FR2181017B1 - - Google Patents

Info

Publication number
FR2181017B1
FR2181017B1 FR7314405A FR7314405A FR2181017B1 FR 2181017 B1 FR2181017 B1 FR 2181017B1 FR 7314405 A FR7314405 A FR 7314405A FR 7314405 A FR7314405 A FR 7314405A FR 2181017 B1 FR2181017 B1 FR 2181017B1
Authority
FR
France
Prior art keywords
leads
acid
polyamic acid
amine
solvents
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7314405A
Other languages
English (en)
French (fr)
Other versions
FR2181017A1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westinghouse Electric Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of FR2181017A1 publication Critical patent/FR2181017A1/fr
Application granted granted Critical
Publication of FR2181017B1 publication Critical patent/FR2181017B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • C09D5/4419—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications with polymers obtained otherwise than by polymerisation reactions only involving carbon-to-carbon unsaturated bonds
    • C09D5/4461—Polyamides; Polyimides
    • H10W70/458—
    • H10W70/465—
    • H10W72/20—
    • H10W74/121—
    • H10W74/127—
    • H10W74/47—
    • H10W74/473—
    • H10W72/5522—
    • H10W72/5524—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Paints Or Removers (AREA)
  • Details Of Resistors (AREA)
FR7314405A 1972-04-19 1973-04-19 Expired FR2181017B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00245416A US3821099A (en) 1972-04-19 1972-04-19 Process for producing encapsulated solid state electronic devices having a sealed lead- encapsulant interface

Publications (2)

Publication Number Publication Date
FR2181017A1 FR2181017A1 (enExample) 1973-11-30
FR2181017B1 true FR2181017B1 (enExample) 1978-08-04

Family

ID=22926564

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7314405A Expired FR2181017B1 (enExample) 1972-04-19 1973-04-19

Country Status (12)

Country Link
US (1) US3821099A (enExample)
JP (1) JPS5222371B2 (enExample)
BE (1) BE798379A (enExample)
BR (1) BR7302853D0 (enExample)
CA (1) CA962371A (enExample)
ES (1) ES413891A1 (enExample)
FR (1) FR2181017B1 (enExample)
GB (1) GB1428179A (enExample)
HK (1) HK72976A (enExample)
IN (1) IN138750B (enExample)
IT (1) IT984017B (enExample)
ZA (1) ZA732151B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2535074A1 (de) * 1974-11-29 1976-08-12 Ibm Korrosionsfestes elektrisches bauteil mit integrierten schaltungen
JPH0776440B2 (ja) * 1986-10-29 1995-08-16 三井東圧化学株式会社 金属の被覆方法
US5045151A (en) * 1989-10-17 1991-09-03 Massachusetts Institute Of Technology Micromachined bonding surfaces and method of forming the same
CN102816441B (zh) * 2012-08-16 2014-05-28 西安近代化学研究所 一种用于火炮塑性测压器的测压油脂及其制备方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3486084A (en) * 1968-03-19 1969-12-23 Westinghouse Electric Corp Encapsulated semiconductor device

Also Published As

Publication number Publication date
ZA732151B (en) 1974-06-26
HK72976A (en) 1976-12-03
JPS5222371B2 (enExample) 1977-06-17
US3821099A (en) 1974-06-28
FR2181017A1 (enExample) 1973-11-30
BR7302853D0 (pt) 1974-07-11
JPS49108977A (enExample) 1974-10-16
GB1428179A (en) 1976-03-17
ES413891A1 (es) 1976-06-16
CA962371A (en) 1975-02-04
BE798379A (fr) 1973-10-18
IN138750B (enExample) 1976-03-27
IT984017B (it) 1974-11-20

Similar Documents

Publication Publication Date Title
US4729797A (en) Process for removal of cured epoxy
US3684592A (en) Passivated surfaces and protective coatings for semiconductor devices and processes for producing the same
CN107768342B (zh) 具有用于将电感器连接到一个或一个以上晶体管的预成形电连接部的功率开关封装
ES8407625A1 (es) Metodo para encapsular circuitos electronicos
FR2181017B1 (enExample)
JP2017110051A (ja) 封止用樹脂組成物、半導体装置および車載用電子制御ユニット
GB1098752A (en) A semiconductor device
JPH0381243B2 (enExample)
GB1330528A (en) Mounting device for semiconductor wafers for use in the manu facture of semiconductor devices
US2883592A (en) Encapsulated selenium rectifiers
IT981202B (it) Procedimento per fissare circui ti microminiaturizzati a moduli di supporto e composto adesivo isolante impiegato in tale pro cedimento
GB1206759A (en) Semiconductor devices
JPS61133225A (ja) 半導体封止用エボキシ樹脂成形材料
KR20070083889A (ko) 수지로 피복한 고내전압 반도체 장치 및 그 제조 방법
GB1261378A (en) Improvements relating to the encapsulation of semiconductor devices and other electrical components
JPH0680753B2 (ja) 樹脂封止半導体装置
JPS62192445A (ja) 封止用エポキシ樹脂成形材料
US3341938A (en) Method of producing selenium midget rectifiers
JPS62192447A (ja) 半導体封止用エポキシ樹脂成形材料
JPS61133226A (ja) 半導体封止用エポキシ樹脂成形材料
JPS62192446A (ja) 封止用エポキシ樹脂成形材料
CS268940B1 (cs) Způsob zapouzdřeni elβktronických a elektrotechnických součistek
JP2018154791A (ja) 封止用樹脂組成物、半導体装置および車載用電子制御ユニット
GB1288058A (enExample)
JPS61113240A (ja) 電子部品の封止方法

Legal Events

Date Code Title Description
ST Notification of lapse