GB2574632B - Heat sink arrangement for immersion cooling - Google Patents

Heat sink arrangement for immersion cooling Download PDF

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Publication number
GB2574632B
GB2574632B GB1809681.8A GB201809681A GB2574632B GB 2574632 B GB2574632 B GB 2574632B GB 201809681 A GB201809681 A GB 201809681A GB 2574632 B GB2574632 B GB 2574632B
Authority
GB
United Kingdom
Prior art keywords
heat sink
immersion cooling
sink arrangement
arrangement
immersion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1809681.8A
Other versions
GB2574632A (en
GB201809681D0 (en
Inventor
Amos David
Edmunds Neil
Young Andrew
Kidger Jasper
Longhurst Nathan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iceotope Group Ltd
Original Assignee
Iceotope Group Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iceotope Group Ltd filed Critical Iceotope Group Ltd
Priority to GB1809681.8A priority Critical patent/GB2574632B/en
Publication of GB201809681D0 publication Critical patent/GB201809681D0/en
Priority to JP2020513520A priority patent/JP7183257B2/en
Priority to KR1020237018651A priority patent/KR102639521B1/en
Priority to EP23153461.1A priority patent/EP4203016A1/en
Priority to TW113106779A priority patent/TW202428114A/en
Priority to PCT/GB2018/052526 priority patent/WO2019048864A1/en
Priority to IL273104A priority patent/IL273104B2/en
Priority to KR1020207009009A priority patent/KR102541199B1/en
Priority to CN201880058136.4A priority patent/CN111095541B/en
Priority to EP18769441.9A priority patent/EP3679603B1/en
Priority to US16/645,166 priority patent/US11096313B2/en
Priority to TW111142513A priority patent/TWI836706B/en
Priority to IL308679A priority patent/IL308679A/en
Priority to TW107131329A priority patent/TWI786175B/en
Priority to KR1020237018653A priority patent/KR102640723B1/en
Priority to EP23153453.8A priority patent/EP4199076A1/en
Priority to ES18769441T priority patent/ES2943656T3/en
Priority to CN202111385072.9A priority patent/CN114375131A/en
Publication of GB2574632A publication Critical patent/GB2574632A/en
Publication of GB2574632B publication Critical patent/GB2574632B/en
Application granted granted Critical
Priority to US17/354,781 priority patent/US11470739B2/en
Priority to US17/354,769 priority patent/US11369040B2/en
Priority to US17/678,387 priority patent/US11653472B2/en
Priority to US17/902,747 priority patent/US11596082B2/en
Priority to JP2022186574A priority patent/JP2023029880A/en
Priority to JP2022186573A priority patent/JP7555385B2/en
Priority to US18/122,449 priority patent/US20230240042A1/en
Priority to US18/122,431 priority patent/US11968802B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB1809681.8A 2017-09-06 2018-06-13 Heat sink arrangement for immersion cooling Active GB2574632B (en)

Priority Applications (26)

Application Number Priority Date Filing Date Title
GB1809681.8A GB2574632B (en) 2018-06-13 2018-06-13 Heat sink arrangement for immersion cooling
KR1020237018653A KR102640723B1 (en) 2017-09-06 2018-09-06 Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling
ES18769441T ES2943656T3 (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
KR1020237018651A KR102639521B1 (en) 2017-09-06 2018-09-06 Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling
TW113106779A TW202428114A (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
PCT/GB2018/052526 WO2019048864A1 (en) 2017-09-06 2018-09-06 Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling
IL273104A IL273104B2 (en) 2017-09-06 2018-09-06 Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling
KR1020207009009A KR102541199B1 (en) 2017-09-06 2018-09-06 Heat sinks, heat sink arrays and modules for immersion cooling
CN201880058136.4A CN111095541B (en) 2017-09-06 2018-09-06 Heat sink, heat sink device and module for liquid immersion cooling
EP18769441.9A EP3679603B1 (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
US16/645,166 US11096313B2 (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
TW111142513A TWI836706B (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
IL308679A IL308679A (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
TW107131329A TWI786175B (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
JP2020513520A JP7183257B2 (en) 2017-09-06 2018-09-06 Immersion cooling heat sinks, heat sink devices and modules
EP23153453.8A EP4199076A1 (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
EP23153461.1A EP4203016A1 (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
CN202111385072.9A CN114375131A (en) 2017-09-06 2018-09-06 Heat sink, heat sink device and module for liquid immersion cooling
US17/354,769 US11369040B2 (en) 2017-09-06 2021-06-22 Heat sink, heat sink arrangement and module for liquid immersion cooling
US17/354,781 US11470739B2 (en) 2017-09-06 2021-06-22 Heat sink, heat sink arrangement and module for liquid immersion cooling
US17/678,387 US11653472B2 (en) 2017-09-06 2022-02-23 Heat sink, heat sink arrangement and module for liquid immersion cooling
US17/902,747 US11596082B2 (en) 2017-09-06 2022-09-02 Heat sink, heat sink arrangement and module for liquid immersion cooling
JP2022186573A JP7555385B2 (en) 2017-09-06 2022-11-22 Cooling Module
JP2022186574A JP2023029880A (en) 2017-09-06 2022-11-22 cooling module
US18/122,449 US20230240042A1 (en) 2017-09-06 2023-03-16 Heat sink, heat sink arrangement and module for liquid immersion cooling
US18/122,431 US11968802B2 (en) 2017-09-06 2023-03-16 Heat sink, heat sink arrangement and module for liquid immersion cooling

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1809681.8A GB2574632B (en) 2018-06-13 2018-06-13 Heat sink arrangement for immersion cooling

Publications (3)

Publication Number Publication Date
GB201809681D0 GB201809681D0 (en) 2018-08-01
GB2574632A GB2574632A (en) 2019-12-18
GB2574632B true GB2574632B (en) 2020-07-15

Family

ID=63042169

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1809681.8A Active GB2574632B (en) 2017-09-06 2018-06-13 Heat sink arrangement for immersion cooling

Country Status (1)

Country Link
GB (1) GB2574632B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11924998B2 (en) 2021-04-01 2024-03-05 Ovh Hybrid immersion cooling system for rack-mounted electronic assemblies
US12120846B2 (en) 2021-04-01 2024-10-15 Ovh Immersion cooling systems for electronic components

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110290677B (en) * 2019-06-06 2024-04-26 深圳绿色云图科技有限公司 Liquid immersion type cooling cabinet
KR20230158286A (en) * 2022-05-11 2023-11-20 현대자동차주식회사 Cooling apparatus for power module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1517650A (en) * 1975-07-02 1978-07-12 Honeywell Inf Systems Cooling of electronic devices
US5168348A (en) * 1991-07-15 1992-12-01 International Business Machines Corporation Impingment cooled compliant heat sink
US20020186538A1 (en) * 2001-06-08 2002-12-12 Hiroaki Kase Cooling module and the system using the same
US20040182544A1 (en) * 2002-12-27 2004-09-23 Lee Hsieh Kun Cooling device utilizing liquid coolant
CN104779227A (en) * 2015-04-28 2015-07-15 天津商业大学 Liquid-cooled chip radiator with annularly-distributed fins

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1517650A (en) * 1975-07-02 1978-07-12 Honeywell Inf Systems Cooling of electronic devices
US5168348A (en) * 1991-07-15 1992-12-01 International Business Machines Corporation Impingment cooled compliant heat sink
US20020186538A1 (en) * 2001-06-08 2002-12-12 Hiroaki Kase Cooling module and the system using the same
US20040182544A1 (en) * 2002-12-27 2004-09-23 Lee Hsieh Kun Cooling device utilizing liquid coolant
CN104779227A (en) * 2015-04-28 2015-07-15 天津商业大学 Liquid-cooled chip radiator with annularly-distributed fins

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11924998B2 (en) 2021-04-01 2024-03-05 Ovh Hybrid immersion cooling system for rack-mounted electronic assemblies
US12120846B2 (en) 2021-04-01 2024-10-15 Ovh Immersion cooling systems for electronic components

Also Published As

Publication number Publication date
GB2574632A (en) 2019-12-18
GB201809681D0 (en) 2018-08-01

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