CH533362A - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
CH533362A
CH533362A CH933171A CH933171A CH533362A CH 533362 A CH533362 A CH 533362A CH 933171 A CH933171 A CH 933171A CH 933171 A CH933171 A CH 933171A CH 533362 A CH533362 A CH 533362A
Authority
CH
Switzerland
Prior art keywords
semiconductor component
semiconductor
component
Prior art date
Application number
CH933171A
Other languages
English (en)
Inventor
Sitte Bernd
Spickenreuther Dieter
Nat Weisshaar Erich Dr Rer
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH933171A priority Critical patent/CH533362A/de
Priority to DE2134647A priority patent/DE2134647C2/de
Priority to DE19717126643U priority patent/DE7126643U/de
Priority to SE7208285A priority patent/SE388080B/xx
Priority to GB2950472A priority patent/GB1381400A/en
Publication of CH533362A publication Critical patent/CH533362A/de
Priority to US39973873 priority patent/US3885243A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/104—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices having particular shapes of the bodies at or near reverse-biased junctions, e.g. having bevels or moats
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/141—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being on at least the sidewalls of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/625—Clamping parts not primarily conducting heat
CH933171A 1971-06-25 1971-06-25 Halbleiterbauelement CH533362A (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CH933171A CH533362A (de) 1971-06-25 1971-06-25 Halbleiterbauelement
DE2134647A DE2134647C2 (de) 1971-06-25 1971-07-12 Halbleiterbauelement zur Begrenzung von Überspannungen
DE19717126643U DE7126643U (de) 1971-06-25 1971-07-12 Halbleiterbauelement
SE7208285A SE388080B (sv) 1971-06-25 1972-06-22 Halvledarkomponent
GB2950472A GB1381400A (en) 1971-06-25 1972-06-23 Semi-conductor device
US39973873 US3885243A (en) 1971-06-25 1973-09-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH933171A CH533362A (de) 1971-06-25 1971-06-25 Halbleiterbauelement

Publications (1)

Publication Number Publication Date
CH533362A true CH533362A (de) 1973-01-31

Family

ID=4350838

Family Applications (1)

Application Number Title Priority Date Filing Date
CH933171A CH533362A (de) 1971-06-25 1971-06-25 Halbleiterbauelement

Country Status (4)

Country Link
CH (1) CH533362A (de)
DE (2) DE2134647C2 (de)
GB (1) GB1381400A (de)
SE (1) SE388080B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4226727A1 (de) * 1992-08-10 1994-02-17 Aeg Westinghouse Transport Anordnung für einen vormontierten Aufbau von druckkontaktierbaren Scheibenzellenhalbleitern

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4000618A1 (de) * 1989-01-27 1990-08-02 Felten & Guilleaume Energie Abgrenzeinheit mit verringertem wellenwiderstand fuer kks-(kathodischer korrosionsschutz-)anlagen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL288523A (de) * 1961-08-04 1900-01-01
GB1017336A (en) * 1962-03-16 1966-01-19 Ass Elect Ind Improvements in and relating to semi-conductor devices
DE1251440C2 (de) * 1963-06-01 1980-04-03 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiterbauelement
US3363150A (en) * 1964-05-25 1968-01-09 Gen Electric Glass encapsulated double heat sink diode assembly
CH465064A (de) * 1967-10-20 1968-11-15 Bbc Brown Boveri & Cie Anordnung mit mehreren Halbleiter-Dioden in einem Gehäuse

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4226727A1 (de) * 1992-08-10 1994-02-17 Aeg Westinghouse Transport Anordnung für einen vormontierten Aufbau von druckkontaktierbaren Scheibenzellenhalbleitern

Also Published As

Publication number Publication date
DE2134647C2 (de) 1984-04-26
DE7126643U (de) 1973-04-12
SE388080B (sv) 1976-09-20
GB1381400A (en) 1975-01-22
DE2134647A1 (de) 1972-12-28

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Legal Events

Date Code Title Description
PL Patent ceased