IT986807B - Struttura a pacco per circuiti elettrici e suo procedimento di fabbricazione - Google Patents

Struttura a pacco per circuiti elettrici e suo procedimento di fabbricazione

Info

Publication number
IT986807B
IT986807B IT25659/71A IT2565971A IT986807B IT 986807 B IT986807 B IT 986807B IT 25659/71 A IT25659/71 A IT 25659/71A IT 2565971 A IT2565971 A IT 2565971A IT 986807 B IT986807 B IT 986807B
Authority
IT
Italy
Prior art keywords
manufacturing process
package structure
electrical circuits
circuits
electrical
Prior art date
Application number
IT25659/71A
Other languages
English (en)
Original Assignee
Bunker Ramo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bunker Ramo filed Critical Bunker Ramo
Application granted granted Critical
Publication of IT986807B publication Critical patent/IT986807B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
IT25659/71A 1970-06-25 1971-06-09 Struttura a pacco per circuiti elettrici e suo procedimento di fabbricazione IT986807B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US4987370A 1970-06-25 1970-06-25

Publications (1)

Publication Number Publication Date
IT986807B true IT986807B (it) 1975-01-30

Family

ID=21962185

Family Applications (1)

Application Number Title Priority Date Filing Date
IT25659/71A IT986807B (it) 1970-06-25 1971-06-09 Struttura a pacco per circuiti elettrici e suo procedimento di fabbricazione

Country Status (9)

Country Link
US (1) US3705332A (it)
JP (1) JPS5529597B1 (it)
CA (1) CA945271A (it)
CH (1) CH539377A (it)
DE (1) DE2129132A1 (it)
GB (1) GB1337652A (it)
IT (1) IT986807B (it)
NL (1) NL7107988A (it)
ZA (1) ZA713954B (it)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3813773A (en) * 1972-09-05 1974-06-04 Bunker Ramo Method employing precision stamping for fabricating the wafers of a multiwafer electrical circuit structure
US3952231A (en) * 1974-09-06 1976-04-20 International Business Machines Corporation Functional package for complex electronic systems with polymer-metal laminates and thermal transposer
US4095867A (en) * 1974-10-10 1978-06-20 Bunker Ramo Corporation Component connection system
US4240198A (en) * 1979-02-21 1980-12-23 International Telephone And Telegraph Corporation Method of making conductive elastomer connector
US4288841A (en) * 1979-09-20 1981-09-08 Bell Telephone Laboratories, Incorporated Double cavity semiconductor chip carrier
US4283755A (en) * 1980-02-05 1981-08-11 The United States Of America As Represented By The Secretary Of The Air Force Modulator multilayer detector
JPS57197604U (it) * 1981-06-09 1982-12-15
DE3319339A1 (de) * 1982-05-31 1983-12-29 Sharp K.K., Osaka Treiberanordnung fuer eine x-y-elektrodenmatrix
US4597617A (en) * 1984-03-19 1986-07-01 Tektronix, Inc. Pressure interconnect package for integrated circuits
US4739448A (en) * 1984-06-25 1988-04-19 Magnavox Government And Industrial Electronics Company Microwave multiport multilayered integrated circuit chip carrier
US4704319A (en) * 1984-11-23 1987-11-03 Irvine Sensors Corporation Apparatus and method for fabricating modules comprising stacked circuit-carrying layers
US4613892A (en) * 1985-02-19 1986-09-23 Sundstrand Corporation Laminated semiconductor assembly
US4659931A (en) * 1985-05-08 1987-04-21 Grumman Aerospace Corporation High density multi-layered integrated circuit package
JPS61288455A (ja) * 1985-06-17 1986-12-18 Fujitsu Ltd 多層半導体装置の製造方法
US4705332A (en) * 1985-08-05 1987-11-10 Criton Technologies High density, controlled impedance connectors
US5227959A (en) * 1986-05-19 1993-07-13 Rogers Corporation Electrical circuit interconnection
JPH0286166U (it) * 1988-12-23 1990-07-09
DE69015878T2 (de) * 1989-04-17 1995-07-13 Ibm Mehrschichtleiterplattenstruktur.
US5089880A (en) * 1989-06-07 1992-02-18 Amdahl Corporation Pressurized interconnection system for semiconductor chips
US5245751A (en) * 1990-04-27 1993-09-21 Circuit Components, Incorporated Array connector
US5071359A (en) * 1990-04-27 1991-12-10 Rogers Corporation Array connector
US5357403A (en) * 1990-06-29 1994-10-18 General Electric Company Adaptive lithography in a high density interconnect structure whose signal layers have fixed patterns
US5714802A (en) * 1991-06-18 1998-02-03 Micron Technology, Inc. High-density electronic module
US5383269A (en) * 1991-09-03 1995-01-24 Microelectronics And Computer Technology Corporation Method of making three dimensional integrated circuit interconnect module
US5270571A (en) * 1991-10-30 1993-12-14 Amdahl Corporation Three-dimensional package for semiconductor devices
US5343366A (en) * 1992-06-24 1994-08-30 International Business Machines Corporation Packages for stacked integrated circuit chip cubes
DE4435121A1 (de) * 1994-09-30 1996-04-04 Siemens Ag An Datenbus betreibbare tragbare Datenträgeranordnung
US5637920A (en) * 1995-10-04 1997-06-10 Lsi Logic Corporation High contact density ball grid array package for flip-chips
US6661085B2 (en) * 2002-02-06 2003-12-09 Intel Corporation Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack
US6762076B2 (en) * 2002-02-20 2004-07-13 Intel Corporation Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices
US20030213619A1 (en) * 2002-05-14 2003-11-20 Denzene Quentin S. Ground discontinuity improvement in RF device matching
US7030486B1 (en) * 2003-05-29 2006-04-18 Marshall Paul N High density integrated circuit package architecture
US7087538B2 (en) * 2004-08-16 2006-08-08 Intel Corporation Method to fill the gap between coupled wafers
US9084382B2 (en) * 2012-10-18 2015-07-14 Infineon Technologies Austria Ag Method of embedding an electronic component into an aperture of a substrate

Also Published As

Publication number Publication date
DE2129132A1 (de) 1972-01-05
ZA713954B (en) 1972-02-23
JPS5529597B1 (it) 1980-08-05
NL7107988A (it) 1971-12-28
CA945271A (en) 1974-04-09
US3705332A (en) 1972-12-05
GB1337652A (en) 1973-11-21
CH539377A (de) 1973-07-15

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