FR2343828B1 - - Google Patents
Info
- Publication number
- FR2343828B1 FR2343828B1 FR7707251A FR7707251A FR2343828B1 FR 2343828 B1 FR2343828 B1 FR 2343828B1 FR 7707251 A FR7707251 A FR 7707251A FR 7707251 A FR7707251 A FR 7707251A FR 2343828 B1 FR2343828 B1 FR 2343828B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19762610705 DE2610705C3 (de) | 1976-03-13 | 1976-03-13 | Saure galvanische Kupferbäder |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2343828A1 FR2343828A1 (fr) | 1977-10-07 |
FR2343828B1 true FR2343828B1 (fr) | 1980-02-08 |
Family
ID=5972410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7707251A Granted FR2343828A1 (fr) | 1976-03-13 | 1977-03-11 | Bains galvaniques acides de cuivrage |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE2610705C3 (fr) |
FR (1) | FR2343828A1 (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6776893B1 (en) * | 2000-11-20 | 2004-08-17 | Enthone Inc. | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect |
US7316772B2 (en) | 2002-03-05 | 2008-01-08 | Enthone Inc. | Defect reduction in electrodeposited copper for semiconductor applications |
US8002962B2 (en) | 2002-03-05 | 2011-08-23 | Enthone Inc. | Copper electrodeposition in microelectronics |
TW200632147A (fr) | 2004-11-12 | 2006-09-16 | ||
US7905994B2 (en) | 2007-10-03 | 2011-03-15 | Moses Lake Industries, Inc. | Substrate holder and electroplating system |
US8262894B2 (en) | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
WO2011064735A1 (fr) | 2009-11-30 | 2011-06-03 | Basf Se | Procédé d'enlèvement d'une couche de matière en vrac d'un substrat, et agent de polissage chimico-mécanique approprié pour cette tâche |
EP2507824A4 (fr) | 2009-11-30 | 2013-09-25 | Basf Se | Procédé d'enlèvement d'une couche de matière de base d'un substrat, et agent de polissage chimico-mécanique approprié pour cette tâche |
MY175638A (en) | 2010-09-08 | 2020-07-03 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectic and polysilicon films. |
CN103210047B (zh) | 2010-09-08 | 2018-07-17 | 巴斯夫欧洲公司 | 含n取代的二氮烯*二氧化物和/或n’-羟基-二氮烯*氧化物盐的含水抛光组合物 |
MY164859A (en) | 2010-09-08 | 2018-01-30 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices |
MY158489A (en) | 2010-10-07 | 2016-10-14 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers |
EP2649144A4 (fr) | 2010-12-10 | 2014-05-14 | Basf Se | Composition de polissage aqueuse et procédé de polissage mécano-chimique de substrats contenant un diélectrique en oxyde de silicium et des films en polysilicium |
US9496146B2 (en) | 2011-03-11 | 2016-11-15 | Basf Se | Method for forming through-base wafer vias |
-
1976
- 1976-03-13 DE DE19762610705 patent/DE2610705C3/de not_active Expired
-
1977
- 1977-03-11 FR FR7707251A patent/FR2343828A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
DE2610705C3 (de) | 1978-10-19 |
DE2610705A1 (de) | 1977-09-22 |
DE2610705B2 (de) | 1978-02-02 |
FR2343828A1 (fr) | 1977-10-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property | ||
ST | Notification of lapse |