FR2343828A1 - Bains galvaniques acides de cuivrage - Google Patents
Bains galvaniques acides de cuivrageInfo
- Publication number
- FR2343828A1 FR2343828A1 FR7707251A FR7707251A FR2343828A1 FR 2343828 A1 FR2343828 A1 FR 2343828A1 FR 7707251 A FR7707251 A FR 7707251A FR 7707251 A FR7707251 A FR 7707251A FR 2343828 A1 FR2343828 A1 FR 2343828A1
- Authority
- FR
- France
- Prior art keywords
- acid
- thiourea
- bath
- deriv
- electroplating bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19762610705 DE2610705C3 (de) | 1976-03-13 | 1976-03-13 | Saure galvanische Kupferbäder |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2343828A1 true FR2343828A1 (fr) | 1977-10-07 |
FR2343828B1 FR2343828B1 (fr) | 1980-02-08 |
Family
ID=5972410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7707251A Granted FR2343828A1 (fr) | 1976-03-13 | 1977-03-11 | Bains galvaniques acides de cuivrage |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE2610705C3 (fr) |
FR (1) | FR2343828A1 (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6776893B1 (en) * | 2000-11-20 | 2004-08-17 | Enthone Inc. | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect |
US8002962B2 (en) | 2002-03-05 | 2011-08-23 | Enthone Inc. | Copper electrodeposition in microelectronics |
US7316772B2 (en) | 2002-03-05 | 2008-01-08 | Enthone Inc. | Defect reduction in electrodeposited copper for semiconductor applications |
TW200632147A (fr) | 2004-11-12 | 2006-09-16 | ||
US7905994B2 (en) | 2007-10-03 | 2011-03-15 | Moses Lake Industries, Inc. | Substrate holder and electroplating system |
US8262894B2 (en) | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
WO2011064734A1 (fr) | 2009-11-30 | 2011-06-03 | Basf Se | Procédé d'enlèvement d'une couche de matière de base d'un substrat, et agent de polissage chimico-mécanique approprié pour cette tâche |
CN102648258B (zh) | 2009-11-30 | 2015-04-08 | 巴斯夫欧洲公司 | 从衬底去除本体材料层的方法以及适于该方法的化学机械抛光剂 |
SG10201606566SA (en) | 2010-09-08 | 2016-09-29 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films |
WO2012032466A1 (fr) | 2010-09-08 | 2012-03-15 | Basf Se | Compositions de polissage aqueuses contenant des dioxydes de diazénium n-substitués et/ou des sels d'oxyde de n'-hydroxy-diazénium |
JP6196155B2 (ja) | 2010-09-08 | 2017-09-13 | ビーエーエスエフ ソシエタス・ヨーロピアBasf Se | 水性研磨剤組成物、並びに電気、機械及び光学デバイス用の基板材料を研磨する方法 |
MY158489A (en) | 2010-10-07 | 2016-10-14 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers |
JP6096670B2 (ja) | 2010-12-10 | 2017-03-15 | ビーエーエスエフ ソシエタス・ヨーロピアBasf Se | 酸化ケイ素誘電体膜およびポリシリコン膜を含有する基板を化学的機械的に研磨するための水性研磨組成物および方法 |
WO2012123839A1 (fr) | 2011-03-11 | 2012-09-20 | Basf Se | Procédé pour la formation de trous d'interconnexion à travers la tranche de base |
-
1976
- 1976-03-13 DE DE19762610705 patent/DE2610705C3/de not_active Expired
-
1977
- 1977-03-11 FR FR7707251A patent/FR2343828A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
DE2610705C3 (de) | 1978-10-19 |
FR2343828B1 (fr) | 1980-02-08 |
DE2610705A1 (de) | 1977-09-22 |
DE2610705B2 (de) | 1978-02-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property | ||
ST | Notification of lapse |