FR1550982A - - Google Patents

Info

Publication number
FR1550982A
FR1550982A FR1550982DA FR1550982A FR 1550982 A FR1550982 A FR 1550982A FR 1550982D A FR1550982D A FR 1550982DA FR 1550982 A FR1550982 A FR 1550982A
Authority
FR
France
Prior art keywords
leads
mould
bar
comb
bars
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of FR1550982A publication Critical patent/FR1550982A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
FR1550982D 1966-04-28 1967-04-27 Expired FR1550982A (ref)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6605674A NL6605674A (ref) 1966-04-28 1966-04-28

Publications (1)

Publication Number Publication Date
FR1550982A true FR1550982A (ref) 1968-12-27

Family

ID=19796427

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1550982D Expired FR1550982A (ref) 1966-04-28 1967-04-27

Country Status (11)

Country Link
AT (1) AT268381B (ref)
BE (1) BE697849A (ref)
CH (1) CH470759A (ref)
DE (1) DE1614242A1 (ref)
DK (1) DK116949B (ref)
ES (1) ES339806A1 (ref)
FR (1) FR1550982A (ref)
GB (1) GB1125428A (ref)
NL (1) NL6605674A (ref)
NO (1) NO120123B (ref)
SE (1) SE309455B (ref)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3210623A1 (de) * 1982-03-23 1983-10-06 Siemens Ag Verfahren zum verhindern der bildung von graten bei der umhuellung von bauelementen
DE3320700A1 (de) * 1983-06-08 1984-12-13 Siemens AG, 1000 Berlin und 8000 München Verfahren zum kunststoffumhuellen von elektrischen bauelementen
JPS60176259A (ja) * 1984-02-22 1985-09-10 Toshiba Corp 樹脂封止形半導体装置の製造方法
DE3406538A1 (de) * 1984-02-23 1985-08-29 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung
FR2638594B1 (fr) * 1988-11-03 1990-12-21 Cartier Systemes G Procede de realisation d'un circuit electrique de puissance monocouche ou multicouches, et circuit obtenu par ce procede

Also Published As

Publication number Publication date
DK116949B (da) 1970-03-02
NL6605674A (ref) 1967-10-30
ES339806A1 (es) 1968-05-16
AT268381B (de) 1969-02-10
DE1614242A1 (de) 1970-05-27
GB1125428A (en) 1968-08-28
NO120123B (ref) 1970-08-31
CH470759A (de) 1969-03-31
SE309455B (ref) 1969-03-24
BE697849A (ref) 1967-10-30

Similar Documents

Publication Publication Date Title
AT323269B (de) Aus einem stanzling einstückig geformter elektrischer verbinder
CA938384A (en) Method of making semiconductor integrated circuit elements
GB1343490A (en) Insulating of electronic components
GB1236402A (en) Improvements relating to a semiconductor integrated circuit
CH413941A (de) Verfahren zur Herstellung von leitenden Verbindungen bei elektrischen Schaltungsplatten
IT986807B (it) Struttura a pacco per circuiti elettrici e suo procedimento di fabbricazione
CH454985A (de) Verfahren zur Herstellung von Schaltkreisanordnungen mit elektrischen Verbindungen zwischen auf einer Substratplatte und auf einem Halbleiterbauteil befindlichen Kontakten
GB1092235A (en) Electrical connector and method of manufacture
GB1295594A (ref)
FR1550982A (ref)
ES402464A1 (es) Perfeccionamientos introducidos en marcos conductores para dispositivos semiconductores.
GB1209901A (en) Improvements relating to the mounting of integrated circuit assemblies
GB1189904A (en) Process for Encapsulating Electronic Devices in Plastics and Devices so Produced
CH489961A (de) Schaltungsanordnung für die Zwangsabschaltung von Thyristoren
GB1379270A (en) Integrated circuit manufacturing process
AT260998B (de) Elektrische Schaltungsanordnung mit einem mehrfachen dielektrischen Element
GB1321282A (en) Electronic or electrical circuit component and apparatus and method of making same
GB1248584A (en) Thyristors and other semi-conductor devices
AU407807B2 (en) Electronic bistable semiconductor switching element and method for producing it
AU1330766A (en) Electronic bistable semiconductor switching element and method for producing it
GB1165513A (en) Memory matrices.
CA744117A (en) Etching method for fabricating electrical circuit components
GB1045788A (en) Manufacture of semi-conductor solid-state circuits
GB1354369A (en) Methods of manufacturing semiconductor high-voltage rectifiers
CA773776A (en) Electronic semi-conductor device comprising at least one bistable electric circuit

Legal Events

Date Code Title Description
ST Notification of lapse