SE7606715L - Flerskiktig elektronisk skiktkrets samt forfarande for tillverkning av densamma - Google Patents

Flerskiktig elektronisk skiktkrets samt forfarande for tillverkning av densamma

Info

Publication number
SE7606715L
SE7606715L SE7606715A SE7606715A SE7606715L SE 7606715 L SE7606715 L SE 7606715L SE 7606715 A SE7606715 A SE 7606715A SE 7606715 A SE7606715 A SE 7606715A SE 7606715 L SE7606715 L SE 7606715L
Authority
SE
Sweden
Prior art keywords
layer
procedure
manufacture
same
layer circuit
Prior art date
Application number
SE7606715A
Other languages
English (en)
Other versions
SE421852B (sv
Inventor
K Bruninger
D Haberland
B Strasser
A Weitze
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE7606715L publication Critical patent/SE7606715L/sv
Publication of SE421852B publication Critical patent/SE421852B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
SE7606715A 1975-06-13 1976-06-11 Flerskiktig dektronisk skiktkrets och forfarande for dess framstellning SE421852B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2526553A DE2526553C3 (de) 1975-06-13 1975-06-13 Mehrlagige elektronische Schichtschaltung und Verfahren zu ihrer Herstellung

Publications (2)

Publication Number Publication Date
SE7606715L true SE7606715L (sv) 1976-12-14
SE421852B SE421852B (sv) 1982-02-01

Family

ID=5949067

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7606715A SE421852B (sv) 1975-06-13 1976-06-11 Flerskiktig dektronisk skiktkrets och forfarande for dess framstellning

Country Status (9)

Country Link
JP (2) JPS5210569A (sv)
AT (1) AT359583B (sv)
CH (1) CH604344A5 (sv)
DE (1) DE2526553C3 (sv)
FR (1) FR2314585A1 (sv)
GB (1) GB1540112A (sv)
IT (1) IT1063970B (sv)
NL (1) NL7604158A (sv)
SE (1) SE421852B (sv)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2045540B (en) * 1978-12-28 1983-08-03 Tdk Electronics Co Ltd Electrical inductive device
EP0062084A1 (en) * 1981-04-06 1982-10-13 Herbert Irwin Schachter Multi-level circuit and method of making same
US4495479A (en) * 1982-10-22 1985-01-22 International Business Machines Corporation Selective wiring for multilayer printed circuit board
JPS60130883A (ja) * 1983-12-19 1985-07-12 中央銘板工業株式会社 多層印刷配線板
DE3831148C1 (sv) * 1988-09-13 1990-03-29 Robert Bosch Gmbh, 7000 Stuttgart, De
NO900229D0 (no) * 1990-01-16 1990-01-16 Micro Electronics Ame A S Fremgangsmaate for fremstilling av miniatyrisert impedanstilpasset ledningsnett.

Also Published As

Publication number Publication date
SE421852B (sv) 1982-02-01
DE2526553C3 (de) 1978-06-01
JPS5210569A (en) 1977-01-26
FR2314585B1 (sv) 1979-09-28
GB1540112A (en) 1979-02-07
IT1063970B (it) 1985-02-18
DE2526553B2 (de) 1977-09-29
FR2314585A1 (fr) 1977-01-07
NL7604158A (nl) 1976-12-15
JPS5731876U (sv) 1982-02-19
DE2526553A1 (de) 1976-12-16
ATA358776A (de) 1980-04-15
AT359583B (de) 1980-11-25
CH604344A5 (sv) 1978-09-15

Similar Documents

Publication Publication Date Title
SE7504328L (sv) Integrerad kretsanordning samt forfarande for framstellning av denna
NO773951L (no) Fremgangsmaate for fremstilling av hulpanel
FR2350697A1 (fr) Structure perfectionnee de circuits multicouches
GB1540558A (en) Manufacture of an electronic micro-package
SE7606715L (sv) Flerskiktig elektronisk skiktkrets samt forfarande for tillverkning av densamma
JPS5310863A (en) Method of testing multilayer substrate
SE422740B (sv) Plansil samt forfarande for tillverkning av densamma
JPS52151866A (en) Circuit substrate and method of forming same
NO149344C (no) Laminat samt fremgangsmaate for fremstilling av slikt laminat
SE428658B (sv) Anordning for framstellning av rorformade halkroppar
JPS51120669A (en) Package for electronic circuits and method of making the same
JPS52156375A (en) Method of producing multilayer circuit substrate
JPS526974A (en) Multilayered circuit board and manufacturing it
JPS5346666A (en) Method of producing multilayer circuit substrate
SE405195B (sv) Elektronisk mikrokrets av hybridtyp samt forfarande for dess framstellning
JPS51134874A (en) Method of manufacturing thick film multilayered wiring substrate
JPS5254963A (en) Circuit substrate having metalized wiring layer
JPS51133766A (en) Method of forming thick film circuit components on ceramic substrate
JPS52131167A (en) Multilayer circuit substrate
JPS52131160A (en) Multilayer circuit substrate
JPS5319560A (en) Method of producing multilayer circuit substrate
JPS5332378A (en) Method of producing multilayer circuit substrate
JPS5335728A (en) Method of manufacturing inorganic substratum boards
JPS5227557A (en) Method of manufacturing wiring substrate
JPS5293963A (en) Method of producing thick film wiring circuit substrate