JPS59151070A - Inspecting method of multi-layer ceramic wiring board - Google Patents

Abstract

PURPOSE:To simplify an inspection of a board, and to raise the decision accuracy by comparing a capacitance value having a prescribed range given in advance with a measured capacitance value, and deciding whether the connection is good or not. CONSTITUTION:A board 1 has a specified lead pin 61 connected to an electric conductor of a ground layer 10, and it is fixed to a holding jig 80 having a contact 18 which contacts with the pin 61. From the side facing a surface layer 50 containing an electrode 51 to which a terminal of loaded electronic parts is connected, a probe pin 70 is made to contact with an optional electrode 51. As a result, the capacitance of an optional signal wiring 21 and 41 can be measured. Subsequently, the capacitance having a prescribed range given in advance is compared with a measured value of a signal line to be measured, and whether the connection is good or not is decided. Also, basing on a data of a normal capacitance value obtained by the decision, a capacitance value of the prescribed range is corrected, and subsequently, used for deciding the same pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Technical field to which the invention pertains The present invention relates to an inspection method for determining the quality of electrical connections of a multilayer ceramic wiring board.

2) Prior art Conventionally, when inspecting this type of board, it was necessary to manually touch the probe of a tester or buzzer between the connection terminals of the wiring to check the connection, or to check the connection by manually touching the probe of a tester or buzzer between the connection terminals of the wiring, etc. Measure the resistance between the terminals and determine whether there is oil conduction or non-conduction.

However, with the miniaturization of electronic components, higher density packaging, and increased functionality (・The pattern of this type of board has become finer and the number of wires has increased, i.e., the number of connection terminals has increased. Manually checking such patterns is inefficient, and is virtually inefficient in terms of inspection man-hours and the possibility of inspection errors. However, the probe bin board needs to be miniaturized and highly accurate to accommodate the huge number of probe bins and miniaturization of patterns, making it extremely expensive and expensive.
[ru. In addition, the method of determining conduction or nonconduction by measuring the resistance between terminals requires a huge number of measurements (
There are some drawbacks.

(3) Purpose of the Invention The purpose of the present invention is to solve the above-mentioned drawbacks and to propose a method for testing a 62 multilayer ceramic wiring board with high accuracy.

(4) Structure of the Invention The method of the present invention provides a multilayer ceramic wiring board having a lead bin for external connection, a large number of signal lines connecting a plurality of electronic components mounted on the board, and a ground and power layer. In the electrical connection inspection method, either the ground layer or the power layer, or both the ground layer and the power layer are facing each other,
The capacitance of the signal wiring at each terminal is measured with a capacitance meter by connecting the lead pin through a connector or the like and touching the connection terminal of the signal wiring with a probe. Are the capacitance values of multiple connected terminals the same? What are the shape of the signal wiring pattern, the configuration with the counter electrode, and manufacturing variations? This is an inspection method for a multilayer ceramic wiring board, which is characterized in that the quality of the connection is determined by comparing a measured capacitance value with a capacitance value having a predetermined range given in advance, taking into account the 1111 constant error, etc. . In a modified example of the present invention, the capacitance value having a prescribed range given in advance is corrected based on the data of the normal capacitance value at the same location of the multilayer ceramic wiring board with the same pattern previously inspected. However, this method of testing multilayer ceramic wiring boards is characterized by sequentially modifying the specified range and making it possible to make highly accurate judgments against manufacturing variations, etc.

(5) Principle and operation of the invention In general, this type of multilayer ceramic wiring board has signal wiring with a constant width and different lengths, and a ground and power layer formed in a planar or grid pattern over almost the entire surface of the board. are formed separated by an insulating layer of approximately constant thickness.Therefore, the capacitance of a wiring with one pole of opposing lightning on the ground or power layer is determined by the length of the signal wiring. However, if there is a break in the signal wiring, the capacitance value will be
If there is a short circuit, the capacitance value will increase. Therefore, it is possible to judge whether the product is good or bad.

However, if the turn shape or film thickness changes due to defects or manufacturing variations, or if wire breaks and shorts coexist, erroneous judgments may be made, resulting in the detection of false defects or failures. There may be cases where there is no such thing. In order to eliminate this problem, we add a judgment to determine whether the capacitance values measured at all multiple terminals connected to the same signal wiring are the same. If the values match, the presence of a disconnection can be detected.

On the other hand, since the inspection is performed by measuring capacitance with the ground layer and power layer as counter electrodes, it is recommended to connect the external connection lead pins of the ground and power source to the board holding jig in advance via a connector etc. By sequentially contacting the connecting terminals of the wiring with one probe bottle, it is possible to measure the capacitance of the signal wiring at each terminal.

Furthermore, by correcting and modifying the predetermined capacitance value given in advance for judgment based on the data of the board that has been inspected, and using it for the next inspection, it is possible to improve the accuracy of complex pattern shapes and layer configurations. Gradually, it becomes possible to make judgments with high accuracy.

(6) Detailed Description of the Invention Next, the present invention will be explained in detail with reference to the drawings. is a ground layer formed on almost the entire surface of the board as a grid surface]0, this ground layer]
A first signal layer line 21 formed on a first signal layer 21 for interconnecting electronic components (not shown) mounted on the
The signal wiring layer 20 and the connection between the upper and lower conductor layers formed between the first signal 1lii'' line layer are covered with 95 conductors over almost the entire surface of the board. A power supply layer 30 formed on this power supply layer 30, a second signal layer line layer 40 including a second signal layer 8♂41 for interconnecting electronic components formed on this power supply layer 30, and this second signal wiring. Terminals of electronic components formed on the layer 40 and mounted on the surface of the substrate (
A surface layer 50 that includes a lower electrode 51 for connecting (not shown), a seat 53 for fixing the child parts, a bus 52 for distributing ground or power, and a surface layer 50 for connecting to the outside. Between the IJ-doping pin 60 and the above conductor layer,
An insulating layer 15゜2 provided at the position of the through-hole hole that enables connection between the upper and lower layers and electrically insulates the hot body layer.
It is composed of 5, 35 and 45.

First, it may be an arbitrary electrode 51 to which a terminal of an electronic component is connected.
Any signal lines 21 and 41 of the first and second signal layers 20 and 40 are connected to any other electrode 51 or lead pin 60 via a through hole in the insulating layer ( These arbitrary circuit connections are made by the pattern design of each layer and are uniquely determined by the necessary connection board design.For this reason, the ground layer 10 and power layer 30 on the entire surface of the substrate are used as counter electrodes. The capacitance of each signal wire connected to the same signal wire will also be the same. Therefore, if there is an inconvenience in manufacturing, the capacitance value will be the same. , defective location, i.e., ii to be connected,
If there is a disconnection between terminals or an unnecessary short circuit, the capacitance of each terminal connected to the same signal wiring may be different, or the capacitance value may differ from the value specified in the pattern design. This makes it possible to detect defects.

Furthermore, if the pattern shape or layer structure of the ground layer or power supply layer becomes complicated, or if manufacturing variations increase, it becomes difficult to estimate the constant capacitance value, and the accuracy of the determination decreases. However, in advance, the capacitance value of 4 women is 1 constant #! By correcting and modifying the data for the same pattern that was obtained, and using it for the next 14th time I.J.
Ru.

Referring to FIG. 2, the multilayer ceramic wiring board 1 to be inspected by the inspection method of the present invention has lead pins 61 connected to the conductor of the ground layer 1.0. It is fixed to a retaining jig 80 having contacts 81 that come in contact with each other.

From the base 11 facing the surface layer 50 containing the terminals of the electronic components mounted on the tower, the globe pin 70 is brought into contact with any of the bases 5i. In this way, if the capacitance between the probe pin 70 and the contact 8 is measured, the capacitance between the probe pin 70 and the contact 8 is measured. The capacitance of the electrode is measured.The probe pin 70 is moved (x-y axis and Z axis) to make contact with all other electrodes, and the capacitance is measured.
Also for other IJ-do pins 66, other contacts 82
Measure the capacitance through.

The capacitance measured at each electrode and lead pin is first connected to the same signal line, and it is determined whether the capacitance values are the same across multiple terminals. The capacitance of the signal line to be measured is compared with the measured value of the signal line to be measured to judge whether the connection is good or bad.Furthermore, based on the data of the normal capacitance value obtained by the judgment, the predetermined w well is determined. correct the capacitance value with
Next, it is used to judge the same pattern. By doing this, it is possible to make a highly accurate judgment even if there are variations due to manufacturing variations or a mixture of disconnections and shorts.

Here, we will specifically explain how to move the probe pin 70, how to measure capacitance, and how to compare capacitance values.・Accordingly, precise movement using conventionally known pulse motors or servo motors is possible.Measurement of capacitance can be achieved by connecting a commercially available capacitance meter, and comparison of data can be easily performed using a microcomputer, etc. In addition, automation is easily possible through these applications. Also, although the probe pins were moved in this example, the probe pins are You can move to the side (・
Furthermore, a multilayer ceramic wiring board with a structure different from that described in this embodiment, for example, with lead pins attached to the back surface, may also be used.

(7) Effects of the Invention In the present invention, the capacitance of the ground layer, power supply layer, etc. is used as an opposing gate, the lead pin is connected via a connector, etc., and the signal wiring is made by contacting the connection terminal with a glove, and the capacitance is determined. By using this testing method, it is possible to easily test a 1F multilayer ceramic wiring board having externally connected lead pins and a large number of signal wirings, and to improve accuracy.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing a multilayer ceramic wiring board to be inspected according to the present invention, and FIG. 2 is a perspective view showing an embodiment of the present invention. In Fig. 1 and Fig. 2, 1... multilayer ceramic wiring board, 30... power supply layer, 10...
...Ground layer, 31...Land, 20.
...First signal wiring layer, 40... Second signal wiring layer, 21... First signal wiring, 41.
...Second signal wiring, 50...Surface layer,
60... Lead pin, 51... Electrode,
61... Specific glue-doping, 52...
Bus, 15,25°35.45... Insulating layer, 5
3... seat, 70... prog pin, 8
0...Holding jig, 81...Contact. Bamboo shoots / diagram

Claims (1)

[Claims] (1) An inspection method for a multilayer ceramic wiring board that has lead pins for external connections, a large number of signal lines with connection terminals for connecting a plurality of mounted electronic components, and ground and power layers. Then, the capacitance of the signal wiring is measured by connecting the lead pin via a connector or the like and contacting the connection terminal of the signal wiring with a probe, with at least one of the ground layer and the power layer facing each other. Whether the capacitance values measured at multiple remote terminals connected to the signal wiring are the same (or whether the capacitance values measured at all terminals connected to all of the signal wiring and the pre-specified range) A method for inspecting a multilayer ceramic wiring board, characterized in that the quality of the connection is determined by comparing the capacitance value with the capacitance value. is corrected based on the data of the normal capacitance value at the same location of the multilayer ceramic wiring board with the same pattern that was previously inspected. It is characterized in that it is used for the judgment of ceramic wiring boards, and is sequentially modified to give a prescribed range for judgment.