FR2409327A1 - Bains d'electroplacage pour le depot brillant d'etain ou d'alliages d'etain - Google Patents

Bains d'electroplacage pour le depot brillant d'etain ou d'alliages d'etain

Info

Publication number
FR2409327A1
FR2409327A1 FR7832240A FR7832240A FR2409327A1 FR 2409327 A1 FR2409327 A1 FR 2409327A1 FR 7832240 A FR7832240 A FR 7832240A FR 7832240 A FR7832240 A FR 7832240A FR 2409327 A1 FR2409327 A1 FR 2409327A1
Authority
FR
France
Prior art keywords
tin
brilliant
electroplacing
baths
alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7832240A
Other languages
English (en)
Other versions
FR2409327B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dipsol Chemicals Co Ltd
Original Assignee
Dipsol Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP13673077A external-priority patent/JPS5948874B2/ja
Priority claimed from JP13673177A external-priority patent/JPS5948875B2/ja
Application filed by Dipsol Chemicals Co Ltd filed Critical Dipsol Chemicals Co Ltd
Publication of FR2409327A1 publication Critical patent/FR2409327A1/fr
Application granted granted Critical
Publication of FR2409327B1 publication Critical patent/FR2409327B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

L'INVENTION CONCERNE L'INDUSTRIE DE L'ELECTROPLASTIE. BAIN DE PLACAGE ELECTROLYTIQUE PERMETTANT D'OBTENIR DES DEPOTS BRILLANTS D'ETAIN, COMPRENANT UN BAIN-MERE, DE PH 4 A 8, ET CONTENANT DE L'ACIDE CITRIQUE, UN SEL D'AMMONIUM ET UN POLYMERE SOLUBLE DANS L'EAU, COMME AGENT DE BRILLANTAGE, EVENTUELLEMENT ADDITIONNE D'UN ALDEHYDE COMME ADJUVANT DE BRILLANTAGE. APPLICATION A L'ELECTROPLACAGE BRILLANT PAR L'ETAIN OU SES ALLIAGES.
FR7832240A 1977-11-16 1978-11-15 Bains d'electroplacage pour le depot brillant d'etain ou d'alliages d'etain Granted FR2409327A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13673077A JPS5948874B2 (ja) 1977-11-16 1977-11-16 クエン酸系光沢錫または錫合金めつき浴
JP13673177A JPS5948875B2 (ja) 1977-11-16 1977-11-16 クエン酸系光沢錫または錫合金めつき浴

Publications (2)

Publication Number Publication Date
FR2409327A1 true FR2409327A1 (fr) 1979-06-15
FR2409327B1 FR2409327B1 (fr) 1981-02-20

Family

ID=26470233

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7832240A Granted FR2409327A1 (fr) 1977-11-16 1978-11-15 Bains d'electroplacage pour le depot brillant d'etain ou d'alliages d'etain

Country Status (4)

Country Link
US (1) US4168223A (fr)
DE (1) DE2849502C2 (fr)
FR (1) FR2409327A1 (fr)
GB (1) GB2013241B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0787834A1 (fr) * 1996-01-30 1997-08-06 Nkk Corporation Bain acide pour placage d'étain et additif pour ce bain

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4405412A (en) * 1982-03-29 1983-09-20 Dart Industries Inc. Removal of copper contamination from tin plating baths
US4749626A (en) * 1985-08-05 1988-06-07 Olin Corporation Whisker resistant tin coatings and baths and methods for making such coatings
US5393573A (en) * 1991-07-16 1995-02-28 Microelectronics And Computer Technology Corporation Method of inhibiting tin whisker growth
DE4323386A1 (de) * 1993-07-13 1995-01-19 Bezner Maschf Vorrichtung zur Behandlung von Werstoffgemischen
GB2312438A (en) * 1996-04-26 1997-10-29 Ibm Electrodeposition bath containing zinc salt
DE19852219C1 (de) 1998-11-12 2000-05-11 Schloetter Fa Dr Ing Max Wäßrige Lösung zur elektrolytischen Abscheidung von Zinn-Zink-Legierungen und Verwendung der Lösung
EP1091023A3 (fr) * 1999-10-08 2003-05-14 Shipley Company LLC Composition d'alliage et procédé de plaquage
US6322686B1 (en) * 2000-03-31 2001-11-27 Shipley Company, L.L.C. Tin electrolyte
US6436269B1 (en) 2000-10-19 2002-08-20 Atotech Deutschland Gmbh Plating bath and method for electroplating tin-zinc alloys
US6582582B2 (en) 2001-03-09 2003-06-24 Donald Becking Electroplating composition and process
GB0106131D0 (en) * 2001-03-13 2001-05-02 Macdermid Plc Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys
US8226807B2 (en) * 2007-12-11 2012-07-24 Enthone Inc. Composite coatings for whisker reduction
US20090145764A1 (en) * 2007-12-11 2009-06-11 Enthone Inc. Composite coatings for whisker reduction
JP6834070B2 (ja) * 2016-06-13 2021-02-24 石原ケミカル株式会社 電気スズ及びスズ合金メッキ浴、当該メッキ浴を用いて電着物を形成した電子部品の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2457152A (en) * 1943-07-07 1948-12-28 Du Pont Electrodepositing composition and bath
FR1546176A (fr) * 1966-11-30 1968-11-15 Du Pont Nouvel additif pour bain d'étamage halogéné
FR2067374A1 (fr) * 1969-11-19 1971-08-20 Kenvert Int Corp
FR2111779A1 (fr) * 1970-10-22 1972-06-09 Kenvert Int Corp
FR2207195A1 (fr) * 1972-11-17 1974-06-14 Lea Ronal Inc
US3892637A (en) * 1969-03-10 1975-07-01 Polti Jean Loup Method of treatment of metal surfaces
GB1469547A (en) * 1973-06-28 1977-04-06 Minnesota Mining & Mfg Tin/lead electr-plating baths

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3905878A (en) * 1970-11-16 1975-09-16 Hyogo Prefectural Government Electrolyte for and method of bright electroplating of tin-lead alloy

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2457152A (en) * 1943-07-07 1948-12-28 Du Pont Electrodepositing composition and bath
FR1546176A (fr) * 1966-11-30 1968-11-15 Du Pont Nouvel additif pour bain d'étamage halogéné
US3892637A (en) * 1969-03-10 1975-07-01 Polti Jean Loup Method of treatment of metal surfaces
FR2067374A1 (fr) * 1969-11-19 1971-08-20 Kenvert Int Corp
FR2111779A1 (fr) * 1970-10-22 1972-06-09 Kenvert Int Corp
FR2207195A1 (fr) * 1972-11-17 1974-06-14 Lea Ronal Inc
GB1469547A (en) * 1973-06-28 1977-04-06 Minnesota Mining & Mfg Tin/lead electr-plating baths

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0787834A1 (fr) * 1996-01-30 1997-08-06 Nkk Corporation Bain acide pour placage d'étain et additif pour ce bain
US5871631A (en) * 1996-01-30 1999-02-16 Nkk Corporation Acidic tin-plating bath and additive therefor

Also Published As

Publication number Publication date
DE2849502A1 (de) 1979-05-17
FR2409327B1 (fr) 1981-02-20
DE2849502C2 (de) 1981-12-10
US4168223A (en) 1979-09-18
GB2013241B (en) 1982-03-24
GB2013241A (en) 1979-08-08

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