BE877350A - Plaquette a circuit et son procede de fabrication - Google Patents

Plaquette a circuit et son procede de fabrication

Info

Publication number
BE877350A
BE877350A BE0/196028A BE196028A BE877350A BE 877350 A BE877350 A BE 877350A BE 0/196028 A BE0/196028 A BE 0/196028A BE 196028 A BE196028 A BE 196028A BE 877350 A BE877350 A BE 877350A
Authority
BE
Belgium
Prior art keywords
circuit board
manufacturing process
manufacturing
board
circuit
Prior art date
Application number
BE0/196028A
Other languages
English (en)
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of BE877350A publication Critical patent/BE877350A/fr

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0094Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09581Applying an insulating coating on the walls of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0562Details of resist
    • H05K2203/0571Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0562Details of resist
    • H05K2203/0597Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08Treatments involving gases
    • H05K2203/082Suction, e.g. for holding solder balls or components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/0023Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/425Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
BE0/196028A 1978-06-29 1979-06-28 Plaquette a circuit et son procede de fabrication BE877350A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7895478A JPS556833A (en) 1978-06-29 1978-06-29 Cirucit board and method of manufacturing same

Publications (1)

Publication Number Publication Date
BE877350A true BE877350A (fr) 1979-12-28

Family

ID=13676271

Family Applications (1)

Application Number Title Priority Date Filing Date
BE0/196028A BE877350A (fr) 1978-06-29 1979-06-28 Plaquette a circuit et son procede de fabrication

Country Status (8)

Country Link
US (1) US4293377A (fr)
JP (1) JPS556833A (fr)
BE (1) BE877350A (fr)
CA (1) CA1130011A (fr)
DE (1) DE2926336A1 (fr)
FR (1) FR2430165B1 (fr)
GB (1) GB2028002B (fr)
IT (1) IT1121984B (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57166095A (en) * 1981-04-07 1982-10-13 Sharp Kk Circuit board and method of producing same
WO1982003723A1 (fr) * 1981-04-10 1982-10-28 Roth Johann Contact electrique, notamment pour circuits imprimes de petits appareils electriques
JPS58204176A (ja) * 1982-05-24 1983-11-28 Kangiyou Denki Kiki Kk 化学的蝕刻方法
US4633035A (en) * 1982-07-12 1986-12-30 Rogers Corporation Microwave circuit boards
US4525247A (en) * 1982-07-12 1985-06-25 Rogers Corporation Microwave circuit boards and method of manufacture thereof
EP0180220B1 (fr) * 1984-11-02 1992-09-02 AMP-AKZO CORPORATION (a Delaware corp.) Procédé de fabrication de matériaux de substrat thermoplastique revêtu de métal
DE3728337A1 (de) * 1987-08-25 1989-03-16 Goerlitz Computerbau Gmbh Verfahren zur herstellung von geaetzten leiterplatten
US4992139A (en) * 1989-11-16 1991-02-12 Motorola, Inc. Conductive mask and method of making same
US5080929A (en) * 1990-04-02 1992-01-14 Delco Electronics Corporation Method and apparatus for through hole substrate printing
US5447600A (en) * 1994-03-21 1995-09-05 Texas Instruments Polymeric coatings for micromechanical devices
US6053617A (en) * 1994-09-23 2000-04-25 Texas Instruments Incorporated Manufacture method for micromechanical devices
US5474956A (en) * 1995-03-14 1995-12-12 Hughes Aircraft Company Method of fabricating metallized substrates using an organic etch block layer
JPH11274687A (ja) * 1998-03-20 1999-10-08 Sony Chem Corp フレキシブルプリント配線板の製造方法
KR100509058B1 (ko) * 2000-04-11 2005-08-18 엘지전자 주식회사 인쇄회로기판의 제조방법
US20050260338A1 (en) * 2004-05-19 2005-11-24 Trendon Touch Technology Corp. Method of manufacturing circuit layout on touch panel by utilizing metal plating technology
US8226874B2 (en) * 2007-08-30 2012-07-24 Cirrus Logic, Inc. Method and apparatus for protecting an article during operation
KR101137192B1 (ko) 2009-02-06 2012-04-19 주식회사 엘지화학 절연된 도전성 패턴의 제조 방법 및 적층체
KR20100090628A (ko) 2009-02-06 2010-08-16 주식회사 엘지화학 절연된 도전성 패턴의 제조 방법
JP5474097B2 (ja) 2009-02-06 2014-04-16 エルジー・ケム・リミテッド タッチスクリーンおよびその製造方法
CN102598891B (zh) 2009-07-16 2015-11-25 Lg化学株式会社 电导体及其制造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2673142A (en) * 1949-04-15 1954-03-23 Blue Ridge Glass Corp Electric heating element
GB1194853A (en) * 1967-02-16 1970-06-17 Btr Industries Ltd A Method of Forming Printed Circuits
US3742597A (en) * 1971-03-17 1973-07-03 Hadco Printed Circuits Inc Method for making a coated printed circuit board
US3792423A (en) * 1972-05-24 1974-02-12 Atomic Energy Commission Isometric imaging system
GB1458965A (en) * 1972-12-20 1976-12-22 Hawker Siddeley Dynamics Ltd Protection of boards carrying components especially electrical circuit boards carrying electronic components
JPS5027033A (fr) * 1973-07-11 1975-03-20
US3881884A (en) * 1973-10-12 1975-05-06 Ibm Method for the formation of corrosion resistant electronic interconnections
JPS5197770A (en) * 1975-02-25 1976-08-27 Haisenyododentaino himakukeiseihoho
US4127436A (en) * 1975-04-17 1978-11-28 E. I. Du Pont De Nemours And Company Vacuum laminating process
US4172757A (en) * 1977-10-17 1979-10-30 Xerox Corporation Process for making electrode with integral dielectric layer

Also Published As

Publication number Publication date
CA1130011A (fr) 1982-08-17
IT7924024A0 (it) 1979-06-29
DE2926336A1 (de) 1980-01-10
US4293377A (en) 1981-10-06
GB2028002A (en) 1980-02-27
GB2028002B (en) 1982-06-30
IT1121984B (it) 1986-04-23
FR2430165B1 (fr) 1985-07-05
FR2430165A1 (fr) 1980-01-25
JPS556833A (en) 1980-01-18

Similar Documents

Publication Publication Date Title
BE857125A (fr) Boitier de circuit integre et son procede de fabrication
BE877350A (fr) Plaquette a circuit et son procede de fabrication
BE878667A (fr) Procede de production de circuits integres
BE854118A (fr) Feutre et son procede de fabrication
FR2428951B1 (fr) Haut-parleur et procede de fabrication
BE890506A (fr) Procede electronique de reperage et son procede de fabrication
FR2433681B1 (fr) Courroie de transmission et son procede de fabrication
FR2339697A1 (fr) Etoffe composite et son procede de fabrication
BE869881A (fr) Element de connecteur electrique et son procede de fabrication
BE857659A (fr) Procede de fabrication de dragees
BE877349A (fr) Procede de fabrication d'une plaquette a circuit du type flexible
BE842555A (fr) Circuit imprime flexible et procede pour sa fabrication
FR2330149A1 (fr) Photodiode a semi-conducteur et procede de fabrication
FR2339357A1 (fr) Bracelet extensible et son procede de fabrication
BE860704A (fr) Crible et son procede de fabrication
BE877609A (fr) Procede de fabrication de d-camphorate de l-carnitinamide et de d-camphorate de d-carnitinamide
ES506354A0 (es) Procedimiento de fabricacion de dispositivos de circuitos integrados a gran escala
BE853047A (fr) Accouplement elastique et son procede de fabrication
FR2403394B1 (fr) Materiau en laiton et procede de fabrication
FR2350669A1 (fr) Transducteur electrique et procede de fabrication
BE875506A (fr) Procede de fabrication de suppositoires
BE867705A (fr) Procede de fabrication de cuivre
BE872909A (fr) Procede et agencement de fabrication d'enveloppes
FR2338961A1 (fr) Procede de fabrication de polyoxyphenylenes
FR2339955A1 (fr) Procede de fabrication d'un circuit integre

Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: ROGERS CORP.

Effective date: 19860630