FR2084458A5 - - Google Patents

Info

Publication number
FR2084458A5
FR2084458A5 FR7108367A FR7108367A FR2084458A5 FR 2084458 A5 FR2084458 A5 FR 2084458A5 FR 7108367 A FR7108367 A FR 7108367A FR 7108367 A FR7108367 A FR 7108367A FR 2084458 A5 FR2084458 A5 FR 2084458A5
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7108367A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Union Carbide Corp
Original Assignee
Union Carbide Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Union Carbide Corp filed Critical Union Carbide Corp
Application granted granted Critical
Publication of FR2084458A5 publication Critical patent/FR2084458A5/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
FR7108367A 1970-03-11 1971-03-10 Expired FR2084458A5 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1847070A 1970-03-11 1970-03-11

Publications (1)

Publication Number Publication Date
FR2084458A5 true FR2084458A5 (fr) 1971-12-17

Family

ID=21788096

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7108367A Expired FR2084458A5 (fr) 1970-03-11 1971-03-10

Country Status (6)

Country Link
US (1) US3612963A (fr)
JP (1) JPS5535845B1 (fr)
CA (1) CA918765A (fr)
FR (1) FR2084458A5 (fr)
GB (1) GB1341322A (fr)
NL (1) NL165325C (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2527833A1 (fr) * 1982-05-28 1983-12-02 Europ Composants Electron Procede de depot de terminaisons metalliques sur un condensateur ceramique multicouches et condensateur ainsi obtenu
FR2550001A1 (fr) * 1983-07-29 1985-02-01 Eurofarad Procede de fabrication d'un composant electronique par association de cellules elementaires, notamment de condensateurs ceramiques multicouches
FR2639143A1 (fr) * 1988-07-26 1990-05-18 Mitsubishi Mining & Cement Co Condensateur de microplaquette et procede pour la production d'un tel condensateur

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US3778532A (en) * 1972-07-03 1973-12-11 Illinois Tool Works Electrical circuit component having solder preform connection means
US3908102A (en) * 1974-10-02 1975-09-23 Eltra Corp Unitized breaker point and chip capacitor assembly
US3992761A (en) * 1974-11-22 1976-11-23 Trw Inc. Method of making multi-layer capacitors
US4064606A (en) * 1975-07-14 1977-12-27 Trw Inc. Method for making multi-layer capacitors
US4074340A (en) * 1976-10-18 1978-02-14 Vitramon, Incorporated Trimmable monolithic capacitors
US4082906A (en) * 1977-02-14 1978-04-04 San Fernando Electric Manufacturing Company Low temperature fired ceramic capacitors
JPS5511332A (en) * 1978-07-11 1980-01-26 Taiyo Yuden Kk Porcelain capacitor and method of manufacturing same
US4297773A (en) * 1978-11-16 1981-11-03 Avx Corporation Method of manufacturing a monolithic ceramic capacitor
US4353153A (en) * 1978-11-16 1982-10-12 Union Carbide Corporation Method of making capacitor with CO-fired end terminations
JPS6026289B2 (ja) * 1979-04-13 1985-06-22 ソニー株式会社 タンタルコンデンサ
US4486813A (en) * 1981-07-06 1984-12-04 Sprague Electric Company Ceramic capacitor with nickel terminations
GB2118366B (en) * 1982-03-30 1985-09-18 Standard Telephones Cables Ltd Terminals for multilayer ceramic dielectric capacitors
GB2119571B (en) * 1982-03-30 1985-12-11 Standard Telephones Cables Ltd Terminals for multilayer ceramic dielectric capacitors
US4458294A (en) * 1982-07-28 1984-07-03 Corning Glass Works Compliant termination for ceramic chip capacitors
US4463407A (en) * 1982-09-27 1984-07-31 Northern Telecom Limited Surface mounted electronic components having pre-applied solder
JPS59184511A (ja) * 1983-04-04 1984-10-19 株式会社村田製作所 セラミツク積層コンデンサ
US4586972A (en) * 1983-04-05 1986-05-06 Matsushita Electric Industrial Co., Ltd. Method for making multilayer ceramic body
US4516187A (en) * 1983-07-13 1985-05-07 Electronic Concepts, Inc. Outer wrapping and planar terminations for a metallized wound capacitor and method therefor
US4499524A (en) * 1983-11-07 1985-02-12 North American Philips Corporation High value surface mounted capacitor
US4509103A (en) * 1984-02-01 1985-04-02 Avx Corporation Low dissipation factor monolithic capacitor for high frequency applications
DE3412492A1 (de) * 1984-04-03 1985-10-03 Siemens AG, 1000 Berlin und 8000 München Elektrischer kondensator als chip-bauelement
US4568999A (en) * 1984-06-06 1986-02-04 The United States Of America As Represented By The Secretary Of The Air Force Multilayer ceramic capacitor on printed circuit
US4571276A (en) * 1984-06-22 1986-02-18 North American Philips Corporation Method for strengthening terminations on reduction fired multilayer capacitors
US4580190A (en) * 1984-12-07 1986-04-01 Illinois Tool Works Inc. Surface mountable electrical package
US4648006A (en) * 1985-03-26 1987-03-03 Illinois Tool Works Inc. Plastic chip capacitor for surface mounting
US4811162A (en) * 1987-04-27 1989-03-07 Engelhard Corporation Capacitor end termination composition and method of terminating
JPH0278211A (ja) * 1988-09-13 1990-03-19 Murata Mfg Co Ltd 積層セラミックコンデンサ
US5151846A (en) * 1991-08-23 1992-09-29 General Instrument Corp. Surface mountable rectifier and method for fabricating same
GB9425031D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
AU695731B2 (en) 1995-06-21 1998-08-20 Illinois Tool Works Inc. Infrared shield for capacitors
US6268054B1 (en) 1997-02-18 2001-07-31 Cabot Corporation Dispersible, metal oxide-coated, barium titanate materials
US5880925A (en) 1997-06-27 1999-03-09 Avx Corporation Surface mount multilayer capacitor
JP2991175B2 (ja) 1997-11-10 1999-12-20 株式会社村田製作所 積層コンデンサ
US6266228B1 (en) 1997-11-10 2001-07-24 Murata Manufacturing Co., Ltd Multilayer capacitor
US6292350B1 (en) 1997-11-10 2001-09-18 Murata Manufacturing, Co., Ltd Multilayer capacitor
US6266229B1 (en) 1997-11-10 2001-07-24 Murata Manufacturing Co., Ltd Multilayer capacitor
US6549395B1 (en) 1997-11-14 2003-04-15 Murata Manufacturing Co., Ltd Multilayer capacitor
DE69942902D1 (de) * 1998-03-31 2010-12-16 Tdk Corp Elektronisches Bauelement in Chipbauweise und Verfahren zu seiner Herstellung
JP3548821B2 (ja) 1999-05-10 2004-07-28 株式会社村田製作所 積層コンデンサ、ならびにこれを用いた電子装置および高周波回路
JP3506964B2 (ja) * 1999-06-30 2004-03-15 太陽誘電株式会社 積層セラミック電子部品の製造方法
US6368514B1 (en) 1999-09-01 2002-04-09 Luminous Intent, Inc. Method and apparatus for batch processed capacitors using masking techniques
US6327134B1 (en) 1999-10-18 2001-12-04 Murata Manufacturing Co., Ltd. Multi-layer capacitor, wiring board, and high-frequency circuit
JP3489729B2 (ja) 1999-11-19 2004-01-26 株式会社村田製作所 積層コンデンサ、配線基板、デカップリング回路および高周波回路
DE10120517B4 (de) * 2001-04-26 2013-06-06 Epcos Ag Elektrischer Vielschicht-Kaltleiter und Verfahren zu dessen Herstellung
JP4898080B2 (ja) * 2001-05-08 2012-03-14 エプコス アクチエンゲゼルシャフト セラミックの多層デバイス及びその製造方法
US20030178718A1 (en) * 2001-11-05 2003-09-25 Ehly Jonathan P. Hermetically enhanced plastic package for microelectronics and manufacturing process
US7463474B2 (en) * 2002-04-15 2008-12-09 Avx Corporation System and method of plating ball grid array and isolation features for electronic components
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US7177137B2 (en) * 2002-04-15 2007-02-13 Avx Corporation Plated terminations
US7576968B2 (en) * 2002-04-15 2009-08-18 Avx Corporation Plated terminations and method of forming using electrolytic plating
US6982863B2 (en) 2002-04-15 2006-01-03 Avx Corporation Component formation via plating technology
DE10227658B4 (de) * 2002-06-20 2012-03-08 Curamik Electronics Gmbh Metall-Keramik-Substrat für elektrische Schaltkreise -oder Module, Verfahren zum Herstellen eines solchen Substrates sowie Modul mit einem solchen Substrat
US7016175B2 (en) * 2002-10-03 2006-03-21 Avx Corporation Window via capacitor
US7573698B2 (en) * 2002-10-03 2009-08-11 Avx Corporation Window via capacitors
JP4131694B2 (ja) * 2003-10-06 2008-08-13 三洋電機株式会社 積層セラミックス基板及びその製造方法
US20050082732A1 (en) * 2003-10-21 2005-04-21 Shu-Hui Chang Multi-layer chopping board
KR100812077B1 (ko) * 2004-04-23 2008-03-07 가부시키가이샤 무라타 세이사쿠쇼 전자부품 및 그 제조방법
DE102004031878B3 (de) * 2004-07-01 2005-10-06 Epcos Ag Elektrisches Mehrschichtbauelement mit zuverlässigem Lötkontakt
JP3918851B2 (ja) 2005-06-03 2007-05-23 株式会社村田製作所 積層型電子部品および積層型電子部品の製造方法
US20070084043A1 (en) * 2005-10-14 2007-04-19 Sb Electronics Conductive Adhesive Attachment of Capacitor Terminals
JP5056485B2 (ja) * 2008-03-04 2012-10-24 株式会社村田製作所 積層型電子部品およびその製造方法
JP5589891B2 (ja) * 2010-05-27 2014-09-17 株式会社村田製作所 セラミック電子部品及びその製造方法
KR101141457B1 (ko) * 2010-12-08 2012-05-04 삼성전기주식회사 적층 세라믹 콘덴서 및 그 제조방법
US8363382B2 (en) * 2011-02-10 2013-01-29 Sfi Electronics Technology Inc. Structure of multilayer ceramic device
JP5853976B2 (ja) * 2012-06-12 2016-02-09 株式会社村田製作所 積層コンデンサ
JP5958479B2 (ja) * 2014-01-31 2016-08-02 株式会社村田製作所 電子部品の実装構造体
US9627136B2 (en) * 2014-09-30 2017-04-18 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor
DE102015112426A1 (de) * 2015-07-29 2017-02-02 Endress + Hauser Wetzer Gmbh + Co. Kg Vorrichtung zur Bestimmung und/oder Überwachung der Temperatur eines Mediums
KR102189804B1 (ko) * 2015-12-04 2020-12-11 삼성전기주식회사 적층 전자부품 및 적층 전자부품 실장 기판
JP6455561B2 (ja) * 2017-06-30 2019-01-23 Tdk株式会社 電子部品
JP7426771B2 (ja) * 2018-04-11 2024-02-02 太陽誘電株式会社 積層セラミックコンデンサの製造方法
JP2022123936A (ja) * 2021-02-15 2022-08-25 株式会社村田製作所 積層セラミックコンデンサ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2395442A (en) * 1943-10-15 1946-02-26 Du Pont Electrical capacitor
US3378704A (en) * 1966-01-05 1968-04-16 Bourns Inc Piezoelectric multilayer device
US3444436A (en) * 1967-04-26 1969-05-13 Erie Technological Prod Inc Mounted capacitor with spaced terminal feet

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2527833A1 (fr) * 1982-05-28 1983-12-02 Europ Composants Electron Procede de depot de terminaisons metalliques sur un condensateur ceramique multicouches et condensateur ainsi obtenu
FR2550001A1 (fr) * 1983-07-29 1985-02-01 Eurofarad Procede de fabrication d'un composant electronique par association de cellules elementaires, notamment de condensateurs ceramiques multicouches
EP0133136A2 (fr) * 1983-07-29 1985-02-13 Eurofarad Efd Procédé de fabrication d'un composant électronique par association de cellules élémentaires, notamment de condensateurs céramiques multicouches
EP0133136A3 (fr) * 1983-07-29 1985-04-10 Eurofarad Efd Procédé de fabrication d'un composant électronique par association de cellules élémentaires, notamment de condensateurs céramiques multicouches
FR2639143A1 (fr) * 1988-07-26 1990-05-18 Mitsubishi Mining & Cement Co Condensateur de microplaquette et procede pour la production d'un tel condensateur

Also Published As

Publication number Publication date
JPS5535845B1 (fr) 1980-09-17
DE2111516B2 (de) 1977-06-30
US3612963A (en) 1971-10-12
CA918765A (en) 1973-01-09
NL165325C (nl) 1981-03-16
NL7103215A (fr) 1971-09-14
GB1341322A (en) 1973-12-19
NL165325B (nl) 1980-10-15
DE2111516A1 (de) 1971-10-07

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Legal Events

Date Code Title Description
ST Notification of lapse