JPS5310863A - Method of testing multilayer substrate - Google Patents

Method of testing multilayer substrate

Info

Publication number
JPS5310863A
JPS5310863A JP8496776A JP8496776A JPS5310863A JP S5310863 A JPS5310863 A JP S5310863A JP 8496776 A JP8496776 A JP 8496776A JP 8496776 A JP8496776 A JP 8496776A JP S5310863 A JPS5310863 A JP S5310863A
Authority
JP
Japan
Prior art keywords
multilayer substrate
testing multilayer
testing
substrate
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8496776A
Other languages
Japanese (ja)
Inventor
Masayuki Kokado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP8496776A priority Critical patent/JPS5310863A/en
Publication of JPS5310863A publication Critical patent/JPS5310863A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP8496776A 1976-07-19 1976-07-19 Method of testing multilayer substrate Pending JPS5310863A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8496776A JPS5310863A (en) 1976-07-19 1976-07-19 Method of testing multilayer substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8496776A JPS5310863A (en) 1976-07-19 1976-07-19 Method of testing multilayer substrate

Publications (1)

Publication Number Publication Date
JPS5310863A true JPS5310863A (en) 1978-01-31

Family

ID=13845384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8496776A Pending JPS5310863A (en) 1976-07-19 1976-07-19 Method of testing multilayer substrate

Country Status (1)

Country Link
JP (1) JPS5310863A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54137073U (en) * 1978-03-16 1979-09-22
JPS5918467A (en) * 1982-07-06 1984-01-30 スペリ−・コ−ポレ−シヨン Method and device for detecting destructive breakdown, inadequate connection and temperature of insulator of printed circuit assembly by single electric wire
JPS59151070A (en) * 1983-02-18 1984-08-29 Nec Corp Inspecting method of multi-layer ceramic wiring board
US7656166B2 (en) 2007-02-28 2010-02-02 Micronics Japan Co., Ltd. Multilayer wiring board and method for testing the same
US7659727B2 (en) 2007-02-28 2010-02-09 Micronics Japan Co., Ltd. Multilayer wiring board and method for testing the same
JP2010249664A (en) * 2009-04-16 2010-11-04 Hioki Ee Corp Circuit board inspection device and circuit board inspection method
JP2015004621A (en) * 2013-06-21 2015-01-08 株式会社日本マイクロニクス Device and method for inspecting wiring board
US20150108997A1 (en) * 2013-10-18 2015-04-23 Kabushiki Kaisha Nihon Micronics Inspection apparatus and inspection method
JP2021152511A (en) * 2020-03-25 2021-09-30 日本電産リード株式会社 Inspection device and inspection method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4938968U (en) * 1972-07-07 1974-04-05
JPS5296358A (en) * 1976-02-06 1977-08-12 Tokyo Shibaura Electric Co Device for inspecting pattern

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4938968U (en) * 1972-07-07 1974-04-05
JPS5296358A (en) * 1976-02-06 1977-08-12 Tokyo Shibaura Electric Co Device for inspecting pattern

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54137073U (en) * 1978-03-16 1979-09-22
JPS5918467A (en) * 1982-07-06 1984-01-30 スペリ−・コ−ポレ−シヨン Method and device for detecting destructive breakdown, inadequate connection and temperature of insulator of printed circuit assembly by single electric wire
JPS59151070A (en) * 1983-02-18 1984-08-29 Nec Corp Inspecting method of multi-layer ceramic wiring board
US7656166B2 (en) 2007-02-28 2010-02-02 Micronics Japan Co., Ltd. Multilayer wiring board and method for testing the same
US7659727B2 (en) 2007-02-28 2010-02-09 Micronics Japan Co., Ltd. Multilayer wiring board and method for testing the same
JP2010249664A (en) * 2009-04-16 2010-11-04 Hioki Ee Corp Circuit board inspection device and circuit board inspection method
JP2015004621A (en) * 2013-06-21 2015-01-08 株式会社日本マイクロニクス Device and method for inspecting wiring board
US20150108997A1 (en) * 2013-10-18 2015-04-23 Kabushiki Kaisha Nihon Micronics Inspection apparatus and inspection method
US9535108B2 (en) * 2013-10-18 2017-01-03 Kabushiki Kaisha Nihon Micronics Inspection apparatus and inspection method
JP2021152511A (en) * 2020-03-25 2021-09-30 日本電産リード株式会社 Inspection device and inspection method

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