IT7926809A0 - Procedimento di fabbricazione di modelli metallici su un materialedi sopporto isolante. - Google Patents
Procedimento di fabbricazione di modelli metallici su un materialedi sopporto isolante.Info
- Publication number
- IT7926809A0 IT7926809A0 IT7926809A IT2680979A IT7926809A0 IT 7926809 A0 IT7926809 A0 IT 7926809A0 IT 7926809 A IT7926809 A IT 7926809A IT 2680979 A IT2680979 A IT 2680979A IT 7926809 A0 IT7926809 A0 IT 7926809A0
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- support material
- insulating support
- manufacturing metal
- metal models
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000463 material Substances 0.000 title 1
- 239000002184 metal Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19782847298 DE2847298A1 (de) | 1978-10-27 | 1978-10-27 | Verfahren zur herstellung von metallmustern auf einem isolierenden traegerstoff |
Publications (2)
Publication Number | Publication Date |
---|---|
IT7926809A0 true IT7926809A0 (it) | 1979-10-26 |
IT1124657B IT1124657B (it) | 1986-05-14 |
Family
ID=6053554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT26809/79A IT1124657B (it) | 1978-10-27 | 1979-10-26 | Procedimento di fabbricazione di modelli metallici su un materiale di sopporto isolfante |
Country Status (12)
Country | Link |
---|---|
US (1) | US4262085A (it) |
JP (1) | JPS5562156A (it) |
AT (1) | AT376865B (it) |
BE (1) | BE879669A (it) |
CH (1) | CH645495A5 (it) |
DE (1) | DE2847298A1 (it) |
FR (1) | FR2440139A1 (it) |
GB (1) | GB2037447B (it) |
IT (1) | IT1124657B (it) |
NL (1) | NL7907420A (it) |
SE (1) | SE440440B (it) |
SU (1) | SU1179936A3 (it) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4532152A (en) * | 1982-03-05 | 1985-07-30 | Elarde Vito D | Fabrication of a printed circuit board with metal-filled channels |
US4560643A (en) * | 1982-11-25 | 1985-12-24 | Ciba Geigy Corporation | Use of photosensitive compositions of matter for electroless deposition of metals |
DE3371573D1 (en) * | 1982-11-25 | 1987-06-19 | Ciba Geigy Ag | Light-sensitive and possibly cross-linkable mixture of compounds apt to condensation and addition reactions, reaction products obtained thereby and use thereof |
JPS60149783A (ja) * | 1984-01-17 | 1985-08-07 | Inoue Japax Res Inc | 選択的メツキ方法 |
JPS60149782A (ja) * | 1984-01-17 | 1985-08-07 | Inoue Japax Res Inc | 選択的メツキ方法 |
EP0175253B1 (de) * | 1984-09-19 | 1989-07-12 | Bayer Ag | Verfahren zur partiellen Aktivierung von Substratoberflächen |
US4594311A (en) * | 1984-10-29 | 1986-06-10 | Kollmorgen Technologies Corporation | Process for the photoselective metallization on non-conductive plastic base materials |
JPS62130283A (ja) * | 1985-12-02 | 1987-06-12 | Tanaka Kikinzoku Kogyo Kk | セラミツク基板へのCuコ−テイング方法 |
US5007990A (en) * | 1987-07-10 | 1991-04-16 | Shipley Company Inc. | Electroplating process |
JPH01119982U (it) * | 1988-02-09 | 1989-08-14 | ||
US5380560A (en) * | 1992-07-28 | 1995-01-10 | International Business Machines Corporation | Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition |
JP2737599B2 (ja) * | 1993-04-27 | 1998-04-08 | 上村工業株式会社 | プリント配線板の銅回路パターン上への無電解めっき方法 |
US5882736A (en) * | 1993-05-13 | 1999-03-16 | Atotech Deutschland Gmbh | palladium layers deposition process |
US6265075B1 (en) | 1999-07-20 | 2001-07-24 | International Business Machines Corporation | Circuitized semiconductor structure and method for producing such |
US20040126548A1 (en) * | 2001-05-28 | 2004-07-01 | Waseda University | ULSI wiring and method of manufacturing the same |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3942983A (en) * | 1967-06-09 | 1976-03-09 | Minnesota Mining And Manufacturing Company | Electroless deposition of a non-noble metal on light generated nuclei of a metal more noble than silver |
GB1338497A (en) * | 1970-11-11 | 1973-11-21 | Nippon Telegraph & Telephone | Photochemical method for forming a metal image |
US3904783A (en) * | 1970-11-11 | 1975-09-09 | Nippon Telegraph & Telephone | Method for forming a printed circuit |
CA968908A (en) * | 1971-07-29 | 1975-06-10 | Photocircuits Division Of Kollmorgen Corporation | Sensitized substrates for chemical metallization |
US3772056A (en) * | 1971-07-29 | 1973-11-13 | Kollmorgen Photocircuits | Sensitized substrates for chemical metallization |
US3959547A (en) * | 1971-07-29 | 1976-05-25 | Photocircuits Division Of Kollmorgen Corporation | Process for the formation of real images and products produced thereby |
US3993802A (en) * | 1971-07-29 | 1976-11-23 | Photocircuits Division Of Kollmorgen Corporation | Processes and products for making articles for electroless plating |
US3994727A (en) * | 1971-07-29 | 1976-11-30 | Photocircuits Divison Of Kollmorgen Corporation | Formation of metal images using reducible non-noble metal salts and light sensitive reducing agents |
US3962494A (en) * | 1971-07-29 | 1976-06-08 | Photocircuits Division Of Kollmorgan Corporation | Sensitized substrates for chemical metallization |
US3783005A (en) * | 1972-02-04 | 1974-01-01 | Western Electric Co | Method of depositing a metal on a surface of a nonconductive substrate |
US3791340A (en) * | 1972-05-15 | 1974-02-12 | Western Electric Co | Method of depositing a metal pattern on a surface |
US3959523A (en) * | 1973-12-14 | 1976-05-25 | Macdermid Incorporated | Additive printed circuit boards and method of manufacture |
US3950570A (en) * | 1974-05-02 | 1976-04-13 | Western Electric Company, Inc. | Method of depositing a metal on a surface |
US3928670A (en) * | 1974-09-23 | 1975-12-23 | Amp Inc | Selective plating on non-metallic surfaces |
GB1500435A (en) * | 1976-03-23 | 1978-02-08 | Canning & Co Ltd W | Electroless copper plating solution |
US4084023A (en) * | 1976-08-16 | 1978-04-11 | Western Electric Company, Inc. | Method for depositing a metal on a surface |
JPS5355776A (en) * | 1976-10-30 | 1978-05-20 | Hitachi Chemical Co Ltd | Method of producing printed board terminal |
US4096043A (en) * | 1977-07-11 | 1978-06-20 | Western Electric Company, Inc. | Method of selectively depositing a metal on a surface of a substrate |
US4133908A (en) * | 1977-11-03 | 1979-01-09 | Western Electric Company, Inc. | Method for depositing a metal on a surface |
-
1978
- 1978-10-27 DE DE19782847298 patent/DE2847298A1/de active Granted
-
1979
- 1979-10-05 NL NL7907420A patent/NL7907420A/nl unknown
- 1979-10-18 SU SU792835379A patent/SU1179936A3/ru active
- 1979-10-23 SE SE7908764A patent/SE440440B/sv not_active IP Right Cessation
- 1979-10-24 AT AT0691779A patent/AT376865B/de not_active IP Right Cessation
- 1979-10-25 CH CH959579A patent/CH645495A5/de not_active IP Right Cessation
- 1979-10-26 BE BE0/197845A patent/BE879669A/fr not_active IP Right Cessation
- 1979-10-26 GB GB7937212A patent/GB2037447B/en not_active Expired
- 1979-10-26 IT IT26809/79A patent/IT1124657B/it active
- 1979-10-26 US US06/088,591 patent/US4262085A/en not_active Expired - Lifetime
- 1979-10-26 JP JP13789579A patent/JPS5562156A/ja active Granted
- 1979-10-29 FR FR7926733A patent/FR2440139A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
SE7908764L (sv) | 1980-04-28 |
GB2037447A (en) | 1980-07-09 |
NL7907420A (nl) | 1980-04-29 |
BE879669A (fr) | 1980-04-28 |
FR2440139A1 (fr) | 1980-05-23 |
DE2847298A1 (de) | 1980-05-08 |
FR2440139B1 (it) | 1983-11-10 |
GB2037447B (en) | 1983-02-09 |
SU1179936A3 (ru) | 1985-09-15 |
DE2847298C2 (it) | 1989-10-05 |
IT1124657B (it) | 1986-05-14 |
SE440440B (sv) | 1985-07-29 |
US4262085A (en) | 1981-04-14 |
AT376865B (de) | 1985-01-10 |
JPS5562156A (en) | 1980-05-10 |
CH645495A5 (de) | 1984-09-28 |
ATA691779A (de) | 1984-05-15 |
JPS6220277B2 (it) | 1987-05-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NL7811113A (nl) | Voorwerpdrager. | |
NO152976C (no) | Fremgangsmaate for fremstilling av interferon. | |
DK339379A (da) | Elektrisk stegepande | |
IT7926809A0 (it) | Procedimento di fabbricazione di modelli metallici su un materialedi sopporto isolante. | |
NO149218C (no) | Ekspansjonsplugg for bakomgripende befestigelse. | |
IT7921602A0 (it) | Metodo di connessione. | |
NL189825C (nl) | Werkwijze voor het vervaardigen van uit metaal bestaande kernelementen. | |
IT7945716A0 (it) | Mezzi di posizionamento per un interruttore elettrico. | |
NO153705C (no) | Elektrisk tennanordning. | |
NL7901497A (nl) | Ijzer-nikkel-chroomlegeringen. | |
ES242568Y (es) | Enrejado metalico. | |
NL7900468A (nl) | Zeolietadsorbens alsmede werkwijze ter vervaardiging daarvan. | |
IT7919845A0 (it) | Apparato di spurgo. | |
IT7919811A0 (it) | Metodo per preparare un refrattario isolante. | |
TR20396A (tr) | Zamanli komuetasyon sebekesi icin kontrol tertibati | |
NL7900604A (nl) | Schakeling voor bepaling van een tijdstip. | |
IT7927685A0 (it) | Procedimento per produrre corpi sagomati metallici. | |
IT7923033A0 (it) | Contatto elettrico e metodo per lasua fabbricazione. | |
NL7613327A (nl) | Ontsluitingsprocede voor biomaterialen. | |
ES242702Y (es) | Un rele electromagnetico. | |
NL7901053A (nl) | Elektronisch uurwerk. | |
NL7714429A (nl) | Werkwijze ter vervaardiging van een orthope- disch steunmateriaal. | |
NL7901021A (nl) | Elektrisch onderdeel. | |
NL7804038A (nl) | Elektronenmikroskoop. | |
ES233588Y (es) | Teclado para telefonos. |