GB1500435A - Electroless copper plating solution - Google Patents

Electroless copper plating solution

Info

Publication number
GB1500435A
GB1500435A GB1441275A GB1441275A GB1500435A GB 1500435 A GB1500435 A GB 1500435A GB 1441275 A GB1441275 A GB 1441275A GB 1441275 A GB1441275 A GB 1441275A GB 1500435 A GB1500435 A GB 1500435A
Authority
GB
United Kingdom
Prior art keywords
examples
plating solution
edta
formaldehyde
given
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1441275A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Europe Ltd
Original Assignee
W Canning PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by W Canning PLC filed Critical W Canning PLC
Priority to GB1441275A priority Critical patent/GB1500435A/en
Publication of GB1500435A publication Critical patent/GB1500435A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

1500435 Stabilizers for electroless copperplating baths W CANNING Ltd 23 March 1976 [8 April 1975] 14412/75 Heading C7F An alkaline electroless Cu-plating solution contains cupric ions, a hydroxide, a complexing agent, formaldehyde, and, as a stabilizer, telluric or tellurous acid or a salt thereof. Examples are given of solutions containing CuSO 4 .5H 2 O, formaldehyde and NaOH, with telluric acid (Examples 1 and 2), sodium tellurate (Example 3) ammonium tellurate (Example 4) and potassium tellurite (Example 5), and as complexing agent Rochelle salt (Example 1), EDTA Na 2 (Examples 2, 5), Rochelle salt/EDTA Na 2 (Example 3), trisodium nitrilotriacetate (Example 4). Examples are also given of concentrates for making up or replenishing the solutions. The plating of surfaces of ABS panels or copperclad boards, after activation with a colloidal Pd suspension, is referred to.
GB1441275A 1976-03-23 1976-03-23 Electroless copper plating solution Expired GB1500435A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1441275A GB1500435A (en) 1976-03-23 1976-03-23 Electroless copper plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1441275A GB1500435A (en) 1976-03-23 1976-03-23 Electroless copper plating solution

Publications (1)

Publication Number Publication Date
GB1500435A true GB1500435A (en) 1978-02-08

Family

ID=10040743

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1441275A Expired GB1500435A (en) 1976-03-23 1976-03-23 Electroless copper plating solution

Country Status (1)

Country Link
GB (1) GB1500435A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4262085A (en) * 1978-10-27 1981-04-14 Schering Aktiengesellschaft Process for preparation of metal patterns on insulating carrier materials

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4262085A (en) * 1978-10-27 1981-04-14 Schering Aktiengesellschaft Process for preparation of metal patterns on insulating carrier materials

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee