GB1458965A - Protection of boards carrying components especially electrical circuit boards carrying electronic components - Google Patents

Protection of boards carrying components especially electrical circuit boards carrying electronic components

Info

Publication number
GB1458965A
GB1458965A GB4351672A GB4351672A GB1458965A GB 1458965 A GB1458965 A GB 1458965A GB 4351672 A GB4351672 A GB 4351672A GB 4351672 A GB4351672 A GB 4351672A GB 1458965 A GB1458965 A GB 1458965A
Authority
GB
United Kingdom
Prior art keywords
components
sheet
foam
board
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4351672A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hawker Siddeley Dynamics Ltd
Original Assignee
Hawker Siddeley Dynamics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hawker Siddeley Dynamics Ltd filed Critical Hawker Siddeley Dynamics Ltd
Priority to GB4351672A priority Critical patent/GB1458965A/en
Priority to DE19732363925 priority patent/DE2363925B2/en
Priority to FR7345700A priority patent/FR2211838B1/fr
Publication of GB1458965A publication Critical patent/GB1458965A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

1458965 Moulding foam plastics HAWKER SIDDELEY DYNAMICS Ltd 20 Dec 1973 [20 Dec 1972] 43516/72 Heading B5A [Also in Division H1] A method of protecting a board carrying components, e.g. an electrical circuit board, comprises moulding a foam block, e.g. from a polyurethane or silicone material, by placing over the components a plastics sheet 4 to conform with the contours of the components without readily entering into the re-entrant angles, clamping the sheet at the board margins between mould members 3A and 3C, and with a cover 3B in place, moulding the block in contiguity with the sheet 4 and thereafter separating the board from the foam block. In Fig. 3 the boards and blocks are assembled between end plates 9 by means of tie bars 10. The terminals 8 from the boards are all arranged at one side and can be covered by a further foamed block. Before assembly adhesive can be placed between the boards and the blocks, and a resin lacquer can also be applied. The foam blocks can be sprayed with metallic paint for screening. The foam may be loaded with metal particles. The sheet can be drawn on to the components by vacuum. In the mould the board is placed on an expanded rubber sheet 5.
GB4351672A 1972-12-20 1972-12-20 Protection of boards carrying components especially electrical circuit boards carrying electronic components Expired GB1458965A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB4351672A GB1458965A (en) 1972-12-20 1972-12-20 Protection of boards carrying components especially electrical circuit boards carrying electronic components
DE19732363925 DE2363925B2 (en) 1972-12-20 1973-12-19 METHOD OF MAKING PROTECTION OF COMPONENTED PANELS
FR7345700A FR2211838B1 (en) 1972-12-20 1973-12-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4351672A GB1458965A (en) 1972-12-20 1972-12-20 Protection of boards carrying components especially electrical circuit boards carrying electronic components

Publications (1)

Publication Number Publication Date
GB1458965A true GB1458965A (en) 1976-12-22

Family

ID=10429089

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4351672A Expired GB1458965A (en) 1972-12-20 1972-12-20 Protection of boards carrying components especially electrical circuit boards carrying electronic components

Country Status (3)

Country Link
DE (1) DE2363925B2 (en)
FR (1) FR2211838B1 (en)
GB (1) GB1458965A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0811308A1 (en) * 1995-02-22 1997-12-10 Transition Automation, Inc. Board matched nested support fixture
CN112654147A (en) * 2019-10-11 2021-04-13 大陆汽车有限公司 Circuit assembly

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2744341C2 (en) * 1977-10-01 1987-04-30 Teldix Gmbh, 6900 Heidelberg Arrangement for holding circuit boards with high vibration resistance
JPS556833A (en) * 1978-06-29 1980-01-18 Nippon Mektron Kk Cirucit board and method of manufacturing same
DE4237870A1 (en) * 1992-11-10 1994-03-10 Daimler Benz Ag Electronic control appts. for road vehicle - has conductor plate acting as bearer for electronic circuit with components at least on one side
EP2882268A1 (en) * 2013-12-05 2015-06-10 Taurob GmbH Protection of electronics
DE102016213697A1 (en) 2016-07-26 2018-02-01 Zf Friedrichshafen Ag Printed circuit board assembly
DE102021110319A1 (en) 2021-04-22 2022-10-27 Yazaki Systems Technologies Gmbh Electrical system and method of manufacturing the electrical system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0811308A1 (en) * 1995-02-22 1997-12-10 Transition Automation, Inc. Board matched nested support fixture
EP0811308A4 (en) * 1995-02-22 1998-05-06 Transition Automation Inc Board matched nested support fixture
CN112654147A (en) * 2019-10-11 2021-04-13 大陆汽车有限公司 Circuit assembly

Also Published As

Publication number Publication date
FR2211838A1 (en) 1974-07-19
FR2211838B1 (en) 1979-06-22
DE2363925A1 (en) 1974-07-04
DE2363925B2 (en) 1977-02-24

Similar Documents

Publication Publication Date Title
ES8701022A1 (en) Method and apparatus for molding a frame around the periphery of a flat or curved object
JPS535255A (en) Mold for molding resin
JPS5364270A (en) Mold ejector multiplier
DE3368941D1 (en) Conductive thermoplastic resin foam and process for its production
EP0028994A3 (en) Process for the encapsulation of electronic components with the aid of a mouldable material based on a thermosetting prepolymer, and articles obtained by this process
GB1458965A (en) Protection of boards carrying components especially electrical circuit boards carrying electronic components
DE3069160D1 (en) Process for preparing resin impregnated substrates, resin impregnated substrate and electrical laminate therefrom
JPS5628835A (en) Method of molding foaming thermoplastic resin and device using said method
US3076230A (en) Mold for casting electrical component mounting boards
GB935103A (en) Methods of sealing and protecting electrical components
US3222442A (en) Method of casting electrical component mounting boards
AT378964B (en) METHOD FOR POOLING OR IMPREGNATING ELECTRICAL COMPONENTS AND FOR MOLDING MOLDED PARTS WITH EPOXY RESIN
JPS5293488A (en) Process for separating metal and thermoplastic resin from composite board
GB996335A (en) Methods of and apparatus for mounting electrical components
JPS5232075A (en) Process for separating metal and thermoplastic resin from composite board
JPS52114654A (en) Method of releasing thermosetting resin moldings from mold
DD152932A1 (en) METHOD AND DEVICE FOR THE CONTINUOUS PRODUCTION OF PLATES FROM MOLDED PLASTICS
JPS532561A (en) Device for cooling and solidifying deformed thermoplastic resin mold material
JPS533454A (en) Method and device for producing molded article from thermoplastic resin sheet
JPS51132273A (en) Method of producing reinforced molded article from thermoplastic resin sheet
JPS5221085A (en) Process for separating metal from laminated board consisting of metal and thermoplastic synthetic resin
JPS54106302A (en) Method and material for making resin gravure board
JPS56129147A (en) Foam molding
JPS5319370A (en) Method and mold for injection molding thermoplastic resin
JPS546067A (en) Method and apparatus for foam molding foamable thermoplastic resin particle

Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee