CA972704A - Bath and method for electrodepositing tin and/or lead - Google Patents

Bath and method for electrodepositing tin and/or lead

Info

Publication number
CA972704A
CA972704A CA125,761A CA125761A CA972704A CA 972704 A CA972704 A CA 972704A CA 125761 A CA125761 A CA 125761A CA 972704 A CA972704 A CA 972704A
Authority
CA
Canada
Prior art keywords
bath
lead
electrodepositing tin
electrodepositing
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA125,761A
Other languages
English (en)
Other versions
CA125761S (en
Inventor
Grace F. Hsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26769076&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CA972704(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Application granted granted Critical
Publication of CA972704A publication Critical patent/CA972704A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/34—Electroplating: Baths therefor from solutions of lead
    • C25D3/36—Electroplating: Baths therefor from solutions of lead characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CA125,761A 1970-10-22 1971-10-21 Bath and method for electrodepositing tin and/or lead Expired CA972704A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8322970A 1970-10-22 1970-10-22
US16010971A 1971-07-06 1971-07-06

Publications (1)

Publication Number Publication Date
CA972704A true CA972704A (en) 1975-08-12

Family

ID=26769076

Family Applications (1)

Application Number Title Priority Date Filing Date
CA125,761A Expired CA972704A (en) 1970-10-22 1971-10-21 Bath and method for electrodepositing tin and/or lead

Country Status (8)

Country Link
US (2) US3785939A (de)
AU (1) AU458608B2 (de)
CA (1) CA972704A (de)
DE (1) DE2152785C2 (de)
FR (1) FR2111779B1 (de)
GB (1) GB1368318A (de)
MY (1) MY7500186A (de)
SE (1) SE392132B (de)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3749649A (en) * 1971-12-16 1973-07-31 M & T Chemicals Inc Bright tin-lead alloy plating
US3926749A (en) * 1971-12-20 1975-12-16 M & T Chemicals Inc Tin-lead alloy plating
GB1469547A (en) * 1973-06-28 1977-04-06 Minnesota Mining & Mfg Tin/lead electr-plating baths
US3875029A (en) * 1974-02-19 1975-04-01 R O Hull & Company Inc Plating bath for electrodeposition of bright tin and tin-lead alloy
US4053372A (en) * 1975-10-09 1977-10-11 Amp Incorporated Tin-lead acidic plating bath
US4207148A (en) * 1975-11-28 1980-06-10 Minnesota Mining And Manufacturing Company Electroplating bath for the electrodeposition of tin and tin/cadmium deposits
CA1077430A (en) * 1975-11-28 1980-05-13 Minnesota Mining And Manufacturing Company Electroplating bath for the electrodeposition of tin and tin/cadmium deposits
US4067781A (en) * 1977-01-10 1978-01-10 Rapids Felix R Method for electroplating
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
GB2013241B (en) * 1977-11-16 1982-03-24 Dipsol Chem Electroplating bath for depositing tin or tin alloy with brightness
US4347107A (en) * 1981-04-02 1982-08-31 Hooker Chemicals & Plastics Corp. Electroplating tin and tin alloys and baths therefor
SE8204505L (sv) * 1981-09-08 1983-03-09 Occidental Chem Co Elektropletering for avsettning av tenn-blylegeringar pa olika underlag
US5094726B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5066367B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4765871A (en) * 1981-12-28 1988-08-23 The Boeing Company Zinc-nickel electroplated article and method for producing the same
US4701244A (en) * 1983-12-22 1987-10-20 Learonal, Inc. Bath and process for electroplating tin, lead and tin/alloys
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
US4640746A (en) * 1984-10-11 1987-02-03 Learonal, Inc. Bath and process for plating tin/lead alloys on composite substrates
DE3440668A1 (de) * 1984-11-07 1986-05-07 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US4681670A (en) * 1985-09-11 1987-07-21 Learonal, Inc. Bath and process for plating tin-lead alloys
EP0319997B1 (de) * 1987-12-10 1995-10-04 LeaRonal, Inc. Zinn-, Blei- und Zinn-Blei-Legierungs-Elektrolyten für Elekroplattieren bei hoher Geschwindigkeit
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
US4844780A (en) * 1988-02-17 1989-07-04 Maclee Chemical Company, Inc. Brightener and aqueous plating bath for tin and/or lead
US4849059A (en) * 1988-09-13 1989-07-18 Macdermid, Incorporated Aqueous electroplating bath and method for electroplating tin and/or lead and a defoaming agent therefor
US4885064A (en) * 1989-05-22 1989-12-05 Mcgean-Rohco, Inc. Additive composition, plating bath and method for electroplating tin and/or lead
AU2927392A (en) * 1991-11-01 1993-06-07 National-Standard Company Age resistant solder coatings
US5698087A (en) * 1992-03-11 1997-12-16 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US5346607A (en) * 1992-09-30 1994-09-13 Weirton Steel Corporation Electrolytic tinplating and product
DE4422756C1 (de) * 1994-06-29 1995-04-20 Goldschmidt Ag Th Selbstregulierende, saure Elektrolyte zur Tauchverzinnung von Aluminiumlegierungen
US5560813A (en) * 1994-09-09 1996-10-01 National Science Council Solder electroplating solution containing gelatin
US6175752B1 (en) * 1998-04-30 2001-01-16 Therasense, Inc. Analyte monitoring device and methods of use
US9066695B2 (en) * 1998-04-30 2015-06-30 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US8688188B2 (en) 1998-04-30 2014-04-01 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US8465425B2 (en) 1998-04-30 2013-06-18 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US8480580B2 (en) 1998-04-30 2013-07-09 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US20080076997A1 (en) * 1998-04-30 2008-03-27 Abbott Diabetes Care, Inc. Analyte monitoring device and methods of use
US6949816B2 (en) 2003-04-21 2005-09-27 Motorola, Inc. Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing same
US8346337B2 (en) * 1998-04-30 2013-01-01 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US8974386B2 (en) 1998-04-30 2015-03-10 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US6560471B1 (en) 2001-01-02 2003-05-06 Therasense, Inc. Analyte monitoring device and methods of use
US6582582B2 (en) 2001-03-09 2003-06-24 Donald Becking Electroplating composition and process
US7041468B2 (en) * 2001-04-02 2006-05-09 Therasense, Inc. Blood glucose tracking apparatus and methods
US6562221B2 (en) 2001-09-28 2003-05-13 David Crotty Process and composition for high speed plating of tin and tin alloys
JP2004002970A (ja) * 2002-03-05 2004-01-08 Shipley Co Llc スズ又はスズ合金電気メッキ浴液における酸化によるスズ損失の制限
US7273540B2 (en) * 2002-07-25 2007-09-25 Shinryo Electronics Co., Ltd. Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
AU2003303597A1 (en) 2002-12-31 2004-07-29 Therasense, Inc. Continuous glucose monitoring system and methods of use
US20080071157A1 (en) * 2006-06-07 2008-03-20 Abbott Diabetes Care, Inc. Analyte monitoring system and method
JP5622360B2 (ja) * 2009-01-16 2014-11-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気錫めっき液および電気錫めっき方法
US8834958B2 (en) 2011-07-08 2014-09-16 The United States Of America As Represented By The Secretary Of The Army Process of making negative electrode

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2460252A (en) * 1946-02-09 1949-01-25 Harshaw Chem Corp Lead-tin alloy plating
BE508197A (de) * 1951-01-12
US2773819A (en) * 1954-01-13 1956-12-11 Harshaw Chem Corp Electrodeposition of lead
AT252681B (de) * 1963-08-28 1967-03-10 Max Schloetter Fa Dr Ing Galvanische Bäder zur elektrolytischen Abscheidung blanker bis glänzender Zinnschichten
NL124247C (de) * 1963-08-28
NL128321C (de) * 1965-02-13
GB1151460A (en) * 1967-10-09 1969-05-07 Motohiko Kanai Improvements in and relating to the Electroplating of Tin-Lead Alloy
US3661730A (en) * 1969-09-22 1972-05-09 Kazuo Nishihara Process for the formation of a super-bright solder coating

Also Published As

Publication number Publication date
MY7500186A (en) 1975-12-31
US3769182A (en) 1973-10-30
AU3484271A (en) 1973-05-03
US3785939A (en) 1974-01-15
DE2152785A1 (de) 1972-05-04
FR2111779B1 (de) 1975-02-07
FR2111779A1 (de) 1972-06-09
GB1368318A (en) 1974-09-25
AU458608B2 (en) 1975-03-06
SE392132B (sv) 1977-03-14
DE2152785C2 (de) 1982-07-01

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