FR2314585A1 - Circuit electronique stratifie multicouche et procede pour sa fabrication - Google Patents

Circuit electronique stratifie multicouche et procede pour sa fabrication

Info

Publication number
FR2314585A1
FR2314585A1 FR7617770A FR7617770A FR2314585A1 FR 2314585 A1 FR2314585 A1 FR 2314585A1 FR 7617770 A FR7617770 A FR 7617770A FR 7617770 A FR7617770 A FR 7617770A FR 2314585 A1 FR2314585 A1 FR 2314585A1
Authority
FR
France
Prior art keywords
manufacturing
electronic circuit
layer laminate
laminate electronic
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7617770A
Other languages
English (en)
French (fr)
Other versions
FR2314585B1 (nl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2314585A1 publication Critical patent/FR2314585A1/fr
Application granted granted Critical
Publication of FR2314585B1 publication Critical patent/FR2314585B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR7617770A 1975-06-13 1976-06-11 Circuit electronique stratifie multicouche et procede pour sa fabrication Granted FR2314585A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2526553A DE2526553C3 (de) 1975-06-13 1975-06-13 Mehrlagige elektronische Schichtschaltung und Verfahren zu ihrer Herstellung

Publications (2)

Publication Number Publication Date
FR2314585A1 true FR2314585A1 (fr) 1977-01-07
FR2314585B1 FR2314585B1 (nl) 1979-09-28

Family

ID=5949067

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7617770A Granted FR2314585A1 (fr) 1975-06-13 1976-06-11 Circuit electronique stratifie multicouche et procede pour sa fabrication

Country Status (9)

Country Link
JP (2) JPS5210569A (nl)
AT (1) AT359583B (nl)
CH (1) CH604344A5 (nl)
DE (1) DE2526553C3 (nl)
FR (1) FR2314585A1 (nl)
GB (1) GB1540112A (nl)
IT (1) IT1063970B (nl)
NL (1) NL7604158A (nl)
SE (1) SE421852B (nl)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0107037A2 (en) * 1982-10-22 1984-05-02 International Business Machines Corporation Multilayer printed circuit board, and method of manufacturing multilayer printed circuit boards

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2045540B (en) * 1978-12-28 1983-08-03 Tdk Electronics Co Ltd Electrical inductive device
EP0062084A1 (en) * 1981-04-06 1982-10-13 Herbert Irwin Schachter Multi-level circuit and method of making same
JPS60130883A (ja) * 1983-12-19 1985-07-12 中央銘板工業株式会社 多層印刷配線板
DE3831148C1 (nl) * 1988-09-13 1990-03-29 Robert Bosch Gmbh, 7000 Stuttgart, De
NO900229D0 (no) * 1990-01-16 1990-01-16 Micro Electronics Ame A S Fremgangsmaate for fremstilling av miniatyrisert impedanstilpasset ledningsnett.

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0107037A2 (en) * 1982-10-22 1984-05-02 International Business Machines Corporation Multilayer printed circuit board, and method of manufacturing multilayer printed circuit boards
EP0107037A3 (en) * 1982-10-22 1984-11-28 International Business Machines Corporation Multilayer printed circuit board, and method of manufacturing multilayer printed circuit boards

Also Published As

Publication number Publication date
DE2526553C3 (de) 1978-06-01
AT359583B (de) 1980-11-25
IT1063970B (it) 1985-02-18
SE7606715L (sv) 1976-12-14
ATA358776A (de) 1980-04-15
SE421852B (sv) 1982-02-01
DE2526553B2 (de) 1977-09-29
CH604344A5 (nl) 1978-09-15
FR2314585B1 (nl) 1979-09-28
GB1540112A (en) 1979-02-07
JPS5210569A (en) 1977-01-26
DE2526553A1 (de) 1976-12-16
JPS5731876U (nl) 1982-02-19
NL7604158A (nl) 1976-12-15

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Legal Events

Date Code Title Description
ST Notification of lapse