FR2111779A1 - - Google Patents
Info
- Publication number
- FR2111779A1 FR2111779A1 FR7138136A FR7138136A FR2111779A1 FR 2111779 A1 FR2111779 A1 FR 2111779A1 FR 7138136 A FR7138136 A FR 7138136A FR 7138136 A FR7138136 A FR 7138136A FR 2111779 A1 FR2111779 A1 FR 2111779A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/34—Electroplating: Baths therefor from solutions of lead
- C25D3/36—Electroplating: Baths therefor from solutions of lead characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8322970A | 1970-10-22 | 1970-10-22 | |
US16010971A | 1971-07-06 | 1971-07-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2111779A1 true FR2111779A1 (de) | 1972-06-09 |
FR2111779B1 FR2111779B1 (de) | 1975-02-07 |
Family
ID=26769076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7138136A Expired FR2111779B1 (de) | 1970-10-22 | 1971-10-22 |
Country Status (8)
Country | Link |
---|---|
US (2) | US3785939A (de) |
AU (1) | AU458608B2 (de) |
CA (1) | CA972704A (de) |
DE (1) | DE2152785C2 (de) |
FR (1) | FR2111779B1 (de) |
GB (1) | GB1368318A (de) |
MY (1) | MY7500186A (de) |
SE (1) | SE392132B (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2163453A1 (de) * | 1971-12-16 | 1973-07-27 | M & T Chemicals Inc | |
FR2409327A1 (fr) * | 1977-11-16 | 1979-06-15 | Dipsol Chem | Bains d'electroplacage pour le depot brillant d'etain ou d'alliages d'etain |
FR2503192A1 (fr) * | 1981-04-02 | 1982-10-08 | Hooker Chemicals Plastics Corp | Bain de revetement electrolytique pour le depot d'etain ou d'alliages d'etain renfermant notamment une amine aromatique et un acide sulfonique aromatique |
EP0196232A2 (de) * | 1985-03-26 | 1986-10-01 | Mcgean-Rohco, Inc. | Plattierungsbad und Verfahren zum Elektroplattieren von Zinn und/oder Blei |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3926749A (en) * | 1971-12-20 | 1975-12-16 | M & T Chemicals Inc | Tin-lead alloy plating |
GB1469547A (en) * | 1973-06-28 | 1977-04-06 | Minnesota Mining & Mfg | Tin/lead electr-plating baths |
US3875029A (en) * | 1974-02-19 | 1975-04-01 | R O Hull & Company Inc | Plating bath for electrodeposition of bright tin and tin-lead alloy |
US4053372A (en) * | 1975-10-09 | 1977-10-11 | Amp Incorporated | Tin-lead acidic plating bath |
CA1077430A (en) * | 1975-11-28 | 1980-05-13 | Minnesota Mining And Manufacturing Company | Electroplating bath for the electrodeposition of tin and tin/cadmium deposits |
US4207148A (en) * | 1975-11-28 | 1980-06-10 | Minnesota Mining And Manufacturing Company | Electroplating bath for the electrodeposition of tin and tin/cadmium deposits |
US4067781A (en) * | 1977-01-10 | 1978-01-10 | Rapids Felix R | Method for electroplating |
US4135991A (en) * | 1977-08-12 | 1979-01-23 | R. O. Hull & Company, Inc. | Bath and method for electroplating tin and/or lead |
SE8204505L (sv) * | 1981-09-08 | 1983-03-09 | Occidental Chem Co | Elektropletering for avsettning av tenn-blylegeringar pa olika underlag |
US5066367B1 (en) * | 1981-09-11 | 1993-12-21 | I. Nobel Fred | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
US4871429A (en) * | 1981-09-11 | 1989-10-03 | Learonal, Inc | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
US5094726B1 (en) * | 1981-09-11 | 1993-12-21 | I. Nobel Fred | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
US4765871A (en) * | 1981-12-28 | 1988-08-23 | The Boeing Company | Zinc-nickel electroplated article and method for producing the same |
US4717460A (en) * | 1983-12-22 | 1988-01-05 | Learonal, Inc. | Tin lead electroplating solutions |
US4701244A (en) * | 1983-12-22 | 1987-10-20 | Learonal, Inc. | Bath and process for electroplating tin, lead and tin/alloys |
US4640746A (en) * | 1984-10-11 | 1987-02-03 | Learonal, Inc. | Bath and process for plating tin/lead alloys on composite substrates |
DE3440668A1 (de) * | 1984-11-07 | 1986-05-07 | Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen | Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen |
US4681670A (en) * | 1985-09-11 | 1987-07-21 | Learonal, Inc. | Bath and process for plating tin-lead alloys |
EP0652306B1 (de) * | 1987-12-10 | 2000-09-27 | LeaRonal, Inc. | Zinn, Blei- oder Zinn-Blei-Legierungselektrolyten für Elektroplattieren bei hoher Geschwindigkeit |
US5174887A (en) * | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
US4844780A (en) * | 1988-02-17 | 1989-07-04 | Maclee Chemical Company, Inc. | Brightener and aqueous plating bath for tin and/or lead |
US4849059A (en) * | 1988-09-13 | 1989-07-18 | Macdermid, Incorporated | Aqueous electroplating bath and method for electroplating tin and/or lead and a defoaming agent therefor |
US4885064A (en) * | 1989-05-22 | 1989-12-05 | Mcgean-Rohco, Inc. | Additive composition, plating bath and method for electroplating tin and/or lead |
AU2927392A (en) * | 1991-11-01 | 1993-06-07 | National-Standard Company | Age resistant solder coatings |
US5698087A (en) * | 1992-03-11 | 1997-12-16 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
US5346607A (en) * | 1992-09-30 | 1994-09-13 | Weirton Steel Corporation | Electrolytic tinplating and product |
DE4422756C1 (de) * | 1994-06-29 | 1995-04-20 | Goldschmidt Ag Th | Selbstregulierende, saure Elektrolyte zur Tauchverzinnung von Aluminiumlegierungen |
US5560813A (en) * | 1994-09-09 | 1996-10-01 | National Science Council | Solder electroplating solution containing gelatin |
US8974386B2 (en) | 1998-04-30 | 2015-03-10 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
US20080076997A1 (en) * | 1998-04-30 | 2008-03-27 | Abbott Diabetes Care, Inc. | Analyte monitoring device and methods of use |
US8346337B2 (en) | 1998-04-30 | 2013-01-01 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
US6949816B2 (en) | 2003-04-21 | 2005-09-27 | Motorola, Inc. | Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing same |
US8688188B2 (en) | 1998-04-30 | 2014-04-01 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
US8465425B2 (en) | 1998-04-30 | 2013-06-18 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
US9066695B2 (en) * | 1998-04-30 | 2015-06-30 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
US6175752B1 (en) * | 1998-04-30 | 2001-01-16 | Therasense, Inc. | Analyte monitoring device and methods of use |
US8480580B2 (en) | 1998-04-30 | 2013-07-09 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
US6560471B1 (en) * | 2001-01-02 | 2003-05-06 | Therasense, Inc. | Analyte monitoring device and methods of use |
US6582582B2 (en) | 2001-03-09 | 2003-06-24 | Donald Becking | Electroplating composition and process |
AU2002309528A1 (en) * | 2001-04-02 | 2002-10-15 | Therasense, Inc. | Blood glucose tracking apparatus and methods |
US6562221B2 (en) | 2001-09-28 | 2003-05-13 | David Crotty | Process and composition for high speed plating of tin and tin alloys |
JP2004002970A (ja) * | 2002-03-05 | 2004-01-08 | Shipley Co Llc | スズ又はスズ合金電気メッキ浴液における酸化によるスズ損失の制限 |
US7273540B2 (en) * | 2002-07-25 | 2007-09-25 | Shinryo Electronics Co., Ltd. | Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
EP1578262A4 (de) | 2002-12-31 | 2007-12-05 | Therasense Inc | Kontinuierliches blutzuckerüberwachungssystem und anwendungsverfahren |
US20080064937A1 (en) * | 2006-06-07 | 2008-03-13 | Abbott Diabetes Care, Inc. | Analyte monitoring system and method |
JP5622360B2 (ja) * | 2009-01-16 | 2014-11-12 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 電気錫めっき液および電気錫めっき方法 |
US8834958B2 (en) | 2011-07-08 | 2014-09-16 | The United States Of America As Represented By The Secretary Of The Army | Process of making negative electrode |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2460252A (en) * | 1946-02-09 | 1949-01-25 | Harshaw Chem Corp | Lead-tin alloy plating |
BE508197A (de) * | 1951-01-12 | |||
US2773819A (en) * | 1954-01-13 | 1956-12-11 | Harshaw Chem Corp | Electrodeposition of lead |
AT252681B (de) * | 1963-08-28 | 1967-03-10 | Max Schloetter Fa Dr Ing | Galvanische Bäder zur elektrolytischen Abscheidung blanker bis glänzender Zinnschichten |
NL124247C (de) * | 1963-08-28 | |||
NL128321C (de) * | 1965-02-13 | |||
GB1151460A (en) * | 1967-10-09 | 1969-05-07 | Motohiko Kanai | Improvements in and relating to the Electroplating of Tin-Lead Alloy |
US3661730A (en) * | 1969-09-22 | 1972-05-09 | Kazuo Nishihara | Process for the formation of a super-bright solder coating |
-
1970
- 1970-10-22 US US00083229A patent/US3785939A/en not_active Expired - Lifetime
-
1971
- 1971-07-06 US US00160109A patent/US3769182A/en not_active Expired - Lifetime
- 1971-10-20 SE SE7113286A patent/SE392132B/xx unknown
- 1971-10-21 AU AU34842/71A patent/AU458608B2/en not_active Expired
- 1971-10-21 CA CA125,761A patent/CA972704A/en not_active Expired
- 1971-10-22 FR FR7138136A patent/FR2111779B1/fr not_active Expired
- 1971-10-22 DE DE2152785A patent/DE2152785C2/de not_active Expired
- 1971-11-22 GB GB4925671A patent/GB1368318A/en not_active Expired
-
1975
- 1975-12-30 MY MY186/75A patent/MY7500186A/xx unknown
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2163453A1 (de) * | 1971-12-16 | 1973-07-27 | M & T Chemicals Inc | |
FR2409327A1 (fr) * | 1977-11-16 | 1979-06-15 | Dipsol Chem | Bains d'electroplacage pour le depot brillant d'etain ou d'alliages d'etain |
FR2503192A1 (fr) * | 1981-04-02 | 1982-10-08 | Hooker Chemicals Plastics Corp | Bain de revetement electrolytique pour le depot d'etain ou d'alliages d'etain renfermant notamment une amine aromatique et un acide sulfonique aromatique |
EP0196232A2 (de) * | 1985-03-26 | 1986-10-01 | Mcgean-Rohco, Inc. | Plattierungsbad und Verfahren zum Elektroplattieren von Zinn und/oder Blei |
EP0196232A3 (en) * | 1985-03-26 | 1987-04-01 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
Also Published As
Publication number | Publication date |
---|---|
AU458608B2 (en) | 1975-03-06 |
AU3484271A (en) | 1973-05-03 |
CA972704A (en) | 1975-08-12 |
DE2152785A1 (de) | 1972-05-04 |
SE392132B (sv) | 1977-03-14 |
DE2152785C2 (de) | 1982-07-01 |
MY7500186A (en) | 1975-12-31 |
GB1368318A (en) | 1974-09-25 |
US3769182A (en) | 1973-10-30 |
US3785939A (en) | 1974-01-15 |
FR2111779B1 (de) | 1975-02-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |