FR2206582A1 - Silicon semiconductor protected from mobile ion effects - by oxide coating contg low concn, chlorine by conditioning in oxygen/hydrogen chloride or chlorine - Google Patents

Silicon semiconductor protected from mobile ion effects - by oxide coating contg low concn, chlorine by conditioning in oxygen/hydrogen chloride or chlorine

Info

Publication number
FR2206582A1
FR2206582A1 FR7340013A FR7340013A FR2206582A1 FR 2206582 A1 FR2206582 A1 FR 2206582A1 FR 7340013 A FR7340013 A FR 7340013A FR 7340013 A FR7340013 A FR 7340013A FR 2206582 A1 FR2206582 A1 FR 2206582A1
Authority
FR
France
Prior art keywords
chlorine
conditioning
oxygen
hydrogen chloride
oxide coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7340013A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Ltd
Original Assignee
Northern Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northern Electric Co Ltd filed Critical Northern Electric Co Ltd
Publication of FR2206582A1 publication Critical patent/FR2206582A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02126Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • H01L21/02131Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being halogen doped silicon oxides, e.g. FSG
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/0223Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
    • H01L21/02233Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
    • H01L21/02236Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
    • H01L21/02238Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02255Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02296Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02321Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment introduction of substances into an already existing insulating layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02296Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02337Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
FR7340013A 1972-11-10 1973-11-09 Silicon semiconductor protected from mobile ion effects - by oxide coating contg low concn, chlorine by conditioning in oxygen/hydrogen chloride or chlorine Withdrawn FR2206582A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US30560172A 1972-11-10 1972-11-10

Publications (1)

Publication Number Publication Date
FR2206582A1 true FR2206582A1 (en) 1974-06-07

Family

ID=23181491

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7340013A Withdrawn FR2206582A1 (en) 1972-11-10 1973-11-09 Silicon semiconductor protected from mobile ion effects - by oxide coating contg low concn, chlorine by conditioning in oxygen/hydrogen chloride or chlorine

Country Status (4)

Country Link
JP (1) JPS4996674A (cs)
DE (1) DE2356170A1 (cs)
FR (1) FR2206582A1 (cs)
NL (1) NL7315136A (cs)

Also Published As

Publication number Publication date
JPS4996674A (cs) 1974-09-12
DE2356170A1 (de) 1974-05-22
NL7315136A (cs) 1974-05-14

Similar Documents

Publication Publication Date Title
Deal Thermal oxidation kinetics of silicon in pyrogenic H 2 O and 5% HCl/H 2 O mixtures
GB1266002A (cs)
US7618901B2 (en) Process for growing a dielectric layer on a silicon-containing surface using a mixture of N2O and O3
IE32133B1 (en) Improvements in or relating to semiconductor insulated gate field effect devices
GB1499090A (en) Field effect transistor structure
FR2206582A1 (en) Silicon semiconductor protected from mobile ion effects - by oxide coating contg low concn, chlorine by conditioning in oxygen/hydrogen chloride or chlorine
GB1046157A (en) Improvements in or relating to the manufacture of semiconductor devices
GB935244A (en) Improvements in or relating to methods of electrically insulating surfaces and to electrical devices so insulated
GB2374980A (en) Method of forming a conductive silicide layer on a silicon comprising substrate and method of forming a conducyive silicide contact
KR960039197A (ko) 실리콘 산화막의 형성방법 및 반도체 장치의 제조방법
GB1299811A (en) Semiconductor integrated circuit device
Badcock et al. Stability and surface charge in the MOS system
JPS54106180A (en) Manufacture of semiconductor integrated circuit
JPS5214367A (en) Semiconductor device on which the phosphosilicate glass layer is formed
Koval et al. The Electron Spectroscopy of the Initial Stages of the Interaction of Oxygen With the(100) Face of Silicon
JPS57102071A (en) Manufacture of semiconductor device
FR2235482A1 (en) Eliminating interface states in MIOS structures - at low temp to avoid degradation of electrical props
JPS5469964A (en) Production of semiconductor device
JPS5527854A (en) Production of silicon dioxide thin film
JPS55166960A (en) Manufacture of field effect semiconductor device
JPS5378180A (en) Manufacture of semiconductor device
JPS5650573A (en) Mis tunnel diode type mosfet
JPS51135366A (en) Method of forming electrode film on silicon semiconductor device
JPS6441245A (en) Manufacture of semiconductor device
JPS5227362A (en) Formation method of passivation film

Legal Events

Date Code Title Description
ST Notification of lapse