IT984017B - Dispositivi elettronici allo stato solido incapsulati con fili conduttori collegati a tenuta ermetica - Google Patents

Dispositivi elettronici allo stato solido incapsulati con fili conduttori collegati a tenuta ermetica

Info

Publication number
IT984017B
IT984017B IT23239/73A IT2323973A IT984017B IT 984017 B IT984017 B IT 984017B IT 23239/73 A IT23239/73 A IT 23239/73A IT 2323973 A IT2323973 A IT 2323973A IT 984017 B IT984017 B IT 984017B
Authority
IT
Italy
Prior art keywords
leads
acid
polyamic acid
amine
solvents
Prior art date
Application number
IT23239/73A
Other languages
English (en)
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Application granted granted Critical
Publication of IT984017B publication Critical patent/IT984017B/it

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • C09D5/4419Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications with polymers obtained otherwise than by polymerisation reactions only involving carbon-to-carbon unsaturated bonds
    • C09D5/4461Polyamides; Polyimides
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
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    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • H01L23/295Organic, e.g. plastic containing a filler
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    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135Double encapsulation or coating and encapsulation
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    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2924/3025Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Molecular Biology (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Details Of Resistors (AREA)
  • Paints Or Removers (AREA)
IT23239/73A 1972-04-19 1973-04-19 Dispositivi elettronici allo stato solido incapsulati con fili conduttori collegati a tenuta ermetica IT984017B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00245416A US3821099A (en) 1972-04-19 1972-04-19 Process for producing encapsulated solid state electronic devices having a sealed lead- encapsulant interface

Publications (1)

Publication Number Publication Date
IT984017B true IT984017B (it) 1974-11-20

Family

ID=22926564

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23239/73A IT984017B (it) 1972-04-19 1973-04-19 Dispositivi elettronici allo stato solido incapsulati con fili conduttori collegati a tenuta ermetica

Country Status (12)

Country Link
US (1) US3821099A (it)
JP (1) JPS5222371B2 (it)
BE (1) BE798379A (it)
BR (1) BR7302853D0 (it)
CA (1) CA962371A (it)
ES (1) ES413891A1 (it)
FR (1) FR2181017B1 (it)
GB (1) GB1428179A (it)
HK (1) HK72976A (it)
IN (1) IN138750B (it)
IT (1) IT984017B (it)
ZA (1) ZA732151B (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2535074A1 (de) * 1974-11-29 1976-08-12 Ibm Korrosionsfestes elektrisches bauteil mit integrierten schaltungen
JPH0776440B2 (ja) * 1986-10-29 1995-08-16 三井東圧化学株式会社 金属の被覆方法
US5045151A (en) * 1989-10-17 1991-09-03 Massachusetts Institute Of Technology Micromachined bonding surfaces and method of forming the same
CN102816441B (zh) * 2012-08-16 2014-05-28 西安近代化学研究所 一种用于火炮塑性测压器的测压油脂及其制备方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3486084A (en) * 1968-03-19 1969-12-23 Westinghouse Electric Corp Encapsulated semiconductor device

Also Published As

Publication number Publication date
HK72976A (en) 1976-12-03
ZA732151B (en) 1974-06-26
JPS5222371B2 (it) 1977-06-17
ES413891A1 (es) 1976-06-16
CA962371A (en) 1975-02-04
JPS49108977A (it) 1974-10-16
US3821099A (en) 1974-06-28
FR2181017B1 (it) 1978-08-04
IN138750B (it) 1976-03-27
FR2181017A1 (it) 1973-11-30
BR7302853D0 (pt) 1974-07-11
GB1428179A (en) 1976-03-17
BE798379A (fr) 1973-10-18

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