IT963918B - Circuiti elettronici a pacco e procedimento per la relativa fabbricazione - Google Patents

Circuiti elettronici a pacco e procedimento per la relativa fabbricazione

Info

Publication number
IT963918B
IT963918B IT28130/72A IT2813072A IT963918B IT 963918 B IT963918 B IT 963918B IT 28130/72 A IT28130/72 A IT 28130/72A IT 2813072 A IT2813072 A IT 2813072A IT 963918 B IT963918 B IT 963918B
Authority
IT
Italy
Prior art keywords
procedure
electronic circuits
relative manufacturing
package electronic
package
Prior art date
Application number
IT28130/72A
Other languages
English (en)
Original Assignee
Globe Union Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Globe Union Inc filed Critical Globe Union Inc
Application granted granted Critical
Publication of IT963918B publication Critical patent/IT963918B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
IT28130/72A 1971-08-19 1972-08-11 Circuiti elettronici a pacco e procedimento per la relativa fabbricazione IT963918B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17314571A 1971-08-19 1971-08-19

Publications (1)

Publication Number Publication Date
IT963918B true IT963918B (it) 1974-01-21

Family

ID=22630733

Family Applications (1)

Application Number Title Priority Date Filing Date
IT28130/72A IT963918B (it) 1971-08-19 1972-08-11 Circuiti elettronici a pacco e procedimento per la relativa fabbricazione

Country Status (10)

Country Link
US (1) US3760090A (it)
JP (1) JPS4830376A (it)
AU (1) AU4258172A (it)
BR (1) BR7205636D0 (it)
CA (1) CA989981A (it)
DE (1) DE2236007A1 (it)
ES (1) ES405978A1 (it)
FR (1) FR2149350A1 (it)
GB (1) GB1403111A (it)
IT (1) IT963918B (it)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3874549A (en) * 1972-05-26 1975-04-01 Norman Hascoe Hermetic sealing cover for a container for a semiconductor device
US3872583A (en) * 1972-07-10 1975-03-25 Amdahl Corp LSI chip package and method
JPS5548700B2 (it) * 1973-01-30 1980-12-08
US3911138B1 (en) * 1973-02-26 1996-10-29 Childrens Hosp Medical Center Artificial blood and method for supporting oxygen transport in animals
JPS5073178A (it) * 1973-11-02 1975-06-17
US3934336A (en) * 1975-01-13 1976-01-27 Burroughs Corporation Electronic package assembly with capillary bridging connection
US4038488A (en) * 1975-05-12 1977-07-26 Cambridge Memories, Inc. Multilayer ceramic multi-chip, dual in-line packaging assembly
US4342069A (en) * 1979-07-02 1982-07-27 Mostek Corporation Integrated circuit package
US4298769A (en) * 1979-12-14 1981-11-03 Standard Microsystems Corp. Hermetic plastic dual-in-line package for a semiconductor integrated circuit
WO1981002367A1 (en) * 1980-02-12 1981-08-20 Mostek Corp Over/under dual in-line chip package
US4296456A (en) * 1980-06-02 1981-10-20 Burroughs Corporation Electronic package for high density integrated circuits
GB2079534A (en) * 1980-07-02 1982-01-20 Fairchild Camera Instr Co Package for semiconductor devices
US4441119A (en) * 1981-01-15 1984-04-03 Mostek Corporation Integrated circuit package
FR2498814B1 (fr) * 1981-01-26 1985-12-20 Burroughs Corp Boitier pour circuit integre, moyen pour le montage et procede de fabrication
JPS58446U (ja) * 1981-06-25 1983-01-05 富士通株式会社 混成集積回路装置
DE3129134A1 (de) * 1981-07-23 1983-02-03 Siemens AG, 1000 Berlin und 8000 München Elektronische bauteile
US4682414A (en) * 1982-08-30 1987-07-28 Olin Corporation Multi-layer circuitry
CA1257828A (en) * 1984-04-16 1989-07-25 William Mccormick Perfluoro compound dispersions containing reduced amounts of surfactant and process of preparation
US4659931A (en) * 1985-05-08 1987-04-21 Grumman Aerospace Corporation High density multi-layered integrated circuit package
JPS62142850U (it) * 1986-03-04 1987-09-09
US4931854A (en) * 1989-02-06 1990-06-05 Kyocera America, Inc. Low capacitance integrated circuit package
US4982494A (en) * 1989-02-06 1991-01-08 Kyocera America, Inc. Methods of making a low capacitance integrated circuit package
US5134247A (en) * 1989-02-21 1992-07-28 Cray Research Inc. Reduced capacitance chip carrier
US5086334A (en) * 1989-12-08 1992-02-04 Cray Research Inc. Chip carrier
US5280413A (en) * 1992-09-17 1994-01-18 Ceridian Corporation Hermetically sealed circuit modules having conductive cap anchors
US6627393B2 (en) * 1993-06-04 2003-09-30 Biotime, Inc. Solutions for use as plasma expanders and substitutes
US5455385A (en) * 1993-06-28 1995-10-03 Harris Corporation Multilayer LTCC tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses
US6031723A (en) * 1994-08-18 2000-02-29 Allen-Bradley Company, Llc Insulated surface mount circuit board construction
US5641944A (en) * 1995-09-29 1997-06-24 Allen-Bradley Company, Inc. Power substrate with improved thermal characteristics
US5670749A (en) * 1995-09-29 1997-09-23 Allen-Bradley Company, Inc. Multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area
US5648892A (en) * 1995-09-29 1997-07-15 Allen-Bradley Company, Inc. Wireless circuit board system for a motor controller
US5616888A (en) * 1995-09-29 1997-04-01 Allen-Bradley Company, Inc. Rigid-flex circuit board having a window for an insulated mounting area
JP4058607B2 (ja) * 1999-08-19 2008-03-12 セイコーエプソン株式会社 配線基板及びその製造方法、電子部品、回路基板並びに電子機器
KR100699488B1 (ko) * 2005-07-19 2007-03-26 삼성전자주식회사 인덕터를 구비한 패키징 칩
US20150252666A1 (en) 2014-03-05 2015-09-10 Baker Hughes Incorporated Packaging for electronics in downhole assemblies

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3349481A (en) * 1964-12-29 1967-10-31 Alpha Microelectronics Company Integrated circuit sealing method and structure
US3601522A (en) * 1970-06-18 1971-08-24 American Lava Corp Composite ceramic package breakaway notch

Also Published As

Publication number Publication date
JPS4830376A (it) 1973-04-21
CA989981A (en) 1976-05-25
AU4258172A (en) 1973-11-29
FR2149350A1 (it) 1973-03-30
GB1403111A (en) 1975-08-13
DE2236007A1 (de) 1973-02-22
BR7205636D0 (pt) 1973-07-03
ES405978A1 (es) 1975-09-16
US3760090A (en) 1973-09-18

Similar Documents

Publication Publication Date Title
IT963918B (it) Circuiti elettronici a pacco e procedimento per la relativa fabbricazione
AT361042B (de) Integrierte halbleiterschaltung
IL39277A0 (en) A semiconductor integrated circuit
IT963303B (it) Laser a semiconduttore
IT993367B (it) Circuito integrato a semiconduttori e metodo per la fabbricazione dello stesso
SE389486B (sv) Kretstransportor
GB1343794A (en) Multilayer semiconductor devices
CH546482A (de) Halbleiterbauelement.
CH538701A (de) Rauschzahlmesskreis
SE381700B (sv) Elektronisk lasanordning
SE387493B (sv) Avstemd oscillatorkrets
BE769520A (fr) Circuit a semi-conducteur
AT313978B (de) Gyratorschaltung
IT962726B (it) Circuito elettronico di bloccaggio
IT948015B (it) Procedimento per la fabbricazione di circuiti elettrici stampati
IT994322B (it) Circuito integrato a semiconduttore
AU4728572A (en) Manufacturing semiconductor devices
IT967738B (it) Circuito a semiconduttori integrato
SE383940B (sv) Forfarande for att framstella en halvledaranordning
BE792001A (fr) Structures a circuits integres a croisements
SE388080B (sv) Halvledarkomponent
CH539953A (de) Halbleiterbauelement
CH534391A (it) Dispositivo elettronico integratore
BE786797A (fr) Perfectionnement a la fabrication des circuits imprimes
CH533360A (de) Halbleiterbauelement