FR2428274A1 - Appareil et procede d'alignement a haute resolution, notamment pour la realisation de dispositifs semi-conducteurs miniatures - Google Patents
Appareil et procede d'alignement a haute resolution, notamment pour la realisation de dispositifs semi-conducteurs miniaturesInfo
- Publication number
- FR2428274A1 FR2428274A1 FR7914228A FR7914228A FR2428274A1 FR 2428274 A1 FR2428274 A1 FR 2428274A1 FR 7914228 A FR7914228 A FR 7914228A FR 7914228 A FR7914228 A FR 7914228A FR 2428274 A1 FR2428274 A1 FR 2428274A1
- Authority
- FR
- France
- Prior art keywords
- semiconductor devices
- production
- high resolution
- alignment apparatus
- configuration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7049—Technique, e.g. interferometric
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/975—Substrate or mask aligning feature
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
L'invention concerne un appareil et un procédé d'alignement précis d'un masque et d'un substrat par moirage produit par superposition des réseaux de diffraction. Les réseaux comprennent des première et seconde configurations composés respectivement de lignes et espaces horizontaux et verticaux. La première configuration comprend des lignes horizontales et verticales d'une seconde largeur qui diffère de celle des lignes de la première configuration d'une faible quantité DELTA . Les configurations sont superposées pour obtenir un moirage. L'alignement assure une configuration symétrique. Applications dans la fabrication de dispositifs semi-conducteurs sub-micrométriques.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/912,612 US4193687A (en) | 1978-06-05 | 1978-06-05 | High resolution alignment technique and apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2428274A1 true FR2428274A1 (fr) | 1980-01-04 |
Family
ID=25432186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7914228A Withdrawn FR2428274A1 (fr) | 1978-06-05 | 1979-06-01 | Appareil et procede d'alignement a haute resolution, notamment pour la realisation de dispositifs semi-conducteurs miniatures |
Country Status (8)
Country | Link |
---|---|
US (1) | US4193687A (fr) |
JP (1) | JPS598058B2 (fr) |
CA (1) | CA1119396A (fr) |
DE (1) | DE2922017A1 (fr) |
FR (1) | FR2428274A1 (fr) |
GB (1) | GB2022289B (fr) |
IT (1) | IT1118102B (fr) |
NL (1) | NL7903676A (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5612172A (en) * | 1979-07-11 | 1981-02-06 | Ricoh Co Ltd | Mark for adjusting degree of balance of installation of solid scanning element |
US4691434A (en) * | 1982-02-19 | 1987-09-08 | Lasarray Holding Ag | Method of making electrically conductive regions in monolithic semiconductor devices as applied to a semiconductor device |
US4388386A (en) * | 1982-06-07 | 1983-06-14 | International Business Machines Corporation | Mask set mismatch |
US4536239A (en) * | 1983-07-18 | 1985-08-20 | Nicolet Instrument Corporation | Multi-layer circuit board inspection system |
US4568189A (en) * | 1983-09-26 | 1986-02-04 | The United States Of America As Represented By The Secretary Of The Navy | Apparatus and method for aligning a mask and wafer in the fabrication of integrated circuits |
DE3336901A1 (de) * | 1983-10-11 | 1985-04-18 | Deutsche Itt Industries Gmbh, 7800 Freiburg | Maskenmarkierung und substratmarkierung fuer ein verfahren zum justieren einer eine maskenmarkierung enthaltenden photomaske auf einer substratmarkierung |
JPH0732242B2 (ja) * | 1984-12-24 | 1995-04-10 | 株式会社日立製作所 | 固体撮像装置の製造方法 |
DE3530439A1 (de) * | 1985-08-26 | 1987-02-26 | Siemens Ag | Vorrichtung zum justieren einer mit mindestens einer justiermarke versehenen maske bezueglich eines mit mindestens einer gitterstruktur versehenen halbleiterwafers |
GB8528826D0 (en) * | 1985-11-22 | 1985-12-24 | Gen Electric Co Plc | Alignment techniques |
US4814626A (en) * | 1985-12-13 | 1989-03-21 | Siemens Aktiengesellschaft | Method for high precision position measurement of two-dimensional structures |
JP3200894B2 (ja) * | 1991-03-05 | 2001-08-20 | 株式会社日立製作所 | 露光方法及びその装置 |
KR0144082B1 (ko) * | 1994-04-01 | 1998-08-17 | 김주용 | 레티클 및 그 레티클을 사용한 가림막 세팅 방법 |
US6150231A (en) * | 1998-06-15 | 2000-11-21 | Siemens Aktiengesellschaft | Overlay measurement technique using moire patterns |
DE10142318C1 (de) * | 2001-08-30 | 2003-01-30 | Advanced Micro Devices Inc | Halbleiterstruktur und Verfahren zur Bestimmung kritischer Dimensionen und Überlagerungsfehler |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3690881A (en) * | 1970-09-28 | 1972-09-12 | Bell Telephone Labor Inc | Moire pattern aligning of photolithographic mask |
US3783520A (en) * | 1970-09-28 | 1974-01-08 | Bell Telephone Labor Inc | High accuracy alignment procedure utilizing moire patterns |
DE2326059A1 (de) * | 1972-05-22 | 1974-03-14 | Hitachi Ltd | Verfahren und maske zum ausrichten von mustern |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3688570A (en) * | 1970-06-05 | 1972-09-05 | Polaroid Corp | Angular deflection meter |
US3806254A (en) * | 1971-12-08 | 1974-04-23 | Information Storage Systems | Agc servo system having error signal responsive to a non-extinguishable intensity light energy signal |
DE2521618B1 (de) * | 1975-05-15 | 1976-03-11 | Zeiss Carl Fa | Vorrichtung zum Messen oder Einstellen von zweidimensionalen Lagekoordinaten |
JPS5212064A (en) * | 1975-07-15 | 1977-01-29 | Seiko Epson Corp | Blade exchangeable razor |
JPS5215510A (en) * | 1975-07-28 | 1977-02-05 | Nippon Chemical Ind | Optical glass |
US4047585A (en) * | 1976-03-08 | 1977-09-13 | Pitney-Bowes, Inc. | Scale optical detector with spring constant variation compensator |
-
1978
- 1978-06-05 US US05/912,612 patent/US4193687A/en not_active Expired - Lifetime
-
1979
- 1979-04-30 CA CA000326684A patent/CA1119396A/fr not_active Expired
- 1979-05-10 NL NL7903676A patent/NL7903676A/xx not_active Application Discontinuation
- 1979-05-30 JP JP54067408A patent/JPS598058B2/ja not_active Expired
- 1979-05-30 DE DE19792922017 patent/DE2922017A1/de not_active Ceased
- 1979-06-01 FR FR7914228A patent/FR2428274A1/fr not_active Withdrawn
- 1979-06-04 IT IT49289/79A patent/IT1118102B/it active
- 1979-06-05 GB GB7919605A patent/GB2022289B/en not_active Expired
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3690881A (en) * | 1970-09-28 | 1972-09-12 | Bell Telephone Labor Inc | Moire pattern aligning of photolithographic mask |
US3783520A (en) * | 1970-09-28 | 1974-01-08 | Bell Telephone Labor Inc | High accuracy alignment procedure utilizing moire patterns |
DE2326059A1 (de) * | 1972-05-22 | 1974-03-14 | Hitachi Ltd | Verfahren und maske zum ausrichten von mustern |
Also Published As
Publication number | Publication date |
---|---|
GB2022289B (en) | 1983-04-27 |
US4193687A (en) | 1980-03-18 |
NL7903676A (nl) | 1979-12-07 |
GB2022289A (en) | 1979-12-12 |
IT7949289A0 (it) | 1979-06-04 |
IT1118102B (it) | 1986-02-24 |
DE2922017A1 (de) | 1979-12-06 |
JPS54159878A (en) | 1979-12-18 |
JPS598058B2 (ja) | 1984-02-22 |
CA1119396A (fr) | 1982-03-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |