs semi-conducteurs à l'état solide.
FR7931447A 1978-12-26 1979-12-21 Procede de fabrication d'une couche de passivation, notamment pour dispositif electronique semi-conducteur Withdrawn FR2445624A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US97345278A 1978-12-26 1978-12-26

Publications (1)

Publication Number Publication Date
FR2445624A1 true FR2445624A1 (fr) 1980-07-25

Family

ID=25520909

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7931447A Withdrawn FR2445624A1 (fr) 1978-12-26 1979-12-21 Procede de fabrication d'une couche de passivation, notamment pour dispositif electronique semi-conducteur

Country Status (3)

Country Link
FR (1) FR2445624A1 (fr)
PL (1) PL121661B1 (fr)
RO (1) RO76971A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0075537A1 (fr) * 1981-09-17 1983-03-30 Ciba-Geigy Ag Procédé de revêtement de circuits imprimés

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB991759A (en) * 1960-09-14 1965-05-12 Aeroprojects Inc Activating chemical reactions
GB1073758A (en) * 1963-10-08 1967-06-28 Texas Instruments Inc Application of glass to semiconductor devices
US3474718A (en) * 1966-02-08 1969-10-28 Sperry Rand Corp Photosensitive method for depositing thin uniform glass films on substrates

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB991759A (en) * 1960-09-14 1965-05-12 Aeroprojects Inc Activating chemical reactions
GB1073758A (en) * 1963-10-08 1967-06-28 Texas Instruments Inc Application of glass to semiconductor devices
US3474718A (en) * 1966-02-08 1969-10-28 Sperry Rand Corp Photosensitive method for depositing thin uniform glass films on substrates

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0075537A1 (fr) * 1981-09-17 1983-03-30 Ciba-Geigy Ag Procédé de revêtement de circuits imprimés
US4544623A (en) * 1981-09-17 1985-10-01 Ciba-Geigy Corporation Photosensitive coating composition and the use thereof for protective purposes

Also Published As

Publication number Publication date
PL220787A1 (fr) 1980-09-08
RO76971A (fr) 1981-06-22
PL121661B1 (en) 1982-05-31

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Legal Events

Date Code Title Description
ST Notification of lapse