FR2031120A5 - - Google Patents

Info

Publication number
FR2031120A5
FR2031120A5 FR7001113A FR7001113A FR2031120A5 FR 2031120 A5 FR2031120 A5 FR 2031120A5 FR 7001113 A FR7001113 A FR 7001113A FR 7001113 A FR7001113 A FR 7001113A FR 2031120 A5 FR2031120 A5 FR 2031120A5
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7001113A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bunker Ramo Corp
Original Assignee
Bunker Ramo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bunker Ramo Corp filed Critical Bunker Ramo Corp
Application granted granted Critical
Publication of FR2031120A5 publication Critical patent/FR2031120A5/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/20—Bus-bar or other wiring layouts, e.g. in cubicles, in switchyards
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/06—Electric connectors, e.g. conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
  • Structure Of Printed Boards (AREA)
FR7001113A 1969-01-13 1970-01-13 Expired FR2031120A5 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US79072269A 1969-01-13 1969-01-13

Publications (1)

Publication Number Publication Date
FR2031120A5 true FR2031120A5 (fr) 1970-11-13

Family

ID=25151569

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7001113A Expired FR2031120A5 (fr) 1969-01-13 1970-01-13

Country Status (5)

Country Link
US (1) US3541222A (fr)
JP (1) JPS5412621B1 (fr)
DE (1) DE2001142C2 (fr)
FR (1) FR2031120A5 (fr)
GB (1) GB1284481A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2464010A1 (fr) * 1979-08-18 1981-02-27 Int Computers Ltd Structure de circuit a plusieurs couches et son procede de production
EP0066706A2 (fr) * 1981-06-04 1982-12-15 International Business Machines Corporation Système de circuits imprimés pour l'interconnexion de modules semiconducteurs

Families Citing this family (126)

* Cited by examiner, † Cited by third party
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GB1311659A (en) * 1969-07-30 1973-03-28 Secr Defence Electrical device substrates
US3710196A (en) * 1970-04-27 1973-01-09 T Fifield Circuit board and method of making circuit connections
US3680037A (en) * 1970-11-05 1972-07-25 Tech Wire Prod Inc Electrical interconnector
US3671819A (en) * 1971-01-26 1972-06-20 Westinghouse Electric Corp Metal-insulator structures and method for forming
US3745509A (en) * 1971-03-02 1973-07-10 Bunker Ramo High density electrical connector
US3795047A (en) * 1972-06-15 1974-03-05 Ibm Electrical interconnect structuring for laminate assemblies and fabricating methods therefor
US3813773A (en) * 1972-09-05 1974-06-04 Bunker Ramo Method employing precision stamping for fabricating the wafers of a multiwafer electrical circuit structure
US3838984A (en) * 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
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US4050756A (en) * 1975-12-22 1977-09-27 International Telephone And Telegraph Corporation Conductive elastomer connector and method of making same
JPS583343B2 (ja) * 1976-06-14 1983-01-20 信越ポリマ−株式会社 インタ−コネクタ−
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FR2358022A1 (fr) * 1976-07-07 1978-02-03 Minnesota Mining & Mfg Perfectionnements aux connecteurs pour circuits integres
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US20050062492A1 (en) * 2001-08-03 2005-03-24 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2464010A1 (fr) * 1979-08-18 1981-02-27 Int Computers Ltd Structure de circuit a plusieurs couches et son procede de production
EP0066706A2 (fr) * 1981-06-04 1982-12-15 International Business Machines Corporation Système de circuits imprimés pour l'interconnexion de modules semiconducteurs
EP0066706A3 (en) * 1981-06-04 1984-04-25 International Business Machines Corporation Semiconductor module circuit interconnection system

Also Published As

Publication number Publication date
DE2001142C2 (de) 1983-12-29
DE2001142A1 (de) 1970-07-23
GB1284481A (en) 1972-08-09
JPS5412621B1 (fr) 1979-05-24
US3541222A (en) 1970-11-17

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