BR7302853D0 - Dispositivo eletronico de estado solido,dispositivo semicondutor, e processo para revestir uma conexao metalica - Google Patents

Dispositivo eletronico de estado solido,dispositivo semicondutor, e processo para revestir uma conexao metalica

Info

Publication number
BR7302853D0
BR7302853D0 BR2853/73A BR285373A BR7302853D0 BR 7302853 D0 BR7302853 D0 BR 7302853D0 BR 2853/73 A BR2853/73 A BR 2853/73A BR 285373 A BR285373 A BR 285373A BR 7302853 D0 BR7302853 D0 BR 7302853D0
Authority
BR
Brazil
Prior art keywords
solid
cover
metal connection
state electronic
electronic device
Prior art date
Application number
BR2853/73A
Other languages
English (en)
Portuguese (pt)
Inventor
J Szedon
D Phillips
J Jackson
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of BR7302853D0 publication Critical patent/BR7302853D0/pt

Links

Classifications

    • H10W72/00—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • C09D5/4419—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications with polymers obtained otherwise than by polymerisation reactions only involving carbon-to-carbon unsaturated bonds
    • C09D5/4461—Polyamides; Polyimides
    • H10W70/458—
    • H10W70/465—
    • H10W72/20—
    • H10W74/121—
    • H10W74/127—
    • H10W74/47—
    • H10W74/473—
    • H10W72/5522—
    • H10W72/5524—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Paints Or Removers (AREA)
  • Details Of Resistors (AREA)
BR2853/73A 1972-04-19 1973-04-18 Dispositivo eletronico de estado solido,dispositivo semicondutor, e processo para revestir uma conexao metalica BR7302853D0 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00245416A US3821099A (en) 1972-04-19 1972-04-19 Process for producing encapsulated solid state electronic devices having a sealed lead- encapsulant interface

Publications (1)

Publication Number Publication Date
BR7302853D0 true BR7302853D0 (pt) 1974-07-11

Family

ID=22926564

Family Applications (1)

Application Number Title Priority Date Filing Date
BR2853/73A BR7302853D0 (pt) 1972-04-19 1973-04-18 Dispositivo eletronico de estado solido,dispositivo semicondutor, e processo para revestir uma conexao metalica

Country Status (12)

Country Link
US (1) US3821099A (enExample)
JP (1) JPS5222371B2 (enExample)
BE (1) BE798379A (enExample)
BR (1) BR7302853D0 (enExample)
CA (1) CA962371A (enExample)
ES (1) ES413891A1 (enExample)
FR (1) FR2181017B1 (enExample)
GB (1) GB1428179A (enExample)
HK (1) HK72976A (enExample)
IN (1) IN138750B (enExample)
IT (1) IT984017B (enExample)
ZA (1) ZA732151B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2535074A1 (de) * 1974-11-29 1976-08-12 Ibm Korrosionsfestes elektrisches bauteil mit integrierten schaltungen
JPH0776440B2 (ja) * 1986-10-29 1995-08-16 三井東圧化学株式会社 金属の被覆方法
US5045151A (en) * 1989-10-17 1991-09-03 Massachusetts Institute Of Technology Micromachined bonding surfaces and method of forming the same
CN102816441B (zh) * 2012-08-16 2014-05-28 西安近代化学研究所 一种用于火炮塑性测压器的测压油脂及其制备方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3486084A (en) * 1968-03-19 1969-12-23 Westinghouse Electric Corp Encapsulated semiconductor device

Also Published As

Publication number Publication date
ZA732151B (en) 1974-06-26
HK72976A (en) 1976-12-03
JPS5222371B2 (enExample) 1977-06-17
US3821099A (en) 1974-06-28
FR2181017A1 (enExample) 1973-11-30
JPS49108977A (enExample) 1974-10-16
GB1428179A (en) 1976-03-17
ES413891A1 (es) 1976-06-16
FR2181017B1 (enExample) 1978-08-04
CA962371A (en) 1975-02-04
BE798379A (fr) 1973-10-18
IN138750B (enExample) 1976-03-27
IT984017B (it) 1974-11-20

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