JPS5210569A - Multilayered electronic circuit - Google Patents

Multilayered electronic circuit

Info

Publication number
JPS5210569A
JPS5210569A JP51065491A JP6549176A JPS5210569A JP S5210569 A JPS5210569 A JP S5210569A JP 51065491 A JP51065491 A JP 51065491A JP 6549176 A JP6549176 A JP 6549176A JP S5210569 A JPS5210569 A JP S5210569A
Authority
JP
Japan
Prior art keywords
electronic circuit
multilayered electronic
multilayered
circuit
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP51065491A
Other languages
English (en)
Japanese (ja)
Inventor
Buruningaa Kaaru
Haaberuranto Detsutoreefu
Shiyutoratsuseru Purukuharuto
Buaitsue Arutsuuru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS5210569A publication Critical patent/JPS5210569A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP51065491A 1975-06-13 1976-06-04 Multilayered electronic circuit Pending JPS5210569A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2526553A DE2526553C3 (de) 1975-06-13 1975-06-13 Mehrlagige elektronische Schichtschaltung und Verfahren zu ihrer Herstellung

Publications (1)

Publication Number Publication Date
JPS5210569A true JPS5210569A (en) 1977-01-26

Family

ID=5949067

Family Applications (2)

Application Number Title Priority Date Filing Date
JP51065491A Pending JPS5210569A (en) 1975-06-13 1976-06-04 Multilayered electronic circuit
JP1981100259U Pending JPS5731876U (nl) 1975-06-13 1981-07-07

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP1981100259U Pending JPS5731876U (nl) 1975-06-13 1981-07-07

Country Status (9)

Country Link
JP (2) JPS5210569A (nl)
AT (1) AT359583B (nl)
CH (1) CH604344A5 (nl)
DE (1) DE2526553C3 (nl)
FR (1) FR2314585A1 (nl)
GB (1) GB1540112A (nl)
IT (1) IT1063970B (nl)
NL (1) NL7604158A (nl)
SE (1) SE421852B (nl)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2045540B (en) * 1978-12-28 1983-08-03 Tdk Electronics Co Ltd Electrical inductive device
EP0062084A1 (en) * 1981-04-06 1982-10-13 Herbert Irwin Schachter Multi-level circuit and method of making same
US4495479A (en) * 1982-10-22 1985-01-22 International Business Machines Corporation Selective wiring for multilayer printed circuit board
JPS60130883A (ja) * 1983-12-19 1985-07-12 中央銘板工業株式会社 多層印刷配線板
DE3831148C1 (nl) * 1988-09-13 1990-03-29 Robert Bosch Gmbh, 7000 Stuttgart, De
NO900229D0 (no) * 1990-01-16 1990-01-16 Micro Electronics Ame A S Fremgangsmaate for fremstilling av miniatyrisert impedanstilpasset ledningsnett.

Also Published As

Publication number Publication date
DE2526553C3 (de) 1978-06-01
AT359583B (de) 1980-11-25
IT1063970B (it) 1985-02-18
FR2314585A1 (fr) 1977-01-07
SE7606715L (sv) 1976-12-14
ATA358776A (de) 1980-04-15
SE421852B (sv) 1982-02-01
DE2526553B2 (de) 1977-09-29
CH604344A5 (nl) 1978-09-15
FR2314585B1 (nl) 1979-09-28
GB1540112A (en) 1979-02-07
DE2526553A1 (de) 1976-12-16
JPS5731876U (nl) 1982-02-19
NL7604158A (nl) 1976-12-15

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