FR2440139A1 - Procede pour realiser des dessins metalliques sur un support isolant - Google Patents

Procede pour realiser des dessins metalliques sur un support isolant

Info

Publication number
FR2440139A1
FR2440139A1 FR7926733A FR7926733A FR2440139A1 FR 2440139 A1 FR2440139 A1 FR 2440139A1 FR 7926733 A FR7926733 A FR 7926733A FR 7926733 A FR7926733 A FR 7926733A FR 2440139 A1 FR2440139 A1 FR 2440139A1
Authority
FR
France
Prior art keywords
copper
insulating support
metal
making metal
treated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7926733A
Other languages
English (en)
Other versions
FR2440139B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of FR2440139A1 publication Critical patent/FR2440139A1/fr
Application granted granted Critical
Publication of FR2440139B1 publication Critical patent/FR2440139B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)

Abstract

L'INVENTION A TRAIT A UN PROCEDE POUR REALISER DES DESSINS METALLIQUES SUR UN SUPPORT ISOLANT. APRES AVOIR FAIT SUBIR AU SUPPORT UN TRAITEMENT PREALABLE ON LE TRAITE PAR UN PHOTOSENSIBILISATEUR SANS MOUILLANTS, ON L'EXPOSE A UNE SOURCE DE RAYONNEMENT, ON MULTIPLIE LES GERMES METALLIQUES PAR ACTION D'UNE SOLUTION AQUEUSE D'UN SEL DE PALLADIUM, ON TRAITE LES GERMES METALLIQUES PAR UN BAIN CAPABLE DE DEPOSER DU NICKEL OU A LA FOIS DU NICKEL DU COBALT PAR VOIE NON GALVANIQUE, ON TRAITE LA COUCHE METALLIQUE AINSI FORMEE PAR UNE SOLUTION AQUEUSE CONTENANT UN COMPLEXANT POUR LE CUIVRE I ET ON DEPOSE DES COUCHES DE CUIVRE AYANT L'EPAISSEUR VOULUE AU MOYEN D'UN BAIN DE CUIVRAGE NON GALVANIQUE. APPLICATION A LA FABRICATION DE CIRCUITS IMPRIMES.#R
FR7926733A 1978-10-27 1979-10-29 Procede pour realiser des dessins metalliques sur un support isolant Granted FR2440139A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782847298 DE2847298A1 (de) 1978-10-27 1978-10-27 Verfahren zur herstellung von metallmustern auf einem isolierenden traegerstoff

Publications (2)

Publication Number Publication Date
FR2440139A1 true FR2440139A1 (fr) 1980-05-23
FR2440139B1 FR2440139B1 (fr) 1983-11-10

Family

ID=6053554

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7926733A Granted FR2440139A1 (fr) 1978-10-27 1979-10-29 Procede pour realiser des dessins metalliques sur un support isolant

Country Status (12)

Country Link
US (1) US4262085A (fr)
JP (1) JPS5562156A (fr)
AT (1) AT376865B (fr)
BE (1) BE879669A (fr)
CH (1) CH645495A5 (fr)
DE (1) DE2847298A1 (fr)
FR (1) FR2440139A1 (fr)
GB (1) GB2037447B (fr)
IT (1) IT1124657B (fr)
NL (1) NL7907420A (fr)
SE (1) SE440440B (fr)
SU (1) SU1179936A3 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0198928A1 (fr) * 1982-03-05 1986-10-29 E.I. Du Pont De Nemours And Company Fabrication d'une plaquette de circuit imprimé à canaux remplis de métal

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0112798B1 (fr) * 1982-11-25 1987-05-13 Ciba-Geigy Ag Mélanges de produits photosensibles et, le cas échéant, réticulés et capables de réactions de condensation ou d'addition, produits de réactions obtenus à partir de ces mélanges et leur application
US4560643A (en) * 1982-11-25 1985-12-24 Ciba Geigy Corporation Use of photosensitive compositions of matter for electroless deposition of metals
JPS60149782A (ja) * 1984-01-17 1985-08-07 Inoue Japax Res Inc 選択的メツキ方法
JPS60149783A (ja) * 1984-01-17 1985-08-07 Inoue Japax Res Inc 選択的メツキ方法
DE3571545D1 (en) * 1984-09-19 1989-08-17 Bayer Ag Method of partially activating a substrate surfaces
US4594311A (en) * 1984-10-29 1986-06-10 Kollmorgen Technologies Corporation Process for the photoselective metallization on non-conductive plastic base materials
JPS62130283A (ja) * 1985-12-02 1987-06-12 Tanaka Kikinzoku Kogyo Kk セラミツク基板へのＣｕコ−テイング方法
US5007990A (en) * 1987-07-10 1991-04-16 Shipley Company Inc. Electroplating process
JPH01119982U (fr) * 1988-02-09 1989-08-14
US5380560A (en) * 1992-07-28 1995-01-10 International Business Machines Corporation Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition
JP2737599B2 (ja) * 1993-04-27 1998-04-08 上村工業株式会社 プリント配線板の銅回路パターン上への無電解めっき方法
US5882736A (en) * 1993-05-13 1999-03-16 Atotech Deutschland Gmbh palladium layers deposition process
US6265075B1 (en) 1999-07-20 2001-07-24 International Business Machines Corporation Circuitized semiconductor structure and method for producing such
US20040126548A1 (en) * 2001-05-28 2004-07-01 Waseda University ULSI wiring and method of manufacturing the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2114562A5 (fr) * 1970-11-11 1972-06-30 Nippon Telegraph & Telephone
FR2147338A1 (fr) * 1971-07-29 1973-03-09 Kollmorgen Corp
FR2147337A1 (fr) * 1971-07-29 1973-03-09 Kollmorgen Corp
US3904783A (en) * 1970-11-11 1975-09-09 Nippon Telegraph & Telephone Method for forming a printed circuit
US3962494A (en) * 1971-07-29 1976-06-08 Photocircuits Division Of Kollmorgan Corporation Sensitized substrates for chemical metallization
US3993802A (en) * 1971-07-29 1976-11-23 Photocircuits Division Of Kollmorgen Corporation Processes and products for making articles for electroless plating

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3942983A (en) * 1967-06-09 1976-03-09 Minnesota Mining And Manufacturing Company Electroless deposition of a non-noble metal on light generated nuclei of a metal more noble than silver
US3959547A (en) * 1971-07-29 1976-05-25 Photocircuits Division Of Kollmorgen Corporation Process for the formation of real images and products produced thereby
US3994727A (en) * 1971-07-29 1976-11-30 Photocircuits Divison Of Kollmorgen Corporation Formation of metal images using reducible non-noble metal salts and light sensitive reducing agents
US3783005A (en) * 1972-02-04 1974-01-01 Western Electric Co Method of depositing a metal on a surface of a nonconductive substrate
US3791340A (en) * 1972-05-15 1974-02-12 Western Electric Co Method of depositing a metal pattern on a surface
US3959523A (en) * 1973-12-14 1976-05-25 Macdermid Incorporated Additive printed circuit boards and method of manufacture
US3950570A (en) * 1974-05-02 1976-04-13 Western Electric Company, Inc. Method of depositing a metal on a surface
US3928670A (en) * 1974-09-23 1975-12-23 Amp Inc Selective plating on non-metallic surfaces
GB1500435A (en) * 1976-03-23 1978-02-08 Canning & Co Ltd W Electroless copper plating solution
US4084023A (en) * 1976-08-16 1978-04-11 Western Electric Company, Inc. Method for depositing a metal on a surface
JPS5355776A (en) * 1976-10-30 1978-05-20 Hitachi Chemical Co Ltd Method of producing printed board terminal
US4096043A (en) * 1977-07-11 1978-06-20 Western Electric Company, Inc. Method of selectively depositing a metal on a surface of a substrate
US4133908A (en) * 1977-11-03 1979-01-09 Western Electric Company, Inc. Method for depositing a metal on a surface

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2114562A5 (fr) * 1970-11-11 1972-06-30 Nippon Telegraph & Telephone
US3904783A (en) * 1970-11-11 1975-09-09 Nippon Telegraph & Telephone Method for forming a printed circuit
FR2147338A1 (fr) * 1971-07-29 1973-03-09 Kollmorgen Corp
FR2147337A1 (fr) * 1971-07-29 1973-03-09 Kollmorgen Corp
US3962494A (en) * 1971-07-29 1976-06-08 Photocircuits Division Of Kollmorgan Corporation Sensitized substrates for chemical metallization
US3993802A (en) * 1971-07-29 1976-11-23 Photocircuits Division Of Kollmorgen Corporation Processes and products for making articles for electroless plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0198928A1 (fr) * 1982-03-05 1986-10-29 E.I. Du Pont De Nemours And Company Fabrication d'une plaquette de circuit imprimé à canaux remplis de métal

Also Published As

Publication number Publication date
JPS6220277B2 (fr) 1987-05-06
GB2037447A (en) 1980-07-09
IT7926809A0 (it) 1979-10-26
SE7908764L (sv) 1980-04-28
ATA691779A (de) 1984-05-15
SE440440B (sv) 1985-07-29
DE2847298C2 (fr) 1989-10-05
CH645495A5 (de) 1984-09-28
JPS5562156A (en) 1980-05-10
FR2440139B1 (fr) 1983-11-10
IT1124657B (it) 1986-05-14
SU1179936A3 (ru) 1985-09-15
GB2037447B (en) 1983-02-09
US4262085A (en) 1981-04-14
DE2847298A1 (de) 1980-05-08
NL7907420A (nl) 1980-04-29
BE879669A (fr) 1980-04-28
AT376865B (de) 1985-01-10

Similar Documents

Publication Publication Date Title
FR2440139A1 (fr) Procede pour realiser des dessins metalliques sur un support isolant
Doré et al. Insulin-like growth factor I protects and rescues hippocampal neurons against β-amyloid-and human amylin-induced toxicity
US4261800A (en) Method of selectively depositing a metal on a surface of a substrate
SE8101066L (sv) Losning och forfarande for elektrokemisk metallisering av dielektrika
JPH01502205A (ja) ポリイミドに銅導体をコーティングする方法
GB1174613A (en) Metallic Connection Layers on Semiconductor Components
US3791340A (en) Method of depositing a metal pattern on a surface
US2827399A (en) Electroless deposition of iron alloys
US3793072A (en) Method of depositing a metal on a surface of a substrate
JPS6214038B2 (fr)
GB1229935A (fr)
CN101960055B (zh) Rf装置的镀覆方法以及用该方法制造的rf装置
CN112626850A (zh) 一种抗菌纤维及其制备方法
GB339339A (en) A process for applying a metal coating to aluminium by galvanic means
SU362070A1 (ru) Способ металлизации диэлектрика
JPS5865730A (ja) プラスチツク部品の部分めつき方法
GB1271453A (en) Process for making a magnetic film element
SU1042752A1 (ru) Способ лечени хронических уретритов у мужчин
JP3216904B2 (ja) 金属層を有する樹脂膜およびその製造方法
Wing Electroless Nickel Rinse Waters Are Treatable
Wagner REACTION OF NON-CYANIDIC METAL COMPLEXES TO CONVENTIONAL DECONTAMINATION OF WASTE WATER FROM ELECTRO-PLATING(DAS VERHALTEN NICHT-CYANIDISCHER METALLKOMPLEXE BEI DER HERKOEMMLICHEN ENTGIFTUNG VON GALVANIKABWAESSERN)
JPS5433236A (en) Electroplating method for tube
Rubinstein Tampon Plating. III.--Pre-Treatment and Processing Technology
JPH041067B2 (fr)
KR880009866A (ko) 물 살균용 은 코팅 활성탄의 제조 방법

Legal Events

Date Code Title Description
ST Notification of lapse