BE761849A - Circuit microelectronique - Google Patents
Circuit microelectroniqueInfo
- Publication number
- BE761849A BE761849A BE761849A BE761849A BE761849A BE 761849 A BE761849 A BE 761849A BE 761849 A BE761849 A BE 761849A BE 761849 A BE761849 A BE 761849A BE 761849 A BE761849 A BE 761849A
- Authority
- BE
- Belgium
- Prior art keywords
- microelectronic circuit
- microelectronic
- circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19702002571 DE2002571C (de) | 1970-01-21 | Verfahren zur Herstellung von Anschlußleitungen auf einem isolie renden Trager zur Kontaktierung einer mikroelektronischen Schaltung |
Publications (1)
Publication Number | Publication Date |
---|---|
BE761849A true BE761849A (fr) | 1971-07-01 |
Family
ID=5760151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE761849A BE761849A (fr) | 1970-01-21 | 1971-01-21 | Circuit microelectronique |
Country Status (9)
Country | Link |
---|---|
AT (1) | AT315985B (fr) |
BE (1) | BE761849A (fr) |
CA (1) | CA971674A (fr) |
CH (1) | CH518005A (fr) |
FR (1) | FR2080918B1 (fr) |
GB (1) | GB1320124A (fr) |
LU (1) | LU62450A1 (fr) |
NL (1) | NL7100522A (fr) |
SE (1) | SE369467B (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2424646A1 (fr) * | 1978-04-28 | 1979-11-23 | Commissariat Energie Atomique | Procede de raccordement de bornes de connexion d'ensembles electriques |
US4567545A (en) * | 1983-05-18 | 1986-01-28 | Mettler Rollin W Jun | Integrated circuit module and method of making same |
GB2218847B (en) * | 1988-05-16 | 1991-04-24 | Gen Electric Co Plc | Carrier for semiconductor devices |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1209901A (en) * | 1967-01-11 | 1970-10-21 | British Telecomm Res Ltd | Improvements relating to the mounting of integrated circuit assemblies |
-
1970
- 1970-11-03 CH CH1623870A patent/CH518005A/de not_active IP Right Cessation
- 1970-11-12 AT AT1020670A patent/AT315985B/de not_active IP Right Cessation
-
1971
- 1971-01-14 NL NL7100522A patent/NL7100522A/xx unknown
- 1971-01-18 FR FR7101484A patent/FR2080918B1/fr not_active Expired
- 1971-01-19 GB GB267571A patent/GB1320124A/en not_active Expired
- 1971-01-19 LU LU62450D patent/LU62450A1/xx unknown
- 1971-01-20 SE SE00640/71A patent/SE369467B/xx unknown
- 1971-01-21 BE BE761849A patent/BE761849A/fr unknown
- 1971-01-21 CA CA103,280A patent/CA971674A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
CA971674A (en) | 1975-07-22 |
DE2002571A1 (de) | 1971-12-23 |
LU62450A1 (fr) | 1971-08-26 |
FR2080918A1 (fr) | 1971-11-26 |
CH518005A (de) | 1972-01-15 |
NL7100522A (fr) | 1971-07-23 |
SE369467B (fr) | 1974-08-26 |
FR2080918B1 (fr) | 1977-01-28 |
DE2002571B2 (de) | 1972-08-17 |
GB1320124A (en) | 1973-06-13 |
AT315985B (de) | 1974-06-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AT311092B (de) | Halbleiterschaltung | |
BE764990A (fr) | Circuit monolithique semiconducteur | |
AT318003B (de) | Halbleiterbauelement | |
SE400132B (sv) | Referensspenningskrets | |
CH525519A (de) | Funktionsbildende Schaltungsanordnung | |
CH534958A (fr) | Coupe-circuit | |
AT308241B (de) | Integrierte Halbleiterschaltung | |
DK143928C (da) | Squelchkredsloeb | |
CH508983A (de) | Halbleiter-Bauelement | |
CH516230A (de) | Integrierter Schaltkreis | |
AT319336B (de) | Integrierte Schaltung | |
AT308856B (de) | Oszillatorschaltung | |
DK145530C (da) | Loddemiddelsuger | |
BE769520A (fr) | Circuit a semi-conducteur | |
BE761849A (fr) | Circuit microelectronique | |
CH514043A (de) | Isolierendes Bauelement | |
AT301689B (de) | Halbleiterbauelement | |
CH516874A (de) | Halbleiterbauelement | |
AT307931B (de) | Alarmschaltung | |
AT310849B (de) | Schutzschalter | |
CH546478A (fr) | Disjoncteur. | |
DE2061227B2 (de) | Abtast-halteschaltung | |
CH522329A (de) | Flip-Flop-Schaltung | |
CH544453A (de) | Flip-Flop-Schaltung | |
ATA1150270A (de) | Schaltungsanordnung |