GB2570622B - Heat sink for liquid cooling - Google Patents

Heat sink for liquid cooling Download PDF

Info

Publication number
GB2570622B
GB2570622B GB1714313.2A GB201714313A GB2570622B GB 2570622 B GB2570622 B GB 2570622B GB 201714313 A GB201714313 A GB 201714313A GB 2570622 B GB2570622 B GB 2570622B
Authority
GB
United Kingdom
Prior art keywords
heat sink
liquid cooling
cooling
liquid
sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1714313.2A
Other versions
GB201714313D0 (en
GB2570622A (en
Inventor
Edmunds Neil
Young Andrew
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iceotope Group Ltd
Original Assignee
Iceotope Group Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iceotope Group Ltd filed Critical Iceotope Group Ltd
Priority to GB1714313.2A priority Critical patent/GB2570622B/en
Publication of GB201714313D0 publication Critical patent/GB201714313D0/en
Priority to IL308679A priority patent/IL308679A/en
Priority to US16/645,166 priority patent/US11096313B2/en
Priority to KR1020237018653A priority patent/KR102640723B1/en
Priority to CN202111385072.9A priority patent/CN114375131A/en
Priority to IL273104A priority patent/IL273104B2/en
Priority to EP23153453.8A priority patent/EP4199076A1/en
Priority to JP2020513520A priority patent/JP7183257B2/en
Priority to EP18769441.9A priority patent/EP3679603B1/en
Priority to KR1020207009009A priority patent/KR102541199B1/en
Priority to ES18769441T priority patent/ES2943656T3/en
Priority to EP23153461.1A priority patent/EP4203016A1/en
Priority to CN201880058136.4A priority patent/CN111095541B/en
Priority to TW107131329A priority patent/TWI786175B/en
Priority to KR1020237018651A priority patent/KR102639521B1/en
Priority to TW111142513A priority patent/TWI836706B/en
Priority to PCT/GB2018/052526 priority patent/WO2019048864A1/en
Publication of GB2570622A publication Critical patent/GB2570622A/en
Publication of GB2570622B publication Critical patent/GB2570622B/en
Application granted granted Critical
Priority to US17/354,781 priority patent/US11470739B2/en
Priority to US17/354,769 priority patent/US11369040B2/en
Priority to US17/678,387 priority patent/US11653472B2/en
Priority to US17/902,747 priority patent/US11596082B2/en
Priority to JP2022186573A priority patent/JP2023029879A/en
Priority to JP2022186574A priority patent/JP2023029880A/en
Priority to US18/122,431 priority patent/US11968802B2/en
Priority to US18/122,449 priority patent/US20230240042A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB1714313.2A 2017-09-06 2017-09-06 Heat sink for liquid cooling Active GB2570622B (en)

Priority Applications (25)

Application Number Priority Date Filing Date Title
GB1714313.2A GB2570622B (en) 2017-09-06 2017-09-06 Heat sink for liquid cooling
KR1020237018651A KR102639521B1 (en) 2017-09-06 2018-09-06 Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling
PCT/GB2018/052526 WO2019048864A1 (en) 2017-09-06 2018-09-06 Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling
TW111142513A TWI836706B (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
CN202111385072.9A CN114375131A (en) 2017-09-06 2018-09-06 Heat sink, heat sink device and module for liquid immersion cooling
US16/645,166 US11096313B2 (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
EP23153453.8A EP4199076A1 (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
JP2020513520A JP7183257B2 (en) 2017-09-06 2018-09-06 Immersion cooling heat sinks, heat sink devices and modules
EP18769441.9A EP3679603B1 (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
KR1020207009009A KR102541199B1 (en) 2017-09-06 2018-09-06 Heat sinks, heat sink arrays and modules for immersion cooling
ES18769441T ES2943656T3 (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
EP23153461.1A EP4203016A1 (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
CN201880058136.4A CN111095541B (en) 2017-09-06 2018-09-06 Heat sink, heat sink device and module for liquid immersion cooling
TW107131329A TWI786175B (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
IL308679A IL308679A (en) 2017-09-06 2018-09-06 Heat sink, heat sink arrangement and module for liquid immersion cooling
KR1020237018653A KR102640723B1 (en) 2017-09-06 2018-09-06 Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling
IL273104A IL273104B2 (en) 2017-09-06 2018-09-06 Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling
US17/354,769 US11369040B2 (en) 2017-09-06 2021-06-22 Heat sink, heat sink arrangement and module for liquid immersion cooling
US17/354,781 US11470739B2 (en) 2017-09-06 2021-06-22 Heat sink, heat sink arrangement and module for liquid immersion cooling
US17/678,387 US11653472B2 (en) 2017-09-06 2022-02-23 Heat sink, heat sink arrangement and module for liquid immersion cooling
US17/902,747 US11596082B2 (en) 2017-09-06 2022-09-02 Heat sink, heat sink arrangement and module for liquid immersion cooling
JP2022186574A JP2023029880A (en) 2017-09-06 2022-11-22 cooling module
JP2022186573A JP2023029879A (en) 2017-09-06 2022-11-22 cooling module
US18/122,431 US11968802B2 (en) 2017-09-06 2023-03-16 Heat sink, heat sink arrangement and module for liquid immersion cooling
US18/122,449 US20230240042A1 (en) 2017-09-06 2023-03-16 Heat sink, heat sink arrangement and module for liquid immersion cooling

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1714313.2A GB2570622B (en) 2017-09-06 2017-09-06 Heat sink for liquid cooling

Publications (3)

Publication Number Publication Date
GB201714313D0 GB201714313D0 (en) 2017-10-18
GB2570622A GB2570622A (en) 2019-08-07
GB2570622B true GB2570622B (en) 2020-03-11

Family

ID=60050748

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1714313.2A Active GB2570622B (en) 2017-09-06 2017-09-06 Heat sink for liquid cooling

Country Status (1)

Country Link
GB (1) GB2570622B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04196155A (en) * 1990-11-26 1992-07-15 Nec Corp Method for cooling integrated circuit
US20060007656A1 (en) * 2004-07-09 2006-01-12 Symons Robert S Integrated liquid cooling device with immersed electronic components
US20100103620A1 (en) * 2008-10-23 2010-04-29 International Business Machines Corporation Open Flow Cold Plate For Liquid Cooled Electronic Packages
US20100103614A1 (en) * 2008-10-23 2010-04-29 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
US20110149517A1 (en) * 2006-09-06 2011-06-23 Airbus Operations Gmbh Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System
US20150109728A1 (en) * 2013-10-21 2015-04-23 International Business Machines Corporation Field-replaceable bank of immersion-cooled electronic components
WO2016076882A1 (en) * 2014-11-14 2016-05-19 Hewlett Packard Enterprise Development Lp Cooling rack

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04196155A (en) * 1990-11-26 1992-07-15 Nec Corp Method for cooling integrated circuit
US20060007656A1 (en) * 2004-07-09 2006-01-12 Symons Robert S Integrated liquid cooling device with immersed electronic components
US20110149517A1 (en) * 2006-09-06 2011-06-23 Airbus Operations Gmbh Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System
US20100103620A1 (en) * 2008-10-23 2010-04-29 International Business Machines Corporation Open Flow Cold Plate For Liquid Cooled Electronic Packages
US20100103614A1 (en) * 2008-10-23 2010-04-29 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
US20150109728A1 (en) * 2013-10-21 2015-04-23 International Business Machines Corporation Field-replaceable bank of immersion-cooled electronic components
WO2016076882A1 (en) * 2014-11-14 2016-05-19 Hewlett Packard Enterprise Development Lp Cooling rack

Also Published As

Publication number Publication date
GB201714313D0 (en) 2017-10-18
GB2570622A (en) 2019-08-07

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