FR2316737A1 - Echangeur de chaleur pour circuits electroniques - Google Patents

Echangeur de chaleur pour circuits electroniques

Info

Publication number
FR2316737A1
FR2316737A1 FR7620158A FR7620158A FR2316737A1 FR 2316737 A1 FR2316737 A1 FR 2316737A1 FR 7620158 A FR7620158 A FR 7620158A FR 7620158 A FR7620158 A FR 7620158A FR 2316737 A1 FR2316737 A1 FR 2316737A1
Authority
FR
France
Prior art keywords
heat exchanger
electronic circuits
circuits
electronic
exchanger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7620158A
Other languages
English (en)
Other versions
FR2316737B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull HN Information Systems Italia SpA
Bull HN Information Systems Inc
Original Assignee
Honeywell Information Systems Italia SpA
Honeywell Information Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Information Systems Italia SpA, Honeywell Information Systems Inc filed Critical Honeywell Information Systems Italia SpA
Publication of FR2316737A1 publication Critical patent/FR2316737A1/fr
Application granted granted Critical
Publication of FR2316737B1 publication Critical patent/FR2316737B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00—Heat exchange conduits
    • F28F2210/02—Heat exchange conduits with particular branching, e.g. fractal conduit arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/044—Heat exchange having flexible heat exchange surface conforming to a solid structure, e.g. applicator
    • Y10S165/047—Heat exchange having flexible heat exchange surface conforming to a solid structure, e.g. applicator for cooling
    • Y10S165/048—Electrical component
FR7620158A 1975-07-02 1976-07-01 Echangeur de chaleur pour circuits electroniques Granted FR2316737A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/592,578 US4072188A (en) 1975-07-02 1975-07-02 Fluid cooling systems for electronic systems

Publications (2)

Publication Number Publication Date
FR2316737A1 true FR2316737A1 (fr) 1977-01-28
FR2316737B1 FR2316737B1 (fr) 1980-07-18

Family

ID=24371251

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7620158A Granted FR2316737A1 (fr) 1975-07-02 1976-07-01 Echangeur de chaleur pour circuits electroniques

Country Status (4)

Country Link
US (2) US4072188A (fr)
JP (1) JPS528776A (fr)
FR (1) FR2316737A1 (fr)
GB (1) GB1517650A (fr)

Cited By (8)

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FR2574615A1 (fr) * 1984-12-11 1986-06-13 Silicium Semiconducteur Ssc Boitier pour composant de puissance haute-frequence refroidi par circulation d'eau
EP0225108A1 (fr) * 1985-11-19 1987-06-10 Nec Corporation Sytème de refroidissement par liquide pour puces de circuit intégré
EP0236065A2 (fr) * 1986-02-25 1987-09-09 Nec Corporation Système de refroidissement par liquide pour puces à circuit intégré
WO1989003590A1 (fr) * 1987-10-13 1989-04-20 Unisys Corporation Ensemble de refroidissement par liquide a alignement automatique
EP0516280A1 (fr) * 1991-05-31 1992-12-02 Minnesota Mining And Manufacturing Company Dispositifs semi-rigides de transmission de chaleur
EP0616366A2 (fr) * 1993-03-19 1994-09-21 Fujitsu Limited Dissipateur thermique et structure d'assemblage associée
EP3344025A1 (fr) * 2016-12-29 2018-07-04 EKWB d.o.o. Élément de refroidissement à base de fluide pour refroidir un élément générateur de chaleur disposé sur une carte de circuit imprimé

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JPS528776A (en) 1977-01-22
US4072188A (en) 1978-02-07
FR2316737B1 (fr) 1980-07-18
AU1456476A (en) 1977-12-08
GB1517650A (en) 1978-07-12
US4109707A (en) 1978-08-29

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